REMOVABLE OCP MODULE WITH PCIE SLOTS

Reverse clamping compression device for CPO or NPO

CARRIER MODULE APPARATUS FOR RETROFIT IN CONTROL CABINETS AND METHODS OF ASSEMBLY THEREOF

STRUCTURE AND STRUCTURE WITH ELECTRONIC COMPONENT

Electronic assembly including cable modules

Socket alignment and retention system

Socket connector having array of socket contacts

CIRCUIT BOARDS FOR ELECTRONIC DEVICES

Method and apparatus for mounting a DUT on a test board without use of socket or solder

Electronic assembly including cable modules

Power delivery module for an electronic package

Ethernet connector with electromagnetic filtering

Heat spreader for an electrical connector assembly

First socket nested in a second socket

Electrical connector assembly with holding member

Multi-array bottom-side connector using spring bias

Socket with routed contacts

Power Unit with Conductive Slats

Insertable Power Unit with Mounting Contacts for Plugging into a Mother Board

Two-stage power delivery architecture

Socket with routed contacts

Two-stage power delivery architecture

Electrical connector assembly having independent loading mechanism facilitating interconnections for both CPU and cable

Electronic devices mounted on multiple substrates

Chip package to support high-frequency processors

High performance surface mount electrical interconnect with external biased normal force loading

Compliant conductive nano-particle electrical interconnect

Socket connector assembly with compressive contacts

Point of load (POL) power supply systems with replacement module

System And Method For Processor Power Delivery And Thermal Management

Socket package including integrataed capacitors

APPARATUS FOR PROVIDING CONTROLLED IMPEDANCE IN AN ELECTRICAL CONTACT

Re-programmable modular power management circuit

Method and apparatus for enhanced packaging for PC security

APPARATUS FOR PROVIDING CONTROLLED IMPEDANCE IN AN ELECTRICAL CONTACT

Installing Processor/Converter Assembly In A Computer

Socket enabled current delivery to a thermoelectric cooler to cool an in-substrate voltage regulator

Multiple-board power converter

Variable mount voltage regulator

Power converter package and thermal management

Electronic module with dual connectivity

Microbump function assignment in a buck converter

Environmentally hardened Ethernet switch

SYSTEM AND METHOD FOR PROCESSOR POWER DELIVERY AND THERMAL MANAGEMENT

Environmentally hardened ethernet switch

Method and apparatus for assembling multi-core dice using sockets with multiple sets of front side bus contacts

Surface mounted micro-scale springs for separable interconnection of package substrate and high-speed flex-circuit

Processor module with rigidly coupled processor and voltage-regulator heat sinks

System and method for processor power delivery and thermal management

Decoupling capacitor for an integrated circuit and method of manufacturing thereof

Active interconnects and control points in integrated circuits

Integrated power supply module for filter

Adapter module

Electronic assembly with integrated IO and power contacts

Systems to cool multiple electrical components

Multi-chip module with stacked redundant power

Decoupling capacitor for an integrated circuit and method of manufacturing thereof

Environmentally hardened ethernet switch

Multi-portion socket and related apparatuses

System and method for processor power delivery and thermal management

Power delivery system for integrated circuits

Interposer device

Electronic assembly with integrated IO and power contacts

System and apparatus for socket and package power/ground bar to increase current carrying capacity for higher IC power delivery

Delivery regions for power, ground and I/O signal paths in an IC package

Apparatus for providing controlled impedance in an electrical contact

Method for interconnecting an integrated circuit multiple die assembly

Environmentally hardened Ethernet switch

Multilayered power supply line for semiconductor integrated circuit and layout method thereof

Constructing of an electronic assembly having a decoupling capacitor

Land grid array socket with diverse contacts

Electronic module with dual connectivity