234034 ⎘
Constructional details common to different types of electric apparatus; Arrangements of circuit components or wiring on supporting structure; Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers J-shaped leads
LEADED SEMICONDUCTOR DEVICE PACKAGE
#2METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL LOAD DISTRIBUTION OF INTEGRATED CIRCUIT PACKAGES
#3Wiring substrate and manufacturing method thereof
#4Wiring substrate and manufacturing method thereof
#5Wiring substrate and manufacturing method thereof
#6Connection base assembly for an IC testing apparatus
#7Socket for burn-in tests
#8Module connector