Patents-Review.com
ClassID:

234038 ⎘

H05K7/1076 - CPC Classification

Classification description:

Constructional details common to different types of electric apparatus; Arrangements of circuit components or wiring on supporting structure; Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding

Sub-classes:
Recent Application in this class:
#1
20240365493
2024-10-31

LIFTING MODULE AND ELECTRONIC DEVICE

 #2
20240305026
2024-09-12

CONNECTOR ASSEMBLY WITH INTEGRATED DATA AND BACKUP ENERGY CONNECTIONS

 #3
20230269897
2023-08-24

SSD card adapter bracket and circuit board assembly

 #4
20220374056
2022-11-24

Electronic assembly having engagement component for fixing expansion card on motherboard

 #5
20190044265
2019-02-07

Connectors for integrated circuit packages

 #6
20180157295
2018-06-07

Server

 #7
20170238436
2017-08-17

Modular electronics system with interfacing interchangeable components

 #8
20130244490
2013-09-19

High performance surface mount electrical interconnect

 #9
20120073127
2012-03-29

Alignment and lead insertion device for an electronic component

 #10
20120057279
2012-03-08

Electronic apparatus

 #11
20110177701
2011-07-21

Electrical connecting device

 #12
20100075533
2010-03-25

Randomly-accessible electrical busbar with protective cover and associated mating connector

 #13
20090325398
2009-12-31

Land grid array (LGA) socket with cells and method of fabrication and assembly

 #14
20090047808
2009-02-19

Electrical connector

 #15
20080229852
2008-09-25

Spring reaction force converting apparatus

 #16
20080214037
2008-09-04

Zero insertion force socket having improved actuator position

 #17
20080050983
2008-02-28

CPU socket configured with assembled grids

 #18
20070267463
2007-11-22

APPARATUS FOR MOUNTING COLUMNS FOR GRID ARRAY ELECTRONIC PACKAGES

 #19
20070020984
2007-01-25

Alignment system

 #20
20050122126
2005-06-09

Apparatus for mounting columns for grid array electronic packages