233936 ⎘
Apparatus or processes for manufacturing printed circuits; Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
Inverted microvia structure and method of manufacture
#302Wiring substrate for intermediate connection and multi-layered wiring board and their production
#303Method of forming a multi-layer printed circuit board and the product thereof
#304Multi-layer printed circuit board, and method for fabricating the same
#305Circuitized substrate assembly and method of making same
#306Coupling of conductive vias to complex power-signal substructures
#307Circuit board and method for manufacturing the same
#308Connection pad for embedded components in PCB packaging
#309Printed circuit board made through sintering copper nano-particles
#310Method for providing hermetic electrical feedthrough