Y10S156/916 - CPC Classification Index

ClassID:

238896 ⎘

Y10S156/916 - CPC Classification

Classification description:

Adhesive bonding and miscellaneous chemical manufacture Differential etching apparatus including chamber cleaning means or shield for preventing deposits

Recent Application in this class:

20120125891

2012-05-24

Plasma processing apparatus and plasma processing method

20110024040

2011-02-03

Deposit protection cover and plasma processing apparatus

20080233756

2008-09-25

Particle-removing apparatus for a semiconductor device manufacturing apparatus and method of removing particles

20080210170

2008-09-04

Semiconductor manufacturing equipment and manufacturing method of the same

20080066785

2008-03-20

METHOD OF REFURBISHING A MAGNET ASSEMBLY FOR PLASMA PROCESS CHAMBER

20080041525

2008-02-21

Semiconductor device fabricating system

20070113975

2007-05-24

Plasma reaction chamber assemblies

20070034337

2007-02-15

Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system

20070028839

2007-02-08

Apparatus for an improved deposition shield in a plasma processing system

#10

20060131272

2006-06-22

Particle-removing apparatus for a semiconductor device manufacturing apparatus and method of removing particles

#11

20060014395

2006-01-19

Method of manufacturing displays and apparatus for manufacturing displays

#12

20050279456

2005-12-22

Plasma reactor with high productivity

#13

20050194093

2005-09-08

Plasma processing apparatus

#14

20050193953

2005-09-08

Plasma processing apparatus

#15

20050115678

2005-06-02

Magnet assembly for plasma containment

#16

20050101150

2005-05-12

Plasma reaction chamber liner consisting essentially of osmium

#17

20050039679

2005-02-24

Particulate reduction using temperature-controlled chamber shield