H05K3/4632 - CPC Classification Index

#1

20260101445

2026-04-09

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

#2

20260089834

2026-03-26

RESIN LAMINATED BOARD AND METHOD FOR MANUFACTURING RESIN LAMINATED BOARD

#3

20250362712

2025-11-27

DISPLAY DEVICE INCLUDING INNER MOLD AND MANUFACTURING METHOD OF SAME

#4

20240324100

2024-09-26

Multilayer board and manufacturing method thereof

#5

20240215160

2024-06-27

ORGANIC INSULATOR, METAL-CLAD LAMINATE SHEET, AND WIRING BOARD

#6

20240064910

2024-02-22

LAMINATE COATED WITH ASYMMETRIC METAL FOILS, AND PRINTED CIRCUIT BOARD INCLUDING SAME

#7

20240040708

2024-02-01

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

#8

20230371188

2023-11-16

INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTURING THE SAME, AND METAL FOIL-CLAD LAMINATE

#9

20230309219

2023-09-28

Multilayer board and manufacturing method thereof

#10

20230238197

2023-07-27

METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTILAYER CIRCUIT BOARD INCLUDING MEMBRANE SWITCH

#11

20230118261

2023-04-20

Multilayer substrate

#12

20230100174

2023-03-30

Current sensing device

#13

20230043114

2023-02-09

Circuit board, circuit board connection structure, and method of manufacturing circuit board connection structure

#14

20220377911

2022-11-24

Method of manufacturing component carrier and component carrier intermediate product

#15

20220377886

2022-11-24

Laminated body and method for manufacturing the same

#16

20220322534

2022-10-06

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRONIC DEVICE

#17

20220285082

2022-09-08

MULTILAYER BOARD, ELECTRONIC DEVICE, AND MULTILAYER BOARD INSPECTION METHOD

#18

20220159843

2022-05-19

Multilayer Sheets, Methods of Manufacture, and Articles Formed Therefrom

#19

20220141965

2022-05-05

MULTILAYER SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER SUBSTRATE

#20

20220071015

2022-03-03

Circuit board structure and manufacturing method thereof

#21

20220015231

2022-01-13

Printed wiring board and method for manufacturing printed wiring board

#22

20210410296

2021-12-30

Multilayer resin substrate and method of manufacturing multilayer resin substrate

#23

20210345494

2021-11-04

Methods and processes for forming electrical circuitries on three-dimensional geometries

#24

20210235582

2021-07-29

Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board

#25

20210212203

2021-07-08

Laminated body and method for manufacturing the same

#26

20210127502

2021-04-29

Buried via in a circuit board

#27

20210084775

2021-03-18

Manufacturing method of mounting structure, and sheet therefor

#28

20210007222

2021-01-07

ECOLOGICAL MULTILAYER STRUCTURE FOR HOSTING ELECTRONICS AND RELATED METHOD OF MANUFACTURE

#29

20210005405

2021-01-07

Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch including air

#30

20200404785

2020-12-24

Circuit board using non-catalytic laminate with catalytic adhesive overlay

#31

20200388509

2020-12-10

Manufacturing method of mounting structure

#32

20200375030

2020-11-26

THERMOPLASTIC LIQUID CRYSTAL POLYMER FILM, CIRCUIT BOARD, AND METHODS RESPECTIVELY FOR MANUFACTURING SAID FILM AND SAID CIRCUIT BOARD

#33

20200367369

2020-11-19

Printed wiring board and method for manufacturing printed wiring board

#34

20200359508

2020-11-12

Multi-step integrated circuit handling process and apparatus

#35

20200120793

2020-04-16

Ecological multilayer structure for hosting electronics and related method of manufacture

#36

20200107439

2020-04-02

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

#37

20200107437

2020-04-02

Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor package

#38

20200015363

2020-01-09

Method for producing printed wiring board

#39

20200008301

2020-01-02

Circuit module and method for manufacturing the same

#40

20190350083

2019-11-14

Method for manufacturing multilayer wiring board

#41

20190297719

2019-09-26

Hybrid component carrier and method for manufacturing the same

#42

20190239349

2019-08-01

Catalytic circuit board with traces and vias

#43

20190215962

2019-07-11

LC device and method of manufacturing LC device

#44

20190162778

2019-05-30

Multilayer wiring board for inspection of electronic components

#45

20190134951

2019-05-09

Method for manufacturing metal clad laminated board, method for manufacturing electronic circuit board, and rigid body pendulum type viscoelasticity measuring device

#46

20190090361

2019-03-21

Method for producing resin multilayer board

#47

20190088403

2019-03-21

Electronic component, diaphragm, electronic device, and electronic component manufacturing method

#48

20190082542

2019-03-14

Method for manufacturing multilayer substrate

#49

20190080817

2019-03-14

Fibrillated liquid crystal polymer powder, method of producing fibrillated liquid crystal polymer powder, paste, resin multilayer substrate, and method of producing resin multilayer substrate

#50

20190069403

2019-02-28

Ecological multilayer structure for hosting electronics and related method of manufacture

#51

20190014655

2019-01-10

Composite component-embedded circuit board and composite component

#52

20180374623

2018-12-27

Multilayer substrate and method for manufacturing the same

#53

20180332720

2018-11-15

High-speed interconnects for printed circuit boards

#54

20180315687

2018-11-01

Method of manufacturing board

#55

20180302977

2018-10-18

Multilayer substrate, electronic device, and a method for manufacturing a multilayer substrate

#56

20180263119

2018-09-13

Electrical connectors, circuit boards, and fabrication techniques

#57

20180263105

2018-09-13

Hybrid component carrier and method for manufacturing the same

#58

20180237934

2018-08-23

Printed wiring board, semiconductor package and method for manufacturing printed wiring board

#59

20180233429

2018-08-16

Multilayer board and electronic device

#60

20180213653

2018-07-26

Resin substrate, component mounted resin substrate, and method of manufacturing component mounted resin substrate

#61

20180213643

2018-07-26

Resin multilayer substrate and method of manufacturing the same

#62

20180168036

2018-06-14

Circuit board with catalytic adhesive

#63

20180166230

2018-06-14

Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch including air

#64

20180070435

2018-03-08

Multilayer resin substrate, and method of manufacturing multilayer resin substrate

#65

20180054889

2018-02-22

Circuit board apparatus and method

#66

20180054885

2018-02-22

Wiring board and method for manufacturing the same

#67

20170373492

2017-12-28

ESD protection circuit, differential transmission line, common mode filter circuit, ESD protection device, and composite device

#68

20170367181

2017-12-21

Resin substrate and electronic device

#69

20170294258

2017-10-12

Built-in-coil substrate and method for manufacturing the same

#70

20170290172

2017-10-05

Method of lamination of dielectric circuit materials using ultrasonic means

#71

20170273178

2017-09-21

High-frequency signal line, method for producing same, and electronic device

#72

20170238428

2017-08-17

Circuit board and method for manufacturing same

#73

20170188459

2017-06-29

Multilayer circuit board using laser direct structuring additive

#74

20170094798

2017-03-30

Component incorporating substrate and method for manufacturing component incorporating substrate

#75

20170084976

2017-03-23

High-frequency signal line and manufacturing method thereof

#76

20170042033

2017-02-09

Component built-in multilayer board

#77

20160322284

2016-11-03

Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices

#78

20160270221

2016-09-15

Resin multilayer substrate and component module

#79

20160212845

2016-07-21

Thermoplastic liquid crystal polymer film, circuit board, and methods respectively for manufacturing said film and said circuit board

#80

20160174364

2016-06-16

High-speed interconnects for printed circuit boards

#81

20160165720

2016-06-09

Multilayer substrate manufacturing method and multilayer substrate

#82

20160066428

2016-03-03

Component-embedded substrate and communication module

#83

20160050766

2016-02-18

Method for manufacturing resin multilayer board

#84

20160044798

2016-02-11

Method of manufacturing resin multilayer substrate

#85

20160037622

2016-02-04

Multilayer resin substrate, and method of manufacturing multilayer resin substrate

#86

20160027578

2016-01-28

Method of manufacturing multilayer board, multilayer board, and electromagnet

#87

20160014893

2016-01-14

Multilayer board

#88

20160014884

2016-01-14

Sensor device with a flexible electrical conductor structure

#89

20160007480

2016-01-07

Component built-in multilayer substrate fabricating method

#90

20150382464

2015-12-31

Multilayer substrate and manufacturing method for the multilayer substrate

#91

20150380848

2015-12-31

Flexible circuit board and device

#92

20150342062

2015-11-26

Semi-finished product for the production of a printed circuit board, method for producing a printed circuit board and printed circuit board

#93

20150342048

2015-11-26

Circuit board

#94

20150334851

2015-11-19

Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch

#95

20150319848

2015-11-05

Printed wiring board, semiconductor package and method for manufacturing printed wiring board

#96

20150318614

2015-11-05

Circuit board and circuit module

#97

20150305150

2015-10-22

Multi-layer resin substrate and method of manufacturing multi-layer resin substrate

#98

20150296621

2015-10-15

Laminated circuit substrate

#99

20150163927

2015-06-11

Circuit board and method for producing same

#100

20150113802

2015-04-30

Method of manufacturing resin multilayer substrate

#101

20150103499

2015-04-16

Electronic component-embedded module and communication terminal device

#102

20150092369

2015-04-02

Component-embedded substrate and manufacturing method thereof

#103

20150084822

2015-03-26

Circuit board and circuit module

#104

20150054601

2015-02-26

High-frequency signal line and manufacturing method thereof

#105

20140376197

2014-12-25

Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices

#106

20140328038

2014-11-06

Electronic component-embedded module

#107

20140321069

2014-10-30

High-frequency module

#108

20140262448

2014-09-18

High-frequency signal line, method for producing same, and electronic device

#109

20140102623

2014-04-17

Resin composition for insulating layer for multi-layered printed board

#110

20140077638

2014-03-20

Control device and motor unit including the control device

#111

20140029222

2014-01-30

Chip component-embedded resin multilayer substrate and manufacturing method thereof

#112

20140003011

2014-01-02

Electric element-embedded multilayer substrate and method for manufacturing the same

#113

20130333926

2013-12-19

Circuit substrate and method of manufacturing same

#114

20130319750

2013-12-05

Carbon-fiber-reinforced plastic structure and method for producing same

#115

20130316128

2013-11-28

Carbon-fiber-reinforced plastic structure

#116

20130299219

2013-11-14

Multilayer circuit board and method for manufacturing the same

#117

20130213699

2013-08-22

Substrate with built-in component and method for manufacturing the same

#118

20120279765

2012-11-08

Method for manufacturing a circuit board

#119

20120273260

2012-11-01

Systems and methods for composite structures with embedded interconnects

#120

20120205145

2012-08-16

Multilayer substrate and manufacturing method thereof

#121

20120186860

2012-07-26

Circuit board

#122

20120182701

2012-07-19

Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices

#123

20120181068

2012-07-19

CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING SAME

#124

20120160547

2012-06-28

Coreless layer buildup structure

#125

20120056796

2012-03-08

Circuit board and circuit module

#126

20120043129

2012-02-23

Circuit board and method for manufacturing the same

#127

20120012369

2012-01-19

Circuit board

#128

20120002380

2012-01-05

Circuit board and mother laminated body

#129

20120000695

2012-01-05

Resin circuit board

#130

20110317366

2011-12-29

Fixing structure and fixing method of circuit board with embedded electronic parts to cooler

#131

20110266666

2011-11-03

Circuit board with built-in semiconductor chip and method of manufacturing the same

#132

20110266033

2011-11-03

MULTILAYER BOARD

#133

20110042124

2011-02-24

MULTILAYER WIRING SUBSTRATE HAVING CAVITY PORTION

#134

20110030207

2011-02-10

MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

#135

20110024165

2011-02-03

SYSTEMS AND METHODS FOR COMPOSITE STRUCTURES WITH EMBEDDED INTERCONNECTS

#136

20110006861

2011-01-13

Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications

#137

20100276184

2010-11-04

Multilayer printed board and method for manufacturing the same

#138

20100242270

2010-09-30

Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module

#139

20100226110

2010-09-09

Printed wiring board, printed IC board having the printed wiring board, and method of manufacturing the same

#140

20100218891

2010-09-02

MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYMER DIELECTRIC

#141

20100175806

2010-07-15

Method for filling conductive paste and method for manufacturing multilayer board

#142

20100175250

2010-07-15

Multilayer substrate and method of manufacturing the same

#143

20090266492

2009-10-29

Printed circuit board manufacturing equipment

#144

20090229869

2009-09-17

Wiring board and method of making the same

#145

20090185357

2009-07-23

Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods

#146

20090139761

2009-06-04

Multilayer printed wiring board and manufacturing method thereof

#147

20090107715

2009-04-30

Wiring board with a built-in component and method for manufacturing the same

#148

20090008141

2009-01-08

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

#149

20080289868

2008-11-27

CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING CONNECTION BOARD, AND MANUFACTURING METHOD THEREOF

#150

20080217050

2008-09-11

Multi-layered interconnect structure using liquid crystalline polymer dielectric

#151

20080178999

2008-07-31

Multi-layered interconnect structure using liquid crystalline polymer dielectric

#152

20080149374

2008-06-26

Laminated multi-layer circuit board

#153

20080136013

2008-06-12

Multilayer substrate and method of manufacturing the same

#154

20080116611

2008-05-22

Method of Manufacturing Multilayer Wiring Board

#155

20080053688

2008-03-06

Printed circuit board and method of manufacturing the same

#156

20080022519

2008-01-31

ELECTRONIC PACKAGE WITH OPTIMIZED LAMINATION PROCESS

#157

20080017409

2008-01-24

Multilayer board

#158

20080010819

2008-01-17

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

#159

20070267138

2007-11-22

Method for fabricating three-dimensional all organic interconnect structures

#160

20070264438

2007-11-15

RESIN COMPOSITION FOR INSULATING LAYER FOR MULTI-LAYERED PRINTED BOARD

#161

20070085108

2007-04-19

Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications

#162

20070074391

2007-04-05

Method of producing circuit board

#163

20060278963

2006-12-14

Multi-layer substrate having conductive pattern and resin film and method for manufacturing the same

#164

20060274510

2006-12-07

Multilayer wiring board and fabricating method of the same

#165

20060267181

2006-11-30

Graded liquid crystal polymer package

#166

20060162956

2006-07-27

Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing them

#167

20060068180

2006-03-30

Printed circuit board having colored outer layer

#168

20060044735

2006-03-02

Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns

#169

20060042078

2006-03-02

Multi-layer board manufacturing method

#170

20050246879

2005-11-10

Apparatus of recycling printed circuit board

#171

20050224961

2005-10-13

Electronic package with optimized lamination process

#172

20050186406

2005-08-25

Method for manufacturing multi-layer printed circuit board

#173

20050139386

2005-06-30

Multi-layer printed circuit board and method for manufacturing the same

#174

20050057908

2005-03-17

Multi-layered interconnect structure using liquid crystalline polymer dielectric

#175

20050032347

2005-02-10

Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces

#176

20050025944

2005-02-03

Method of manufacturing multilayer wiring board

#177

20050019527

2005-01-27

Lamination of liquid crystal polymer dielectric films

#178

20050000725

2005-01-06

Manufacturing method for a printed circuit board

#179

15240133

2017-07-11

Catalytic laminate apparatus and method