ClassID:

234129

H05K7/20245 - CPC Classification

Classification description:

Constructional details common to different types of electric apparatus; Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by natural convection; Thermosiphons

Recent Application in this class:
#1
20260132646
2026-05-14

SUSTAINABLE HEAT TRANSFER SYSTEM THAT INCLUDES A DIGITAL PROCESSING FACILITY AND A RECREATIONAL MAN-MADE SWIMMING LAGOON THAT PROVIDES COOLING TO SUCH FACILITY, THE SYSTEM BEING CONFIGURED FOR CONTRIBUTING TO ENVIRONMENTAL SUSTAINABILITY AND COMMUNITY BENEFITS

#2
20250335012
2025-10-30

EDGE DATA CENTER WITH INTEGRATED GEOTHERMAL COOLING

#3
20250318080
2025-10-09

DIRECT LIQUID CONTACT ELECTRONICS COOLING SYSTEM WITH MULTIMODE FUNCTIONALITY

#4
20250280508
2025-09-04

COOLING SYSTEM

#5
20250280507
2025-09-04

COOLING SYSTEM

#6
20240332865
2024-10-03

COOLING DEVICE

#7
20240130074
2024-04-18

Immersive Cooling Unit for Cooling Electronic Components and Method of Using the Same

#8
20230232574
2023-07-20

Pumpless liquid-cooling heat dissipator

#9
20230213216
2023-07-06

HEAT EXCHANGER, ELECTRIC CONTROL BOX AND AIR CONDITIONING SYSTEM

#10
20230041910
2023-02-09

Cooling system of electronic systems, in particular for data centre

#11
20220386512
2022-12-01

Electronic device and heat dissipation assembly

#12
20220322577
2022-10-06

Rack system for housing at least one immersion case

#13
20220322572
2022-10-06

Data center rack system with integrated liquid and dielectric immersion cooling

#14
20220322561
2022-10-06

Rack system for housing an electronic device

#15
20220315399
2022-10-06

Method and extraction system for extracting an electronic device from an immersive cooling container

#16
20220151098
2022-05-12

COOLING DEVICES FOR COOLING ELECTRONIC COMPONENTS WITH LIQUID COOLING COMPONENTS

#17
20220142001
2022-05-05

Loop thermosyphon devices and systems, and related methods

#18
20210212238
2021-07-08

SERVER HEAT DISSIPATION STRUCTURE

#19
20210084795
2021-03-18

FLUID COOLED HEATSINK WITH FLOW CONTROL FOILS

#20
20200329586
2020-10-15

Cooling system in electronics cabinet comprising thermally coupled cooling circuits

#21
20200267872
2020-08-20

Cooling device, cooling system, and method of cooling

#22
20200214169
2020-07-02

Electronic device and housing unit for electronic device

#23
20200194339
2020-06-18

Self-contained liquid cooled semiconductor packaging

#24
20190281728
2019-09-12

Thermal control system

#25
20190230826
2019-07-25

Device for cooling a power electronics circuit

#26
20180343770
2018-11-29

Device comprising heat producing components with liquid submersion cooling

#27
20180288906
2018-10-04

AN IMMERSION COOLING SYSTEM

#28
20180275293
2018-09-27

Systems and methods for energy window adjustment

#29
20180270987
2018-09-20

Natural convection cooling for power electronics systems having discrete power dissipation components

#30
20180220554
2018-08-02

Self-priming thermosyphon

#31
20180059270
2018-03-01

Temperature stabilization for detector heads

#32
20170311487
2017-10-26

Fan controlled ambient air cooling of equipment in a controlled airflow environment

#33
20170127540
2017-05-04

Power conversion device

#34
20170112021
2017-04-20

Arrangement for cooling components of a subsea electric system

#35
20170055377
2017-02-23

Thermosiphon systems for electronic devices

#36
20160270257
2016-09-15

Actively cooled electrical connection

#37
20160257433
2016-09-08

Pressurized payload compartment and mission agnostic space vehicle including the same

#38
20160234967
2016-08-11

Heat management and removal assemblies for semiconductor devices

#39
20160198591
2016-07-07

Passive aircraft cooling systems and methods

#40
20160088767
2016-03-24

Subsea unit with conduction and convection cooling

#41
20150181763
2015-06-25

Electronics chassis and method of fabricating the same

#42
20150173255
2015-06-18

SYSTEM AND METHOD FOR PROVIDING CERTIFIABLE ELECTROMAGNETIC PULSE AND RFI PROTECTION THROUGH MASS-PRODUCED SHIELDED CONTAINERS AND ROOMS

#43
20140268548
2014-09-18

Thermosiphon systems for electronic devices

#44
20130091881
2013-04-18

Cooling system and method for controlling cooling system

#45
20120268877
2012-10-25

Thermosiphon systems for electronic devices

#46
20120111553
2012-05-10

Heat spreading device and method with sectioning forming multiple chambers

#47
20110132016
2011-06-09

EQUIPMENT COOLING

#48
20110127027
2011-06-02

COOLING METHOD AND COOLING SYSTEM OF ELECTRONIC DEVICE

#49
20100073863
2010-03-25

Electronic apparatus

#50
20070105445
2007-05-10

System and method for providing certifiable electromagnetic pulse and RFI protection through mass-produced shielded containers and rooms

#51
20070074853
2007-04-05

Cooling systems incorporating heat transfer meshes

#52
20060140630
2006-06-29

Communication systems incorporating control meshes

#53
20060137856
2006-06-29

Cooling systems incorporating heat transfer meshes

#54
17109472
2023-02-07

Dynamic regulation of two-phase thermal management systems for servers

#55
16704778
2022-01-11

Carbon nanotube heat pipe or thermosiphon

#56
16154710
2020-02-11

Flexible gasket seal for direct liquid cooling of electronic devices

#57
15150766
2018-07-03

Geo-thermal inverter cooling system