H05K3/4617 - CPC Classification Index

#1

20260059664

2026-02-26

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

#2

20250159797

2025-05-15

MEMBRANE CIRCUIT BOARD

#3

20240147613

2024-05-02

MULTILAYER BOARD AND METHOD FOR MANUFACTURING MULTILAYER BOARD

#4

20220394859

2022-12-08

METHOD OF MANUFACTURING CIRCUIT BOARD

#5

20220151081

2022-05-12

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

#6

20220087011

2022-03-17

Bent laminated printed circuit board

#7

20200344895

2020-10-29

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

#8

20200329567

2020-10-15

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

#9

20200137894

2020-04-30

Method of manufacturing circuit board

#10

20200029433

2020-01-23

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

#11

20190373739

2019-12-05

Printed wiring board and method for manufacturing the same

#12

20190306991

2019-10-03

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

#13

20190208630

2019-07-04

LASER DIODE CHIP ON PRINTED CIRCUIT BOARD

#14

20190189335

2019-06-20

Buildup board structure

#15

20190090361

2019-03-21

Method for producing resin multilayer board

#16

20190090359

2019-03-21

Electronic component, electronic device, and method for mounting electronic component

#17

20190057802

2019-02-21

Multilayer substrate and method of producing multilayer substrate

#18

20190053369

2019-02-14

Manufacturing method of printed board

#19

20190037702

2019-01-31

Component-embedded substrate and method for manufacturing component-embedded substrate

#20

20180374623

2018-12-27

Multilayer substrate and method for manufacturing the same

#21

20180286745

2018-10-04

Parallel plate waveguide for power semiconductor package

#22

20180277425

2018-09-27

Power semiconductor package having a parallel plate waveguide

#23

20180242456

2018-08-23

Conductor-structure element having an internal layer substrate laminated into same, and method for the production thereof

#24

20180237934

2018-08-23

Printed wiring board, semiconductor package and method for manufacturing printed wiring board

#25

20180220526

2018-08-02

Radio-frequency antenna, radio-frequency substrate with radio-frequency antenna, and production method

#26

20180213643

2018-07-26

Resin multilayer substrate and method of manufacturing the same

#27

20180153037

2018-05-31

Multilayer substrate and electronic device

#28

20180070458

2018-03-08

Multilayered substrate and method for manufacturing the same

#29

20180054894

2018-02-22

METHOD FOR MANUFACTURING LAYERED ELECTRONIC DEVICES

#30

20170374742

2017-12-28

COMPOSITE WIRING BOARD AND METHOD FOR MANUFACTURING COMPOSITE WIRING BOARD

#31

20170367197

2017-12-21

Manufacturing method of multilayer printed wiring board

#32

20170290165

2017-10-05

Thin film component sheet, board with built-in electronic component, and method of manufacturing the thin film component sheet

#33

20170287617

2017-10-05

Buildup board structure

#34

20170245362

2017-08-24

Stretchable circuit board and method for manufacturing the same

#35

20170238420

2017-08-17

Laser diode chip on printed circuit board

#36

20170188459

2017-06-29

Multilayer circuit board using laser direct structuring additive

#37

20170040697

2017-02-09

Antenna device and wireless communication apparatus

#38

20160360617

2016-12-08

METHOD FOR MANUFACTURING LAYERED CIRCUIT BOARD, LAYERED CIRCUIT BOARD, AND ELECTRONIC DEVICE

#39

20160295707

2016-10-06

Manufacturing method of multilayer printed wiring board

#40

20160272132

2016-09-22

Electrical connection box

#41

20160128201

2016-05-05

Method for forming vias on printed circuit boards

#42

20160088729

2016-03-24

Multilayer wiring substrate

#43

20160066428

2016-03-03

Component-embedded substrate and communication module

#44

20160029489

2016-01-28

Production method of component-embedded substrate, and component-embedded substrate

#45

20160027578

2016-01-28

Method of manufacturing multilayer board, multilayer board, and electromagnet

#46

20160013108

2016-01-14

Multi-layered printed circuit board having inner-layer portion and outer-layer portions and manufacturing method thereof

#47

20160007480

2016-01-07

Component built-in multilayer substrate fabricating method

#48

20160007462

2016-01-07

Method for manufacturing layered electronic devices

#49

20150382464

2015-12-31

Multilayer substrate and manufacturing method for the multilayer substrate

#50

20150380848

2015-12-31

Flexible circuit board and device

#51

20150373854

2015-12-24

Electronic component, method for manufacturing the electronic component, and circuit board

#52

20150319848

2015-11-05

Printed wiring board, semiconductor package and method for manufacturing printed wiring board

#53

20150296621

2015-10-15

Laminated circuit substrate

#54

20150257273

2015-09-10

Electronic component built-in multi-layer wiring board and method of manufacturing the same

#55

20150163927

2015-06-11

Circuit board and method for producing same

#56

20150163918

2015-06-11

Component-embedded board and communication terminal device

#57

20150108084

2015-04-23

Method of making a flexible circuit

#58

20150102970

2015-04-16

Manufacturing method for a magnetic material core-embedded resin multilayer board

#59

20150060118

2015-03-05

Multilayer printed circuit board and method of manufacturing the same

#60

20150041428

2015-02-12

Methods of manufacturing printed circuit boards with stacked micro vias

#61

20150035718

2015-02-05

Antenna device and wireless communication apparatus

#62

20140345932

2014-11-27

Multi-layer printed circuit board and method for fabricating multi-layer printed circuit board

#63

20140321086

2014-10-30

Component-embedded substrate

#64

20140321085

2014-10-30

Component-embedded substrate

#65

20140264737

2014-09-18

Component-embedded substrate

#66

20140262444

2014-09-18

Method of making a three dimensional circuit with an imprint tool

#67

20140211437

2014-07-31

Component built-in board mounting body and method of manufacturing the same, and component built-in board

#68

20140190729

2014-07-10

Flexible printed circuit

#69

20140166346

2014-06-19

Ceramic substrate, and method of manufacturing the same

#70

20140158408

2014-06-12

Multi-layer wiring board and method of manufacturing the same

#71

20140133118

2014-05-15

Component-embedded board and method of manufacturing same

#72

20140029222

2014-01-30

Chip component-embedded resin multilayer substrate and manufacturing method thereof

#73

20140003011

2014-01-02

Electric element-embedded multilayer substrate and method for manufacturing the same

#74

20130341076

2013-12-26

Package substrate and die spacer layers having a ceramic backbone

#75

20130299219

2013-11-14

Multilayer circuit board and method for manufacturing the same

#76

20130277761

2013-10-24

Motor control multilayer circuit board

#77

20130269985

2013-10-17

Resin composition, and protective film, dry film, circuit board, and multilayer circuit board containing same

#78

20130213699

2013-08-22

Substrate with built-in component and method for manufacturing the same

#79

20130162364

2013-06-27

Printed circuit board having differential line pairs with a percentage of their lengths disposed as an outer signal layer

#80

20130126221

2013-05-23

Method for manufacturing layered circuit board, layered circuit board, and electronic device

#81

20120298728

2012-11-29

Method for manufacturing substrate

#82

20120205145

2012-08-16

Multilayer substrate and manufacturing method thereof

#83

20120160554

2012-06-28

Multilayer printed circuit board and method for making same

#84

20120152603

2012-06-21

PRINTED CIRCUIT BOARD INCLUDING AT LEAST ONE LAYER

#85

20120152601

2012-06-21

Package substrate and die spacer layers having a ceramic backbone

#86

20120003499

2012-01-05

Flexible board

#87

20120000695

2012-01-05

Resin circuit board

#88

20110289774

2011-12-01

Methods of manufacturing printed circuit boards using parallel processes to interconnect with subassemblies

#89

20110284273

2011-11-24

Power core for use in circuitized substrate and method of making same

#90

20110266044

2011-11-03

Thin Film Circuit Board Device

#91

20110252637

2011-10-20

Structure and method of making interconnect element, and multilayer wiring board including the interconnect element

#92

20110211321

2011-09-01

Multilayer circuit board with resin bases and separators

#93

20110180206

2011-07-28

Method of providing conductive structures in a multi-foil system and multifoil system comprising same

#94

20110120754

2011-05-26

MULTILAYER WIRING BOARD AND SEMICONDUCTOR DEVICE

#95

20110057324

2011-03-10

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

#96

20110042124

2011-02-24

MULTILAYER WIRING SUBSTRATE HAVING CAVITY PORTION

#97

20110041330

2011-02-24

Methods of manufacturing printed circuit boards with stacked micro vias

#98

20110031000

2011-02-10

RESIN COMPOSITION, CARRIER MATERIAL WITH RESIN, MULTI-LAYERED PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

#99

20110005071

2011-01-13

Printed Circuit Board and Manufacturing Method Thereof

#100

20100326712

2010-12-30

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

#101

20100295170

2010-11-25

Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate

#102

20100276184

2010-11-04

Multilayer printed board and method for manufacturing the same

#103

20100269336

2010-10-28

Methods for fabricating circuit boards

#104

20100242270

2010-09-30

Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module

#105

20100212937

2010-08-26

Process for manufacturing circuit board

#106

20100200643

2010-08-12

METHOD FOR PRODUCING ELECTRONIC PART UNIT

#107

20100175250

2010-07-15

Multilayer substrate and method of manufacturing the same

#108

20100147576

2010-06-17

Laminated wiring board and method for manufacturing the same

#109

20100059266

2010-03-11

Ceramic multi-layer circuit substrate and manufacturing method thereof

#110

20090264028

2009-10-22

Joint structure, joining method, wiring board and method for producing the same

#111

20090242247

2009-10-01

Method for fabricating package substrate and die spacer layers having a ceramic backbone

#112

20090242238

2009-10-01

Buried pattern substrate

#113

20090229869

2009-09-17

Wiring board and method of making the same

#114

20090220738

2009-09-03

Conductive paste and multilayer printed wiring board using the same

#115

20090217518

2009-09-03

Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board

#116

20090178274

2009-07-16

Methods of manufacturing printed circuit boards with stacked micro vias

#117

20090159559

2009-06-25

Method of manufacturing multilayer printed circuit board having buried holes

#118

20090154132

2009-06-18

Method of manufacturing a printed wiring board

#119

20090126975

2009-05-21

Method for fabricating multilayer circuit board, circuit plate, and method for fabricating the circuit plate

#120

20090107624

2009-04-30

Multi-layer circuit board and method of making the same

#121

20090057265

2009-03-05

Method of manufacturing multilayer printed circuit board

#122

20090051041

2009-02-26

MULTILAYER WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND SUBSTRATE FOR USE IN IC INSPECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME

#123

20090020319

2009-01-22

Multilayer printed circuit board

#124

20090008141

2009-01-08

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

#125

20080289868

2008-11-27

CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING CONNECTION BOARD, AND MANUFACTURING METHOD THEREOF

#126

20080250634

2008-10-16

Multi-layer board manufacturing method thereof

#127

20080232074

2008-09-25

Circuit Card Assembly Including Individually Testable Layers

#128

20080185176

2008-08-07

Wiring Board Member For Forming Multilayer Wiring Board, Method of Manufacturing the Same, and Multilayer Wiring Board

#129

20080169568

2008-07-17

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

#130

20080149374

2008-06-26

Laminated multi-layer circuit board

#131

20080136041

2008-06-12

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

#132

20080136013

2008-06-12

Multilayer substrate and method of manufacturing the same

#133

20080116611

2008-05-22

Method of Manufacturing Multilayer Wiring Board

#134

20080100291

2008-05-01

Solid high aspect ratio via hole used for burn-in boards, wafer sort probe cards, and package test load boards with electronic circuitry

#135

20080099121

2008-05-01

Conductive paste and method for manufacturing multilayer printed wiring board using the same

#136

20080090335

2008-04-17

Circuit module and manufacturing method thereof

#137

20080057623

2008-03-06

Thin embedded active IC circuit integration techniques for flexible and rigid circuits

#138

20080017409

2008-01-24

Multilayer board

#139

20080016685

2008-01-24

Wiring board, multilayer wiring board, and method for manufacturing the same

#140

20080010819

2008-01-17

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

#141

20080009128

2008-01-10

Buried pattern substrate and manufacturing method thereof

#142

20070293038

2007-12-20

Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate

#143

20070267138

2007-11-22

Method for fabricating three-dimensional all organic interconnect structures

#144

20070263369

2007-11-15

Component-embedded board device and faulty wiring detecting method for the same

#145

20070246254

2007-10-25

Methods of manufacturing printed circuit boards with stacked micro vias

#146

20070232059

2007-10-04

Multilayer interconnection substrate and method of manufacturing the same

#147

20070227763

2007-10-04

Coreless thin substrate with embedded circuits in dielectric layers and method for manufacturing the same

#148

20070170598

2007-07-26

FLEXIBLE CIRCUIT BOARD, METHOD FOR MAKING THE SAME, FLEXIBLE MULTI-LAYER WIRING CIRCUIT BOARD, AND METHOD FOR MAKING THE SAME

#149

20070148829

2007-06-28

Manufacturing method of flexible printed wiring board

#150

20070133184

2007-06-14

Printed Circuit Board and Manufacturing Method Thereof

#151

20070102191

2007-05-10

Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate

#152

20070074391

2007-04-05

Method of producing circuit board

#153

20070000688

2007-01-04

Method for forming multilayer substrate

#154

20060278963

2006-12-14

Multi-layer substrate having conductive pattern and resin film and method for manufacturing the same

#155

20060274510

2006-12-07

Multilayer wiring board and fabricating method of the same

#156

20060272850

2006-12-07

INTERLAYER CONNECTION CONDUCTOR AND MANUFACTURING METHOD THEREOF

#157

20060249833

2006-11-09

Wiring board, multilayer wiring board, and method for manufacturing the same

#158

20060249754

2006-11-09

Thin embedded active IC circuit integration techniques for flexible and rigid circuits

#159

20060237225

2006-10-26

Multilayer printed wiring board

#160

20060191133

2006-08-31

Multilayer board manufacturing method

#161

20060162956

2006-07-27

Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing them

#162

20060124345

2006-06-15

Method of manufacturing a device-incorporated substrate

#163

20060102386

2006-05-18

Multi-layered flexible print circuit board and manufacturing method thereof

#164

20060079127

2006-04-13

Structure and method of making interconnect element, and multilayer wiring board including the interconnect element

#165

20060068180

2006-03-30

Printed circuit board having colored outer layer

#166

20060057819

2006-03-16

Electronic part producing method and electronic part

#167

20060046485

2006-03-02

Method of manufacturing package substrate with fine circuit pattern using anodic oxidation

#168

20060044735

2006-03-02

Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns

#169

20060042826

2006-03-02

Circuit board, multi-layer wiring boards, method of producing circuit boards and method of producing multilayer wiring boards

#170

20060042078

2006-03-02

Multi-layer board manufacturing method

#171

20060037193

2006-02-23

Method for manufacturing single sided substrate

#172

20050280136

2005-12-22

Method for producing Z-axis interconnection assembly of printed wiring board elements

#173

20050243528

2005-11-03

Board pieces and composite wiring boards using the board pieces

#174

20050186406

2005-08-25

Method for manufacturing multi-layer printed circuit board

#175

20050161804

2005-07-28

Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate

#176

20050155792

2005-07-21

Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method

#177

20050150686

2005-07-14

Organic dielectric electronic interconnect structures and method for making

#178

20050142852

2005-06-30

Method of manufacturing multilayer wiring substrate using temporary metal support layer

#179

20050139386

2005-06-30

Multi-layer printed circuit board and method for manufacturing the same

#180

20050124096

2005-06-09

Manufacturing methods for printed circuit boards

#181

20050098613

2005-05-12

Method for diffusion bond welding for use in a multilayer electronic assembly

#182

20050057906

2005-03-17

Connector sheet and wiring board, and production processes of the same

#183

20050028358

2005-02-10

Process for manufacturing multilayer flexible wiring boards

#184

20050025944

2005-02-03

Method of manufacturing multilayer wiring board

#185

20050017347

2005-01-27

Circuit module and manufacturing method thereof

#186

20050016765

2005-01-27

Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof

#187

20050000725

2005-01-06

Manufacturing method for a printed circuit board

#188

14517403

2016-10-04

Extended landing pad substrate package structure and method