234158 ⎘
Constructional details common to different types of electric apparatus; Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
MOTHERBOARD STRUCTURE AND ELECTRONIC DEVICE
#2ELECTRICAL CONNECTION UNIT
#3CONTROL APPARATUS FOR VEHICLE
#4HEAT EXCHANGE SYSTEM AND ELECTRONIC DEVICE
#5ELECTRICAL CONNECTION UNIT
#6ELECTRONIC DEVICE WITH DEFORMABLE INTERNAL STRUCTURE
#7Heat Management System Comprising Diamond Particles
#8ELECTRONIC DEVICE INCLUDING POROUS HEAT DISSIPATION STRUCTURE
#9METHOD OF STARTING SERVER AT LOW TEMPERATURE AND SERVER THEREOF
#10COMPUTATIONAL HEAT DISSIPATION STRUCTURE, COMPUTING DEVICE COMPRISING SAME, MINE
#11Thermally Conductive Device
#12IMMERSION-TYPE HEAT DISSIPATING DEVICE
#13ELECTRONIC CONTROL UNIT
#14ELECTRONIC CONTROL UNIT
#15Information handling system hybrid heat block keyboard
#16COMPUTATIONAL HEAT DISSIPATION STRUCTURE, COMPUTING DEVICE COMPRISING SAME, MINE
#17IMPINGEMENT COOLING PROVIDING ENHANCED LOCALIZED COOLING OF A HEATSINK
#18Passive Thermal Transport Network for Power Supply
#19COOLING MODULE FOR PROVIDING ENHANCED LOCALIZED COOLING OF A HEATSINK
#20HEAT DISSIPATION MODULE
#21HEAT SINK BASE AND HEAT SINK
#22Combination heat sink
#23Computational heat dissipation structure, computing device comprising same, mine
#24TWO-PHASE IMMERSION TYPE HEAT DISSIPATION SUBSTRATE
#25Split enclosure for fan-less cooling
#26Heater with mounting pads for mechanical, thermal, and opto-mechanical functionality
#27REFRIGERANT COOLED HEAT SINK FOR POWER ELECTRONIC MODULES
#28Computational heat dissipation structure, computing device comprising same, mine
#29High Efficiency Thermal Management Devices For Use With Electronic Components Having High Heat Flux Values
#30THERMAL MANAGEMENT SYSTEMS FOR ELECTRONIC DEVICES AND RELATED METHODS
#31Fluid cooling system
#32Electronic control of a compressor, compressor and cooling equipment
#33Composite pin fin heat sink with improved heat dissipation performance
#34Modular thermoelectric-based cooling device for heterogeneous packages
#35Case assembly and electronic device
#36Fluid cooling system
#37Multi-zone heat sink for printed circuit boards
#38Electrical connector assembly having floating heat sink in resilient manner
#39Heat radiation structure
#40Hot spot cooling for data storage system
#41Heat dissipation structure for electronic device and electronic device
#42Cold plate with flex regions between fin areas
#43Mechanically flexible cold plates for low power components
#44Computational heat dissipation structure, computing device comprising same, mine
#45Vehicular sensing device with cooling feature
#46Crossflow heat-exchangers
#47Cooling electronic devices in a data center
#48Heat dissipation structure for electronic device and electronic device
#49Jet vectoring fluid impingement cooling using pivoting nozzles
#50Forced flow cooling temperature control method, system, and apparatus
#51Speaker apparatus having a heat dissipation structure
#52Thermally Resistive Electronics Case
#53Mechanically flexible cold plates for low power components
#54Techniques for mitigating temperature spikes and dissipating heat
#55First and second shields for thermal isolation
#56Heat sink, preparation method therefor, and communications device
#57Power module with cooling system for electronic cards
#58Dual-mode passive thermal management system and method
#59Vehicle-mounted power distribution board, electrical junction box, and charging/discharging controller
#60Graphene Based Conformal Heat Sink and Method Therefor
#61Current control apparatus and manufacturing method for current control apparatus
#62Heat dissipation case and methods for navigating heat from an electronic device
#63Dissipating heat within housings for electrical components
#64Electronic control unit
#65Dissipating heat during device operation
#66Cooling device and electronic apparatus
#67Dissipating heat during device operation
#68Apparatus and methods using heat pipes for linking electronic assemblies that unequally produce heat
#69Power supply device and components thereof
#70Heat sink for contactor in power distribution assembly
#71Thermal energy guiding systems including anisotropic thermal guiding coatings and methods for fabricating the same
#72Electrical cabinet with improved heat dissipation
#73Electrical junction box
#74Power semiconductor module
#75SYSTEM AND METHOD FOR REGULATING TEMPERATURE OF ELECTRONIC COMPONENT
#76Media content device chassis with internal extension members
#77Electro-rheological micro-channel anisotropic cooled integrated circuits and methods thereof
#78Dissipating heat within housings for electrical components
#79Electrical power circuit assembly
#80HIGH TEMPERATURE ENVIRONMENT CAPABLE MOTOR CONTROLLER
#81Heat radiation device and electronic equipment using the same
#82Media content device chassis with internal extension members
#83Cooling fan control system
#84SEMICONDUCTOR DEVICE
#85Semiconductor device
#86Heat sink, cooling module and coolable electronic board
#87Card-type peripheral apparatus
#88Electronic apparatus
#89Heat dissipation device for communication chassis
#90Insulating aperture in printed circuit boards
#91Cooling system, cold plate and assembly having a cooling system
#92Discharge lamp unit
#93Cooling arrangement for an equipment assembly
#94Semiconductor device
#95Systems and methods for thermal management
#96Electronic device
#97THERMAL ENERGY STORAGE FOR MOBILE COMPUTING THERMAL MANAGEMENT
#98Heat-dissipating device with high heat-dissipating efficiency
#99Energy storage device for starting engines of motor vehicles and other transportation systems
#100Thin, passive cooling system
#101Information processing apparatus
#102Circuit board and arrangement for minimizing thermal and electromagnetic effects
#103Two-compartment AC adaptor
#104Heat receiving sheet, electronic apparatus, and fabrication method for heat receiving sheet
#105Electronic component chassis with isolated power supply cooling
#106Heat dissipating arrangement for an electronic appliance
#107Electronic device with heat-dissipation structure
#108Power conversion device
#109Electronic device
#110Heat sink structure
#111Electronic apparatus
#112Thermocouple arrangement in thermal test vehicles to replicate lidless computing devices
#113Double sided heat exchanger cooling unit
#114Apparatuses, systems, and methods for cooling electronic components
#115Structure for transferring heat in devices
#116Double sided heat exchanger cooling unit
#117Apparatus, system, and method for decreasing heat migration in ganged heatsinks
#118Altering thermal conductivity in devices