SOCKET ASSEMBLIES FOR SEMICONDUCTOR DEVICES

ENVIRONMENTAL SEALING FOR ELECTRONICS CHIP PACKAGE SOCKETS

DIFFERENTIAL TRANSMISSION BOARD SET AND ASSEMBLY

ELECTRICAL CONNECTOR WITH INTEGRATED GROUND PLANE

Standoff And Support Structures for Reliable Land Grid Array and Hybrid Land Grid Array Interconnects

DIFFERENTIAL TRANSMISSION BOARD SET AND ASSEMBLY

DIFFERENTIAL TRANSMISSION BOARD SET AND ASSEMBLY

Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket

Electrical connector assembly having hybrid conductive polymer contacts

Interposer printed circuit boards for power modules

Back plate assembly and electronic device

Electrical connector between CPU and PCB

Loading assembly

Electronic module for motherboard

Interposer printed circuit boards for power modules

Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket

Test socket

Component insertion device with dummy component, and component insertion method and computer readable recording medium of using the same

Connector equipped with carrier frame and rail frame for CPU

Electrical connector

Socket

Semiconductor assembly

Interposer electrical connector for a chip module

LIQUID METAL CIRCUIT ELEMENT CONNECTOR

Electrical connector

Electrical connector

Electrical connector with dual electrical path

Socket with removable retainer attached to deflectable fixing seat

Contacting device

Electrical connector with terminals made from soldering balls

On board transceiver assembly having hold down member

Hardware interface with space-efficient cell pattern

Electrical connector

Electrical connector

Electrical connector with reinforced rib stiffener

Device, system and method for providing zone-based configuration of socket structures

Pressing member and electrical connector assembly

Electrical connector assembly with holding member

Integrated package insertion and loading mechanism (iPILM)

Electrical connector and contacts thereof

Electrical connector assembly

Packaging for eight-socket one-hop SMP topology

Processor loading system

Socket assembly with pick up cap

Low insertion force connector utilizing directional adhesion

Packaging for eight-socket one-hop SMP topology

Socket for reducing size and operating force

LGA socket terminal damage prevention

Electrical connector having an improved stiffener

Integrated package insertion and loading mechanism (iPILM)

Electrical connector having a plurality of absorbing material blocks

Electrical connector with low profile

Contact protection for integrated circuit device loading

Electrical connector for self loading electronic package

PACKAGE RETENTION FRAME

Electrical connector assembly having shielding device for EMI thereof

Electrical connector and carrier thereof for assembling IC package

Adhesively bonding jackets to central processing units

Electrical connector having a holding member and a load plate pivotally assembled to two ends of a stiffener

Electrical interconnect IC device socket

Electrical connection device having a fixing member with a positioning portion engaging a groove in a socket

PoP structures including through-assembly via modules

Socket having a floating plate with a guide member and a biasing spring

Lead frame and flip chip package device thereof

Processor loading system

Fastener for an electrical connector

Low profile heat dissipating system with freely-oriented heat pipe

Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies

Electrical connector incorporated with circuit board facilitating interconnection

Electronic package with thermal interposer and method of making same

Electrical contact for interconnect member

Method of placing a chip assembly in a socket housing

Three dimensional interposer device

LEAD PIN FOR PACKAGE SUBSTRATE AND PACKAGE SUBSTRATE USING THE SAME

System and method for multi-application socket

Method of making a compliant printed circuit peripheral lead semiconductor test socket

CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR INTEGRATED CIRCUIT WAFER PROBE CARD ASSEMBLIES

Electronic Component Structure and Electronic Device

Tray in combination with electronic component attaching tool attached to the tray

Processor loading system

Processor loading system including a heat dissipater

Substrate With Raised Edge Pads

Electrical connector and assembly thereof

Socket connector having a locking member to restrict upward and downward movement of a fastened portion of a load lever

IC SOCKET

Method of applying force to electrical contacts on a printed circuit board

Socket connector having a recess provided with a spring member on a side thereof

Socket connector having stiffener provided with latch-enabled standoff

Electrical connector

High density array module and connector

Electrical connector with improved cam actuator

Land grid array socket connector with anti-slippery load lever structure

Electrical connector having improved contacts

High density connector for interconnecting fine pitch circuit packaging structures

Connector assembly having alignment members for holding a module

BURN-IN SOCKET WITH INTENSIFIED SOCKET BODY

Electrical connector defining plurality of discrete interconnecting sectors for respectively receiving individual IC package thereon

Method of producing a land grid array interposer structure

Socket assembly with pick-up cap serving as stand-off

Electrical component socket

Method for forming an adapter apparatus using curable material

IC socket with offset cam capable of preventing warpage of cover

Electrical connector assembly having a rotatable clip-fastening mechanism

LGA socket having alignment posts with crash ribs

Sliding package retention device for LGA sockets

Wire bale independent load mechanism

Socket for electric component with radiating member

Semiconductor device socket

Electrical connector assembly having pick-up cap

LGA socket having improved standoff

Socket connector with locking device

CPU socket with locking device

Electrical connector assembly

Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies

Connector for microelectronic devices

Printed Circuit Board Assembly Having Multiple Land Grid Arrays for Providing Power Distribution

ELECTRCAL CONNECTOR FOR RECEIVING A CPU

Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Spring actuated clamping mechanism

ENCLOSURE OF ELECTRONIC DEVICE

Method of forming metallized elastomeric electrical contacts

Frame for electrical connector

Voltage regulator attach for high current chip applications

Test method and device for land grid array components

METHOD OF ATTACHING AN INTEGRATED CIRCUIT CHIP TO A MODULE

IC SOCKET

Electrical connector assembly with pick up cap

Electrical connector

Socket having engaging clump

BONDING PAD FOR ELECTRONIC SUBASSEMBLIES

Socket, method for manufacturing socket, and semiconductor device

Non-intrusive interposer for accessing integrated circuit package signals

High rigidity stainless steel for central processing unit socket frame or central processing unit retention cover

Electrical connector assembly with fastening device

CPU socket assembly with package retention mechanism

Shielded electrical interconnect

Land grid array interposer producing method

Electrical connector having a connecting assembly

Method of producing a land grid array (LGA) interposer structure

Pick-and-place cap for socket assembly

Groups of land grid interposers of different heights having metal-on elastomer hemi-torus shapes providing for electrical contact with at least one component on an opposite side of an electrically insulating carrier plate mounting interposers

Socket connector having retaining tabs arranged on edges of sidewalls thereon

Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electrical contacts on opposite sides of a carrier plane

Electrical connector assembly having improved pick up cap

Metalized elastomeric electrical contacts

Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array fabrication using elastomer core and conducting metal shell or mesh

Terminal assembly with pin-retaining socket

Method and apparatus for securing a microprocessor and heat sink using fewer mounting holes

Method of producing a land grid array (LGA) interposer structure

Method of producing a land grid array interposer

Electrical connector having hybrid standoff

Land grid array socket with improved fastening structure

Land grid array interposer (LGA) utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries that is constituted of a moldable dielectric elastometric material

Method of producing a land grid array interposer

IC socket with attached electronic component

Electrical connector assembly having heat sink

Electrical connector assembly having connecting portion

Piston reset apparatus for a multichip module and method for resetting pistons in the same

Socket connector assembly with pick-up cap

Method of forming a land grid array (LGA) interposer

Customizable backer for achieving consistent loading and engagement of array package connections

Integrated circuit socket

Connector with metalized coated polymer contact

IC socket

Electrical connector assembly with improved pick-up cap

Socket with latching equipment

Land grid array (LGA) interposer groups of different heights utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer structure providing for electrical contacts on opposite sides of a carrier plane

Conductive element and an electric connector using the same

Method of producing a land grid array interposer utilizing metal-on-elastomer

Electrical connector

Land grid array connector assembly with pick up cap

Method of producing a land grid array (LGA) interposer utilizing metal-on-elastomer

Electrical connector and packaging assembly

Electrical connector assembly

Integrated circuit device mounting with folded substrate and interposer

Conductive particle filled polymer electrical contact

Method of forming a land grid array interposer

UPDATING FIXTURE FOR BIOS IN COMPUTER SYSTEM

Land grid array connector with retaing clip

Metalized elastomeric probe structure

Socket connector

Protected socket for integrated circuit devices

Socket

Land grid array connector having improved stiffener

Socket

Electrical connector

Force distributing spring element

LGA socket assembly having improved pickup cap to be ejected when a lever is lifted

Electrical connector

Socket having fan

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

LGA utilizing metal-on-elastomer hemi-torus having a slitted wall surface for venting gases

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land Grid Array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Customizable backer for achieving consistent loading and engagement of array package connections

Electrical connector

Metalized elastomeric electrical contacts

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Electrical socket

Heat relief socket

Electronic packaging using conductive interproser connector

Memory module with rubber spring connector

Methods for fabricating fences on interposer substrates

Rubber spring connector

Substrate with raised edge pads

Miniaturized Contact Spring

Memory module

Semiconductor device mounting socket

Interconnecting electrical devices

Three-dimensional flexible interposer

COMPONENT-FIXING DEVICE, AND PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS WITH COMPONENT-FIXING DEVICE

Method for structural enhancement of compression system board connections

Land grid array connector with reinforcement stiffener

SOCKET MEASUREMENT APPARATUS AND METHOD

Conductive element and an electric connector using the same

Process of forming socket contacts

Package structure for a semiconductor device incorporating enhanced solder bump structure

Retractable ledge socket

Interposers with alignment fences and semiconductor device assemblies including the interposers

Alignment fences and devices and assemblies including the same

Circuit component socket and method for mounting the same

Electrical connector having a flexible sheet and one or more conductive connectors

Low profile LGA socket assembly

Test kit semiconductor package and method of testing semiconductor package using the same

High-rigidity stainless steel for central processing unit socket frame or central processing unit retention cover

Socket adapted for compressive loading

Electrical connector

Multi-slot socket for mounting integrated circuits on circuit board

Electrical connector

Land grid array socket and method for assembling the same

LGA socket

Land grid array connector without undesired engagement

Low profile and tight pad-pitch land-grid-array (LGA) socket

Protected socket for integrated circuit devices

Socket connector having multi-piece housing

Folded substrate with interposer package for integrated circuit devices

Land grid array package socket

Electrical connector having protecting protrusions

Substrates including alignment fences

Land grid array fabrication using elastomer core and conducting metal shell or mesh

Circuit board and system with a multi-portion socket

Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unit

Socket connector having two-piece housing

Heat sink attachment

Electronic packaging using conductive interposer connector

Land grid array connector with reinforcement stiffener

Land grid array socket with pressing plate

Method for fabricating a connector

Land grid array (LGA) interposer with adhesive-retained contacts and method of manufacture

Electronic component attaching tool

IC socket

Loading system for a land grid array connector assembly

Connector

Land grid array connector with reliable securing blocks

Adapter apparatus with conductive elements mounted using curable material and methods regarding same

LGA contact with pair of cantilever arms

Surface mount optoelectronic component

I/C package/thermal-solution retention mechanism with spring effect

Colored conductive wires for a semiconductor package

Pick up cap for LGA connector assembly

Three-dimensional flexible interposer

Electrical connector assembly with pick up cap

Land grid array connector with distortion gap

Method of manufacturing a connector

Solderless electronics packaging and methods of manufacture

Land grid array socket with diverse contacts

Ball grid array (BGA) package having corner or edge tab supports

Integrated circuit package

IC socket contact

Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies

Land grid array connector assembly with pick up cap

Board to board array type connector

Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies

Method for making an integrated circuit substrate having embedded back-side access conductors and vias

Electrical connector

Electrical connector with reliable resilient beams

Socket for a microelectronic component having reduced electrical resistance and inductance

Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate

Electrical connector

Pick up cap for LGA connector assembly

Pick up cap used for a land grid array connector

Force distributing spring element

Method for assembling integral type electronic device, and integral type electronic device

Barrier for hybrid socket movement reduction