Patents-Review.com
ClassID:

233930 ⎘

H05K3/4605 - CPC Classification

Classification description:

Apparatus or processes for manufacturing printed circuits; Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material

Recent Application in this class:
#1
20260068037
2026-03-05

Component Carrier With Inorganic Carrier Having Inserted Pin Directly Encapsulated in Through Hole

 #2
20250203752
2025-06-19

PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD

 #3
20240365477
2024-10-31

CIRCUIT BOARD AND METHOD OF PRODUCING CIRCUIT BOARD

 #4
20240284606
2024-08-22

WIRING SUBSTRATE

 #5
20240276653
2024-08-15

WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

 #6
20240260178
2024-08-01

WIRING SUBSTRATE

 #7
20240196546
2024-06-13

PRINTED WIRING BOARD

 #8
20240186227
2024-06-06

INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG)

 #9
20240179853
2024-05-30

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

 #10
20240049398
2024-02-08

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

 #11
20230422409
2023-12-28

CIRCUIT BOARD FOR ANTENNA, ANTENNA PACKAGE INCLUDING THE SAME AND IMAGE DISPLAY DEVICE INCLUDING THE SAME

 #12
20230276575
2023-08-31

Embedded printed circuit board

 #13
20230125928
2023-04-27

Circuit board and method for manufacturing the same

 #14
20220377873
2022-11-24

Method for manufacturing a circuit board

 #15
20220210925
2022-06-30

Wiring board and semiconductor module including the same

 #16
20220174815
2022-06-02

Printed wiring board and method for manufacturing the same

 #17
20220039261
2022-02-03

PRINTED CIRCUIT BOARD, ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE, AND MANUFACTURING METHOD THEREOF

 #18
20210400805
2021-12-23

Method for manufacturing a substrate structure with high reflectance

 #19
20210385943
2021-12-09

Method of fabricating a substrate with metal reflection layer

 #20
20210251087
2021-08-12

Printed wiring board

 #21
20210204397
2021-07-01

Systems and methods for hybrid glass and organic packaging for radio frequency electronics

 #22
20210185818
2021-06-17

Inductor built-in substrate

 #23
20210098351
2021-04-01

Flip-chip package substrate and method for fabricating the same

 #24
20210092841
2021-03-25

Printed wiring board and method for manufacturing the same

 #25
20210007220
2021-01-07

Wiring substrate, stacked wiring substrate, and manufacturing method of wiring substrate

 #26
20200296829
2020-09-17

Substrate

 #27
20200243743
2020-07-30

Method of forming superconducting layers and traces

 #28
20200170113
2020-05-28

HIGH DENSITY FLEXIBLE INTERCONNECT DESIGN FOR MULTI-MODE SIGNALING

 #29
20200084894
2020-03-12

Multilayered ceramic substrate and method for manufacturing same

 #30
20200068706
2020-02-27

Optical waveguide having aluminum nitride thin film

 #31
20200015363
2020-01-09

Method for producing printed wiring board

 #32
20190394886
2019-12-26

Multilayer wiring board

 #33
20190223285
2019-07-18

Highly thermally conductive dielectric structure for heat spreading in component carrier

 #34
20190097118
2019-03-28

Method of forming superconducting apparatus including superconducting layers and traces

 #35
20190082531
2019-03-14

Wiring substrate for electronic component inspection apparatus

 #36
20190080977
2019-03-14

Through electrode substrate and manufacturing method thereof

 #37
20190019737
2019-01-17

Semiconductor device, manufacturing method, imaging device, and electronic apparatus for enabling component mounting with high flatness

 #38
20180319129
2018-11-08

MULTILAYER BODY AND ELECTRONIC COMPONENT

 #39
20180316374
2018-11-01

Glass substrate including passive-on-glass device and semiconductor die

 #40
20180273420
2018-09-27

Multilayer ceramic substrate and electronic component

 #41
20180234070
2018-08-16

LC composite device, processor, and method for manufacturing LC composite device

 #42
20180166354
2018-06-14

Wiring circuit substrate, semiconductor device, method of producing the wiring circuit substrate, and method of producing the semiconductor device

 #43
20180158695
2018-06-07

Manufacturing method and wiring substrate with through electrode

 #44
20180146559
2018-05-24

METHODS OF MAKING STACKABLE WIRING BOARD HAVING ELECTRONIC COMPONENT IN DIELECTRIC RECESS

 #45
20180044244
2018-02-15

Low temperature cofired ceramic material, ceramic sintered body, and ceramic electronic component

 #46
20170301558
2017-10-19

Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrate

 #47
20170223842
2017-08-03

Multilayer wiring board

 #48
20170171978
2017-06-15

Power module and manufacturing method thereof

 #49
20170034923
2017-02-02

Methods of making stackable wiring board having electronic component in dielectric recess

 #50
20160323992
2016-11-03

Aluminum nitride substrate with graphite foil

 #51
20160322290
2016-11-03

Substrate for integrated circuit devices including multi-layer glass core and methods of making the same

 #52
20160284637
2016-09-29

Glass core substrate for integrated circuit devices and methods of making the same

 #53
20160259139
2016-09-08

Semiconductor device with optical and electrical vias

 #54
20160205773
2016-07-14

Circuit board and method of manufacturing the same

 #55
20160174419
2016-06-16

Shielded RF Transmission Lines in Low Temperature Co-fired Ceramic Constructs and Method of Making Same

 #56
20160135292
2016-05-12

DETACHABLE CORE SUBSTRATE AND METHOD OF MANUFACTURING CIRCUIT BOARD USING THE SAME

 #57
20160135289
2016-05-12

Printed circuit board and method of manufacturing the same

 #58
20160088742
2016-03-24

Printed circuit board and method of manufacturing printed circuit board

 #59
20150380356
2015-12-31

Embedded semiconductor device package and method of manufacturing thereof

 #60
20150334823
2015-11-19

Substrate components for packaging IC chips and electronic device packages of the same

 #61
20150319868
2015-11-05

Multilayer circuit board and method for manufacturing the same

 #62
20150129293
2015-05-14

Printed circuit board and method of manufacturing the same

 #63
20150108997
2015-04-23

Inspection apparatus and inspection method

 #64
20150098165
2015-04-09

Conductive paste, multilayer ceramic electronic component, and method for manufacturing same

 #65
20150084207
2015-03-26

Embedded semiconductor device package and method of manufacturing thereof

 #66
20150076107
2015-03-19

Method for manufacturing multilayer wiring board

 #67
20150048505
2015-02-19

Wiring substrate, method of manufacturing the same, and semiconductor device

 #68
20150034377
2015-02-05

GLASS CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

 #69
20150021081
2015-01-22

Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrate

 #70
20140290980
2014-10-02

Touch screen and method of producing the same

 #71
20140224532
2014-08-14

Thin-film wiring substrate and substrate for probe card

 #72
20140117539
2014-05-01

Wiring substrate, method for manufacturing wiring substrate, and semiconductor package

 #73
20140097882
2014-04-10

Mixer fabrication technique and system using the same

 #74
20140015121
2014-01-16

Wiring substrate and manufacturing method thereof

 #75
20130313002
2013-11-28

MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

 #76
20130265736
2013-10-10

Wiring board and electronic apparatus

 #77
20130264101
2013-10-10

Wiring substrate having multiple core substrates

 #78
20130200516
2013-08-08

Hybrid substrate, method for manufacturing the same, and semiconductor integrated circuit package

 #79
20130069251
2013-03-21

Wiring substrate, method of manufacturing the same, and semiconductor device

 #80
20130062778
2013-03-14

Wiring substrate and semiconductor package

 #81
20130056251
2013-03-07

Wiring substrate, method for manufacturing wiring substrate, and semiconductor package including wiring substrate

 #82
20130029031
2013-01-31

Method for manufacturing interposer

 #83
20130026653
2013-01-31

Method for manufacturing semiconductor device

 #84
20120307470
2012-12-06

Wiring substrate and method for manufacturing wiring substrate

 #85
20120192413
2012-08-02

Method of making glass core substrate for integrated circuit devices

 #86
20120181065
2012-07-19

Multi-Layered Circuit Board Device

 #87
20120153495
2012-06-21

Reduced PTH pad for enabling core routing and substrate layer count reduction

 #88
20120073870
2012-03-29

Method of manufacturing printed circuit board

 #89
20120012378
2012-01-19

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

 #90
20110297430
2011-12-08

Wiring substrate

 #91
20110297426
2011-12-08

Wiring substrate and manufacturing method thereof

 #92
20110293874
2011-12-01

HYBRID SUBSTRATE AND METHOD FOR PRODUCING THE SAME

 #93
20110147951
2011-06-23

Wiring substrate and semiconductor device

 #94
20110147059
2011-06-23

Substrate for integrated circuit devices including multi-layer glass core and methods of making the same

 #95
20110147055
2011-06-23

Glass core substrate for integrated circuit devices and methods of making the same

 #96
20110061911
2011-03-17

Interposer and method for manufacturing the same

 #97
20110056068
2011-03-10

Method for manufacturing interposer

 #98
20110035939
2011-02-17

Method of manufacturing multilayer wiring board

 #99
20110031606
2011-02-10

PACKAGING SUBSTRATE HAVING EMBEDDED SEMICONDUCTOR CHIP

 #100
20110024167
2011-02-03

Multilayer circuit board

 #101
20110018144
2011-01-27

Wiring board having piercing linear conductors and semiconductor device using the same

 #102
20110012266
2011-01-20

Semiconductor device and method of manufacturing semiconductor device

 #103
20110000708
2011-01-06

Wiring substrate and method for manufacturing wiring substrate

 #104
20100327897
2010-12-30

Wiring substrate and probe card

 #105
20100307808
2010-12-09

Wiring board

 #106
20100289154
2010-11-18

Method and core materials for semiconductor packaging

 #107
20100230148
2010-09-16

Substrate for mounting semiconductor element and method for manufacturing substrate for mounting semiconductor element

 #108
20100224394
2010-09-09

Module substrate and production method

 #109
20100220448
2010-09-02

Component-containing module

 #110
20100116782
2010-05-13

Method for manufacturing multilayer wiring board

 #111
20100078805
2010-04-01

Method and core materials for semiconductor packaging

 #112
20080299768
2008-12-04

Manufacturing method of substrate with through electrode

 #113
20080277776
2008-11-13

Substrate and multilayer circuit board

 #114
20080261396
2008-10-23

Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same

 #115
20080230260
2008-09-25

Flip-chip substrate

 #116
20080204038
2008-08-28

Multilayer wiring board and method for testing the same

 #117
20080204037
2008-08-28

Multilayer wiring board and method for testing the same

 #118
20080090335
2008-04-17

Circuit module and manufacturing method thereof

 #119
20080083558
2008-04-10

Multilayer wiring board

 #120
20080073110
2008-03-27

Interposer and method for manufacturing the same

 #121
20080029872
2008-02-07

Plate structure having chip embedded therein and the manufacturing method of the same

 #122
20070278654
2007-12-06

Method of making an electronic package

 #123
20070248747
2007-10-25

Glass circuit board and manufacturing method thereof

 #124
20070155174
2007-07-05

Circuit substrate and method for fabricating the same

 #125
20060279940
2006-12-14

Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors

 #126
20060257631
2006-11-16

Probe pad structure in a ceramic space transformer

 #127
20060191710
2006-08-31

Multilayer printed wiring board and a process of producing same

 #128
20060185141
2006-08-24

Method of manufacturing a multilayer wiring board

 #129
20060097378
2006-05-11

Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same

 #130
20060096781
2006-05-11

Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same

 #131
20060081977
2006-04-20

Ceramic multilayer substrate

 #132
20060000640
2006-01-05

Multilayer printed wiring board and a process of producing same

 #133
20050250249
2005-11-10

Method of making an electronic package

 #134
20050050724
2005-03-10

Method for fabricating high density of multi-polyimide-layer DPC lines on a ceramic board

 #135
20050032347
2005-02-10

Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces

 #136
20050017347
2005-01-27

Circuit module and manufacturing method thereof

 #137
20050012217
2005-01-20

Multilayer wiring board and manufacture method thereof

 #138
20050000725
2005-01-06

Manufacturing method for a printed circuit board