234146 ⎘
Constructional details common to different types of electric apparatus; Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Sub-classes:ELECTRONIC DEVICE
#2PERSONAL COMPUTER HAVING PASSIVE COOLING, A PASSIVE COOLER, AND METHODS FOR PROVIDING THE SAME
#3HEAT DISSIPATION MODULE AND FAN ASSEMBLY
#4COOLING MODULE
#5Heat Dissipation System and Electronic Device
#6MONITORING DEVICE
#7SOLID-STATE RELAY WITH TEMPERATURE CONTROL FUNCTION AND TEMPERATURE CONTROL METHOD THEREOF
#8LIQUID-COOLING HEAT-DISSIPATION PLATE HAVING SPARSELY ARRANGED PIN-FINS AND DENSELY ARRANGED PIN-FINS
#9HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME
#10ELECTRONIC APPARATUS
#11SELECTIVE HEAT MANAGEMENT IN SEALED CHASSIS
#12PROCESSOR INTEGRATED MODULE, SERVER, AND ASSEMBLY METHOD FOR PROCESSOR INTEGRATED MODULE
#13ELECTRONIC DEVICE AND METHOD FOR ASSEMBLING ELECTRONIC DEVICE
#14COMPUTER CHASSIS STRUCTURE AND COMPUTER HOST
#15RADIATIVE HEATSINK
#16Heat sink
#17CONNECTOR HAVING COOLING MODULE
#18Enclosed Liquid Cooling System
#19PIEZOELECTRIC FLUTTER COOLING SYSTEM
#20HEAT SINK UNIT, HEAT SINK ASSEMBLY AND ELECTRONIC DEVICE
#21Amplifier Case Connector with Liquid Ingress Seal
#22CONNECTOR
#23SYSTEMS AND METHODS FOR TWO-PHASE COOLING OF ELECTRONIC COMPONENTS
#24LOUDSPEAKER APPARATUS
#25Circuit Breaker
#26HEAT SINK
#27ELECTRONIC ASSEMBLY
#28ELECTRONIC ASSEMBLY
#29CONTROL APPARATUS FOR VEHICLE
#30CONNECTOR ASSEMBLY
#31APPARATUS USING LINKAGE FOR COUPLING A HEATSINK TO A CAGE
#32COOLING STRUCTURE OF LIDAR, LIDAR, AND VEHICLE
#33HEAT SINK, THERMAL MODULE AND ELECTRONIC DEVICE
#34COMPUTING SYSTEM ARCHITECTURE
#35CLOSED INTEGRATED HEAT-DISSIPATION ASSEMBLY STRUCTURE AND LIQUID COOLING MODULE THEREOF
#36IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS
#37IMAGING DEVICE
#38CIRCUIT BREAKER FOR ELECTRICAL DEVICE AND ELECTRICAL SYSTEM
#39Heat Dissipation Assembly, Connector Assembly and Shielding Shell
#40THERMAL-MECHANICAL FRAMEWORK FOR SOLID-STATE CIRCUIT BREAKERS
#41PLUG-IN CONNECTOR PART
#42COOLING DEVICE
#43ELECTRIC COMPONENT BOX
#44MULTI-DIRECTIONAL HEATSINK COOLING SYSTEM
#45HYBRID COOLING SYSTEM AND ELECTROMAGNETIC INTERFERENCE SHIELD
#46HEAT-DISSIPATION DEVICE, HEAT-DISSIPATION MODULE AND ANTENNA APPARATUS INCLUDING SAME
#47HEAT DISSIPATION STRUCTURE FOR HIGH-CAPACITY CIRCUIT BREAKER
#48A MOUNTABLE MOBILE EDGE COMPUTING (MEC) SERVER AND METHOD FOR MOBILE EDGE COMPUTING
#49FLUID DISTRIBUTION UNIT FOR TWO-PHASE COOLING SYSTEM
#50ELECTRIC VEHICLE CHARGING ADAPTOR WITH FORCED-AIR COOLING
#51LIQUID COOLING PLATE FOR COMPUTING SERVER, COMPUTING LIQUID COOLING UNIT, COMPUTING SERVER, AND DATA CENTER
#52LIQUID COOLING APPARATUS AND ELECTRONIC DEVICE
#53HEAT SINK, HEAT SINK MANUFACTURING METHOD, AND COMPUTER
#54MAGNETIC THERMOELECTRIC COOLING ASSEMBLY AND MAGNETIC WIRELESS CHARGER WITH COOLING FUNCTIONALITY
#55CONNECTOR
#56Electrical Assembly Configured to Install Electronic Devices and a Liquid-Cooled Electronic System
#57HEAT SINK ASSEMBLY WITH SPRING-ADJUSTABLE HEAT PIPE FOR IMPROVED HEAT DISSIPATION, AND RELATED CIRCUIT BOARD ASSEMBLIES AND ASSEMBLY METHODS
#58LIQUID-COOLING DEVICES, AND SYSTEMS, TO COOL MULTI-CHIP MODULES
#59ELECTRONIC DEVICE INCLUDING POROUS HEAT DISSIPATION STRUCTURE
#60VAPOR CHAMBER HAVING A RESERVOIR
#61Heat Dissipation Apparatus, Electronic Device, and Vehicle
#62HEAT RADIATION BODY AND BOX-SHAPED BODY
#63ASSEMBLY FOR POWER MODULES AND MOUNTING METHOD FOR THE ASSEMBLY FOR POWER MODULES
#64HEAT SINKS FOR CAGE RECEPTABLE ASSEMBLY
#65DIRECT LIQUID CONTACT ELECTRONICS COOLING SYSTEM WITH MULTIMODE FUNCTIONALITY
#66ARRANGEMENT WITH A HOLDER AND A HOUSING FOR AN ELECTRONIC ASSEMBLY, IN PARTICULAR FOR A RADAR SENSOR, ASSEMBLY WITH SUCH AN ARRANGEMENT, AND METHOD FOR PRODUCING SUCH AN ARRANGEMENT
#67APPARATUSES AND METHODS FOR LIQUID COOLING A VEHICLE SUSPENSION COMPONENT AND WHEEL CONTROLLER
#68POWER CONVERSION APPARATUS, PHOTOVOLTAIC SYSTEM, AND HEAT SINK
#69FOAM HEAT SINKS USED IN IMMERSION COOLING SYSTEMS
#70Charging Device and Charging System
#71PASSIVE COOLING APPARATUS FOR COOLING OF IMMERSION FLUID AND POWER CONVERSION EQUIPMENT AND RELATED SYSTEMS
#72SPEAKER APPARATUS
#73LIQUID COOLED POWER AMPLIFIER WITH INTERNAL FLUID CHANNELIZATION
#74HYBRID CONDUCTOR-VAPOR CHAMBER HEAT SINK FOR HIGH POWER THIN ENVELOPE APPLICATIONS
#75MAGNETIC APPARATUS AND CHARGING DEVICE
#76HEAT DISSIPATING DEVICE
#77NETWORK INTERFACE DEVICE HAVING HEAT DISSIPATING MEMBERS
#78RADIATIVE HEAT DISSIPATION CASING
#79CAGE DESIGN FOR VERTICAL LINE CARD
#80LIQUID-COOLING SERVER SYSTEM
#81ELECTRONIC DEVICE
#82WORKING ASSEMBLY AND ELECTRONIC DEVICE
#83WORKING ASSEMBLY AND ELECTRONIC DEVICE
#84Active Cooling of Busbars Using Compressed Air
#85SPEAKER-INDUCED AIRFLOW FOR ACTIVE DEVICE COOLING
#86APPARATUS INCLUDING THERMAL MANAGEMENT MECHANISM AND METHODS OF MANUFACTURING THE SAME
#87DISTRIBUTED IMPINGEMENT AND RECOVERY MANIFOLD (DIRM) COLD PLATE
#88COOLING SYSTEM
#89WIRE SPRING SENSOR CLOSURE
#90Optical Transceiver Module and Communication Device
#91HEAT DISSIPATION DEVICE AND BASE STATION EQUIPMENT
#92SIGNAL TRANSMISSION DEVICE AND QUANTUM COMPUTER SYSTEM FOR QUANTUM BIT
#93SERVER AND HEAT DISSIPATION MODULE
#94HEAT SINK, ELECTRONIC DEVICE, AND CIRCUIT BOARD
#95HEAT DISSIPATION APPARATUS AND COMPUTING DEVICE
#96IMMERSION-TYPE HEAT DISSIPATING DEVICE
#97HEAT DISSIPATION MODULE AND PROJECTION DEVICE
#98METHOD AND APPARATUS FOR A SILENT BLOWER IN AN INFORMATION HANDLING SYSTEM
#99Heating Element Cooling Device
#100Mounting System For Mounting An Element To An Aircraft Surface
#101HEAT PIPE FOR IMPROVED THERMAL PERFORMANCE AT COLD PLATE INTERFACE
#102SOCKET ASSEMBLY AND ELECTRICAL CONNECTOR COMPRISING THE SAME
#103ELECTRONIC DEVICE
#104Cooling System Assembly
#105ELECTRICAL CONNECTOR SYSTEM AND ELECTRIC VEHICLE
#106RECESSED HEAT SINK WITH A DISCERNIBLE COMPONENT AS PART OF A DEVICE ENCLOSURE
#107AUDIO AMPLIFIER AND METHOD FOR COOLING AN AUDIO AMPLIFIER
#108HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE
#109Methods Of Cooling A Vertical Line Card
#110DATE CENTER LOCAL COOLING SYSTEM WITH PRE-COOLING CHILLER
#111COOLING MODULE
#112COMMUNICATION SYSTEMS HAVING PLUGGABLE OPTICAL MODULES
#113POTTING BOAT HEAT SINK
#114SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES
#115CONNECTING ASSEMBLY AND ELECTRONIC APPARATUS THEREWITH
#116Enhanced optical module cooling with angled fins
#117ELECTRONIC DEVICE
#118VEHICULAR ECU WITH MULTI-CHANNEL COOLING SYSTEM
#119LIQUID-COOLING HEAT SINK WITH TURBULENCE STRUCTURE
#120HEAT DISSIPATION DEVICE
#121DEVICE FOR COOLING AN ELECTRICAL EQUIPMENT ITEM, CORRESPONDING SYSTEM AND AIRCRAFT COMPRISING AT LEAST ONE SUCH SYSTEM
#122HOUSING FOR A CIRCUIT BOARD AND ELECTRIC CIRCUIT ARRANGEMENT
#123Vapor Chamber
#124SYSTEMS AND METHODS FOR INTEGRATED DOUBLE SIDE COOLING OF A POWER MODULE OF AN INVERTER
#125HIGHLY THERMALLY CONDUCTIVE HYBRID THERMAL INTERFACE MATERIAL
#126HIGH-CAPACITY MEMORY AIR COOLING DEVICE
#127THERMAL BRIDGE FOR THERMALLY CONDUCTIVE TRANSPORT OF HEAT
#128LIDAR HEAT DISSIPATION STRUCTURE AND LIDAR
#129CHASSIS, ELECTRONIC APPARATUS AND CHASSIS EXHAUST METHOD
#130BATTERY MODULE ASSEMBLY
#131ELECTRICAL SYSTEM WITH COOLING BY HEAT-TRANSFER FLUID
#132PASSIVE THERMAL-CONTROL STRUCTURE FOR SPEAKERS AND ASSOCIATED APPARATUSES AND METHODS
#133HEAT CONDUCTOR ASSEMBLY
#134ELECTRONIC DEVICE
#135DIRECTING COOLANT TO FLOW TOWARD HEAT SINKS OF ELECTRIC COMPONENTS IN IMMERSION COOLING SYSTEMS
#136POWER-SUPPLY BOX FOR VEHICLE
#137THERMAL PAD, HEAT DISSIPATION MODULE, AND ELECTRONIC DEVICE
#138VARIABLE PIN HEAT SINK
#139LIQUID COOLED MULTI-CHIP COLD PLATES
#140CONTROLLER WITH COOLING
#141ELECTRONIC DEVICE
#142ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS
#143CORRUGATED THERMAL INTERFACE DEVICE WITH LATERAL SPRING FINGERS
#144COOLING DEVICE, LIGHT SOURCE DEVICE, AND IMAGE PROJECTION APPARATUS
#145Heatsink and device with integrated heatsink
#146COOLING DEVICE
#147IMPROVEMENTS TO FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELECTRONIC SYSTEMS
#148THERMAL MANAGEMENT SOLUTION FOR POWER STAGE COMPRISING TOP-COOLED POWER SEMICONDUCTOR SWITCHING DEVICES
#149Method for Manufacturing Heat Dissipation Structure of Electronic Element, Heat Dissipation Structure, and Electronic Device
#150HEAT DISSIPATION DEVICE, ELECTRONIC DEVICE, AND ELECTRICITY-CONSUMPTION DEVICE
#151COOLING DEVICE
#152Outdoor networking equipment enclosure utilizing internal open frame power supply for optimum thermal management and cable minimization
#153COMPOSITE HEAT DISSIPATION DEVICE
#154MEMORY SUB-SYSTEM ENCLOSURE
#155HEATSINK STRUCTURE AND HEATSINK SYSTEM COMPRISING A PLURALITY OF HEATSINK STRUCTURES
#156HEATSINK CHASSIS WITH AEROFOIL
#157Enhanced thermal management in electrical boxes
#158COOLING SYSTEM AND PROJECTION DEVICE
#159ELECTRONIC CONTROL DEVICE
#160ELECTRONIC DEVICE
#161In-Vehicle Control Device and Manufacturing Method
#162CONNECTOR ASSEMBLY WITH IMPROVED HEAT DISSIPATION EFFECT
#163CONNECTOR ASSEMBLY WITH IMPROVED HEAT DISSIPATION EFFECT
#164CIRCUIT ASSEMBLY
#165Two-phase immersion-type composite heat dissipation device
#166ELECTRONIC DEVICE
#167PHOTOELECTRIC SIGNAL CONVERSION DEVICE
#168ELECTRIC POWER CONVERSION UNIT
#169METHOD AND APPARATUS FOR A MOBILE INFORMATION HANDLING SYSTEM WITH AN ION DRAG SERIES ARRAY ENHANCED CONVECTION AIRFLOW
#170Transceiver handle heat dissipation airflow channeling system
#171METHOD AND APPARATUS FOR A MOBILE INFORMATION HANDLING SYSTEM WITH AN ION DRAG ENHANCED CONVECTION AIRFLOW
#172METHOD AND APPARATUS FOR A SILENT BLOWER IN AN INFORMATION HANDLING SYSTEM
#173VEHICULAR CONTROL SYSTEM WITH FAN AND SHROUD FOR ENHANCED COOLING AT ECU
#174CHARGE PORT COOLING SYSTEM FOR AN ELECTRIC VEHICLE
#175Liquid-cooling heat dissipation plate with unequal height pin-fins and enclosed liquid-cooling cooler having the same
#176WIRELESS CHARGING APPARATUS AND ELECTRIC VEHICLE HAVING THE SAME
#177POWER CONVERSION SYSTEM
#178HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE
#179LIQUID-COOLING DEVICES, AND SYSTEMS, TO COOL MULTI-CHIP MODULES
#180Thermal management device for circuit breakers
#181COOLING DEVICE OF ELECTRONIC EQUIPMENT
#182COOLING STRUCTURE FOR DMS MODULE
#183ENDOSCOPE
#184HEAT EXCHANGE ENHANCED MODULE SHELL
#185HEAT TRANSFER DEVICES FOR ENHANCED THERMAL PERFORMANCE OF ELECTRONIC SYSTEMS
#186REDUNDANT HEAT SINK MODULE
#187Heat dissipation device of electronic equipment
#188Self-cooling chassis for a communications device
#189COOLING DEVICE FOR ELECTRONIC EQUIPMENT
#190COOLING DEVICE FOR ELECTRONIC EQUIPMENT
#191HEAT-DISSIPATING WATERPROOF STRUCTURE
#192LIQUID-COOLING HEAT-DISSIPATING MODULE WITH EMBEDDED THREE-DIMENSIONAL VAPOR CHAMBER DEVICE
#193METHOD AND APPARATUS FOR A MOBILE INFORMATION HANDLING SYSTEM WITH AN ION DRAG BLOWER INTEGRATED WITH A FAN FOR ENHANCED CONVECTION AIRFLOW
#194PORTABLE ELECTRONIC DEVICE
#195HEAT DISSIPATION DEVICE FOR VEHICLE PROJECTORS
#196Method and apparatus for a mobile information handling system with an ion drag series array enhanced convection airflow
#197Method and apparatus for a mobile information handling system with an ion drag enhanced convection airflow
#198Method and apparatus for a silent blower in an information handling system
#199VEHICULAR CONTROL SYSTEM WITH FAN AND SHROUD FOR ENHANCED COOLING AT ECU
#200CHARGE PORT COOLING SYSTEM FOR AN ELECTRIC VEHICLE
#201Methods and apparatus for cooling a substrate support
#202Method and apparatus for a rotating ion emitter
#203Method and apparatus for venturi nozzle heat exhaust for an information handling system
#204METHOD AND APPARATUS FOR AN ENCLOSED IONIC THERMAL MODULE
#205Thermal management system including an overmolded layer and a conductive layer over a circuit board
#206Underwater data center
#207COOLING SYSTEM AND METHOD OF MANUFACTURING A COOLING SYSTEM
#208Memory device and electronic device including the same
#209HEAT-DISSIPATING HEAD UP DISPLAY
#210Circuit board assembly and electronic device
#211SENSOR TEMPERATURE REDUCER FOR A SENSOR SHIFT CAMERA ARCHITECTURE
#212POWER SUPPLY DEVICE WITH A HEAT GENERATING COMPONENT
#213Passive Heat Dissipation Power Supply for IT Equipment
#214CONTROL DEVICE
#215ANTENNA APPARATUS
#216High-capacity memory air cooling device
#217Heat sink for a solid-state circuit breakerin an electrical panel
#218CAGE ASSEMBLIES FOR HIGH-SPEED DATA CONNECTORS
#219INTEGRATED BRACKET FOR ENHANCED HEAT DISSIPATION
#220DATA AGGREGATION AND COMPUTE MODULE
#221Systems and methods for an electronic device
#222SERVER
#223HEAT-DISSIPATING NET STRUCTURE
#224IMMERSION COOLING UNIT AND ELECTRONIC APPARATUS
#225TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION STRUCTURE HAVING SKIVED FINS
#226Portable information handling system antenna system
#227Enhanced thermal management in electrical boxes using passive cooling
#228Enhanced thermal management in electrical boxes
#229MULTI-DIE PANEL-LEVEL HIGH PERFORMANCE COMPUTING COMPONENTS
#230Corrugated thermal interface device with lateral spring fingers
#231Systems for dissipating heat from vehicle-based devices having electronic circuitry
#232LIQUID COOLING HEAT DISSIPATION SYSTEM
#233LIGHT SOURCE DEVICE AND DISPLAY APPARATUS
#234Mini-channel cold plate with three-dimensional adaptive flow-path using bi-metal fins
#235COOLING MODULE AND ELECTRONIC APPARATUS
#236Adaptable sunshield for fan-less electronic component
#237POWER CONVERSION DEVICE
#2385G OUTDOOR UNIT HAVING HEAT DISSIPATION FUNCTION
#239HEAT SINK AND ELECTRONIC DEVICE HAVING THE HEAT SINK
#240Metallic thermal interface materials and associated devices, systems, and methods
#241Connector assembly with movable heat sink
#242HEAT DISSIPATION SUBSTRATE
#243HIGH-POWER THERMOELECTRIC CHILLER FOR COMPUTING MACHINES
#244POWER SUPPLY DEVICE
#245Integrator for protective relay
#246Apparatus including thermal management mechanism and methods of manufacturing the same
#247COOLING SYSTEM FOR THE LIQUID IMMERSION COOLING OF ELECTRONIC COMPONENTS
#248COOLING APPARATUS, CIRCULATION-TYPE COOLING SYSTEM, AND ELECTRONIC INSTRUMENT
#249ELECTRONIC DEVICE
#250Circuit Board Arrangement
#251HEAT RECOVERY FROM MULTIPLE LAYERS OF COMPUTER COMPONENTS
#252Cooling for power distribution systems
#253PRIMARY COOLING LOOP CONTROL TO ADDRESS FLUCTUATION DEMANDS ON SECONDARY COOLING LOOPS FOR DATACENTER COOLING SYSTEMS
#254HEAT SINK WITH BULK HEAT ISOLATION
#255HEATSINK WITH ADJUSTABLE FIN PITCH
#256HEAT SINK AND COMMUNICATION DEVICE
#257Systems and methods for heat dissipation in computing systems with environment resistance
#258AIR COOLING, LATENT HEAT COOLING, AND POWER SUPPLY COOLING
#259Communication systems having pluggable optical modules
#260Graphics card and computer host
#261HEAT DISSIPATION DEVICE
#262COOLING MEMBER
#263WATER JACKET
#264ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION MEMBER
#265Thermoconductive structure of socket connector
#266Power Module and Manufacturing Method Thereof, Power Converter, and Power Supply Device
#267Multi-dimensional column-based heat dissipation features for datacenter cooling systems
#268Server packaging for immersion cooling with local acceleration
#269Housing structure
#270Electronic control device
#271LIQUID-COOLING HEAT-DISSIPATION STRUCTURE
#272HEAT SINK BASE AND HEAT SINK
#273ELECTRONIC DEVICE
#274Photosensitive assembly, camera module and electronic device
#275Immersion-type liquid cooling heat dissipation sink
#276Induced air convection cooling for computing or networking devices
#277Combination heat sink
#278THERMAL MANAGEMENT DEVICES
#279TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION SUBSTRATE STRUCTURE
#280Electronic device
#281HEAT SINK FOR OPTICAL MODULE
#282Sealed communications module with multi-path thermal management system
#283HEAT PIPE WITH LOCALIZED HEATSINK
#284CONTROL UNIT FOR A VEHICLE WITH AT LEAST ONE ELECTRIC MOTOR AND A TRANSMISSION
#285Semiconductor storage device
#286Immersion cooling system in miniaturized form
#287Charger, charging device, energy supply device and control method of charger
#288Heating or cooling apparatus-integrated heat sink for a computing device
#289ELECTRONIC CONTROL DEVICE
#290Microchannel heat sink for datacenter solid state drives
#291LIQUID SUBMERSION COOLED ELECTRONIC DEVICE WITH CLAMSHELL ENCLOSURE
#292System and method for a 5G cooling module that directs heat into a thermal loop associated with a processing device
#293HEAT DISSIPATION CABINET AND COMMUNICATIONS DEVICE
#294RADIATIVE HEATSINK
#295HEAT DISSIPATION DEVICE AND HEAT DISSIPATION DEVICE ASSEMBLING METHOD
#296STRUCTURE OF UNIFORM-TEMPERATURE HEAT DISSIPATION DEVICE
#297Electronic apparatus
#298Electronic apparatus
#299HYBRID SYSTEM FOR SERVERS
#300SYSTEMS AND METHODS FOR TWO-PHASE COOLING OF ELECTRONIC COMPONENTS