236894 ⎘
Climate change mitigation technologies for sector-wide applications Reducing waste in manufacturing processes; Calculations of released waste quantities
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#2ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIATED SYSTEMS AND METHODS
#3Semiconductor structure and manufacturing method thereof
#4Semiconductor structure and manufacturing method thereof
#5Methods and systems for advanced ion control for etching processes
#6Etched trenches in bond materials for die singulation, and associated systems and methods
#7Semiconductor structure and manufacturing method thereof
#8Method of separating a back layer on a singulated semiconductor wafer attached to carrier substrate
#9Semiconductor devices employing a barrier layer
#10Method of making a magnetic core with tooth having overlapping short and long teeth distal ends
#11Methods and systems for packaging an integrated circuit
#12TFT substrate, scanning antenna provided with TFT substrate, and method for producing TFT substrate
#13Machine and process of copper rotor die casting used in AC electric motor
#14Method of separating a back layer on a singulated semiconductor wafer attached to carrier substrates
#15Composite part manufacturing compensation system and method
#16Semiconductor wafer device and manufacturing method thereof
#17Methods and systems for packaging semiconductor devices to improve yield
#18Etched trenches in bond materials for die singulation, and associated systems and methods
#19Internet protocol (IP)-enabled smart transducer
#20Method of singulating semiconductor wafer having a plurality of die and a back layer disposed along a major surface
#21Semiconductor device and method of packaging
#22Bus bar unit and motor
#23Semiconductor device including built-in crack-arresting film structure
#24Semiconductor structure and manufacturing method thereof
#25Semiconductor device and method of forming a 3D interposer system-in-package module
#26Hard mask layer to reduce loss of isolation material during dummy gate removal
#27Methods and systems for advanced ion control for etching processes
#28Methods and systems for advanced ion control for etching processes
#29Method for wafer outgassing control
#30Multi-layer integrated circuits having isolation cells for layer testing and related methods
#31Progressive processing method
#32Motor and stator thereof
#33Bipolar mobile electrostatic carriers for wafer processing
#34Magnetic core with multiple teeth having four different teeth tips axially overlapping
#35Motor and bus bar unit having overlapping bridge portions
#36Metrology using overlay and yield critical patterns
#37Array substrate, manufacturing method thereof and display device
#38Bus bar unit and motor
#39Scheduling process for automated mattress manufacturing
#40Package stucture and method of fabricating the same
#41Composite part manufacturing compensation system and method
#42Checking gauge having integrated features and method of making the same
#43Pickup location monitoring
#44Method for manufacturing semiconductor devices having a metallisation layer
#45Etched trenches in bond materials for die singulation, and associated systems and methods
#46Matching process controllers for improved matching of process
#473D IC testing apparatus
#48Method of controlled crack propagation for material cleavage using electromagnetic forces
#49Semiconductor devices employing a barrier layer
#50Method for producing a semiconductor module
#51Methods of reducing material loss in isolation structures by introducing inert atoms into oxide hard mask layer used in growing channel semiconductor material
#52Permanent magnet rotor and methods thereof
#53PoP structure with electrically insulating material between packages
#54Integrated circuit product yield optimization using the results of performance path testing
#55Method for shaping a laminate substrate
#56Methods and apparatus for package on package devices with reversed stud bump through via interconnections
#57Pickup location monitoring
#58PCB based RF-power package window frame
#59Multi-landing contact etching
#60Etched trenches in bond materials for die singulation, and associated systems and methods
#61Superior integrity of high-k metal gate stacks by preserving a resist material above end caps of gate electrode structures
#62Semiconductor devices and methods of manufacturing and packaging thereof
#63Three-dimensional integrated circuit (3DIC) formation process
#64METHOD FOR MAKING A SEMICONDUCTOR DEVICE BY LASER IRRADIATION
#65Formation of a channel semiconductor alloy by forming a nitride based hard mask layer
#66DICING PROCESS AND DICING APPARATUS
#67WIRELESS POWER COMPONENT SELECTION
#68Surface repair structure and process for interconnect applications
#69Method for controlled layer transfer
#70On-chip interconnects with reduced capacitance and method of afbrication
#713D IC testing apparatus
#72CHEMICAL-MECHANICAL POLISHING TOOL AND METHOD FOR PREHEATING THE SAME
#73Transistor Comprising an Embedded Sigma-Shaped Semiconductor Alloy Having Superior Uniformity
#74Green bike
#75Electrical switch using gated resistor structures and three-dimensional integrated circuits using the same
#76Chemical mechanical polishing method and system
#77Method for manufacturing display device
#78Continuously formed annular laminated article and method for its manufacture
#79Method for manufacturing semiconductor devices having a metallisation layer
#80Replacement Gate Approach for High-K Metal Gate Stacks Based on a Non-Conformal Interlayer Dielectric
#81Method for forming pattern, method for manufacturing light emitting device, and light emitting device
#82Methods and System for Processing a Microelectronic Topography
#83Semiconductor device and fabrication thereof
#84Chipstack package and manufacturing method thereof
#85Adaptive patterning for panelized packaging
#86Smart charging system and related method
#87Semiconductor device with interface circuit and method of configuring semiconductor devices
#88Stator for electric motor
#89Wind energy installation with variable rotation speed characteristic
#90FREQUENCY-CHANGING CONTROL APPARATUS
#91Method and apparatus for controlling noise levels of a turbine with minimal loss in energy yield
#92Method for pulling a silicon single crystal
#93ELECTRONIC DEVICE WITH SELF-ALIGNED ELECTRODES FABRICATED USING ADDITIVE LIQUID DEPOSITION
#94Methods and apparatus for a continuous wound laminate rotor flux path
#95Integrated circuit communication system with differential signal and method of manufacture thereof
#96Axial gap motor
#97Method for manufacturing semiconductor device and method for manufacturing display device
#98SEMICONDUCTOR DEVICE
#99METHOD OF MANUFACTURING AN ASSEMBLY AND ASSEMBLY
#100Method and apparatus for controlling the tip speed of a blade of a wind turbine
#101METHOD FOR PRODUCING SOLID PHASE SHEET AND PHOTOVALTAIC CELL EMPLOYING SOLID PHASE SHEET
#102Reduced wafer warpage in semiconductors by stress engineering in the metallization system
#103Semiconductor device, electronic device, and method of manufacturing semiconductor device
#104Semiconductor device with interface circuit and method of configuring semiconductor devices
#105Dimension profiling of SiC devices
#106SURFACE REPAIR STRUCTURE AND PROCESS FOR INTERCONNECT APPLICATIONS
#107METHOD OF PRODUCING SEMICONDUCTOR DEVICES
#108METHOD OF PRODUCING SEMICONDUCTOR WAFER
#109Reducing contamination of semiconductor substrates during BEOL processing by performing a deposition/etch cycle during barrier deposition
#110METHOD FOR PRODUCING SEMICONDUCTOR WAFER
#111REDUCTION OF METAL SILICIDE DIFFUSION IN A SEMICONDUCTOR DEVICE BY PROTECTING SIDEWALLS OF AN ACTIVE REGION
#112Electronic device and semiconductor device and method for manufacturing the same
#113Technique for reducing topography-related irregularities during the patterning of a dielectric material in a contact level of closely spaced transistors
#114Package in package system incorporating an internal stiffener component
#115Etch stop layer of reduced thickness for patterning a dielectric material in a contact level of closely spaced transistors
#116Chipstack package and manufacturing method thereof
#117Integrated Circuit, Semiconductor Module and Method for Manufacturing a Semiconductor Module
#118Forming robust solder interconnect structures by reducing effects of seed layer underetching
#119Printed TFT array
#120High speed electrical interconnects and method of manufacturing thereof
#121High speed electronics interconnect having a dielectric system with air holes of varying diameters and spans
#122High speed interconnect and method of manufacture
#123High speed interconnection system having a dielectric system with polygonal arrays of holes therein
#124Interconnection system with a dielectric system having holes therein that run uninterrupted through the dielectric system
#125Interconnection system with a dielectric system having holes therein that run uninterrupted through the dielectric system
#126Fuse cell and method for programming the same
#127HERMETICALLY SEALED PACKAGE WITH WINDOW
#128Method for forming pattern, method for manufacturing light emitting device, and light emitting device
#129Integrated circuit having multilayer electrode
#130Radio frequency identification (RFID) tag lamination process using liner
#131Microelectronic die including locking bump and method of making same
#132In situ monitoring of wafer charge distribution in plasma processing
#133Semiconductor device and fabrication thereof
#134STACKED POLY STRUCTURE TO REDUCE THE POLY PARTICLE COUNT IN ADVANCED CMOS TECHNOLOGY
#135Mitigation of gate to contact capacitance in CMOS flow
#136VACUUM STORAGE BOX
#137Technique for removing resist material after high dose implantation in a semiconductor device
#138Sacrificial CMP etch stop layer
#139Method for manufacturing display device, and etching apparatus
#140Method for reducing resist poisoning during patterning of stressed nitrogen-containing layers in a semiconductor device
#141System and method for haze control in semiconductor processes
#142Method for manufacturing semiconductor device
#143Method for manufacturing semiconductor device and method for manufacturing display device
#144Method for manufacturing display device
#145Method for Manufacturing Transparent Windows in Molded Semiconductor Packages
#146Chip stack package and manufacturing method thereof
#147Method for manufacturing display device
#148Methods for fabricating stiffeners for flexible substrates
#149Allocating manufactured devices according to customer specifications
#150Method for forming large area display wiring by droplet discharge, and method for manufacturing electronic device and semiconductor device
#151HEAT TRANSFER ASSEMBLY
#152Selective consolidation methods for fabricating semiconductor device components and conductive features thereof
#153Semiconductor device with interface circuit and method of configuring semiconductor devices
#154Mobile transportable electrostatic substrate holder
#155Method of forming a chalcogenide material containing device
#156Allocating manufactured devices according to customer specifications
#157Radio frequency identification (RFID) tag lamination process using liner
#158Radio frequency identification (RFID) tag lamination process
#159Method of marketing electrical conductor enclosures using application-specific customized packaging
#160Semiconductor device, electronic device, and method of manufacturing semiconductor device
#161Amorphous carbon contact film for contact hole etch process
#162Method and apparatus for chemical mechanical polishing of semiconductor substrates
#163Methods for fabricating stiffeners for flexible substrates
#164Eliminating systematic process yield loss via precision wafer placement alignment
#165Optical turn system for optoelectronic modules
#166LED fabrication via ion implant isolation
#167Method for manufacturing display device
#168Collars, support structures, and forms for protruding conductive structures
#169Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
#170Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and packaging methods
#171Method and apparatus for chemical mechanical polishing of semiconductor substrates
#172Adhesive sheet stamping device, adhesive sheet stamping method
#173Method of making a heatsink device
#174Automatically adjusting parameters of a lifting device by identifying objects to be lifted
#175Flip-chip type semiconductor devices and conductive elements thereof
#176Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements
#177Carrier substrates and conductive elements thereof
#178Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
#179Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereof
#180Method of forming a chalcogenide material containing device
#181Methods and systems for processing a microelectronic topography
#182Methods and systems for processing a microelectronic topography
#183Process for producing a semiconductor wafer
#184Yield based, in-line defect sampling method
#185Method of manufacturing organic EL device, organic EL device, and electronic apparatus
#186Minimizing the loss of barrier materials during photoresist stripping
#187Semiconductor device for reducing photovolatic current
#188Acoustic detection of mechanically induced circuit damage
#189Method of forming a resist pattern, method of forming a wiring pattern, method of fabricating a semiconductor device, electro-optic device, and electronic apparatus
#190Hermetically sealed micro-device package with window
#191Reduction of core-end losses of dynamoelectric machines by using lower core loss iron silicon punching
#192Chip stack package and manufacturing method thereof
#193Substantially hermetic packages for semiconductor devices and substantially hermetically packaged, semiconductor devices
#194Straight angle conductor and method of manufacturing the same
#195LED fabrication via ion implant isolation
#196Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads
#197Semiconductor structure having thick stabilization layer
#198Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages
#199Selective consolidation processes for electrically connecting contacts of semiconductor device components