ClassID:

239519

Y10S165/908 - CPC Classification

Classification description:

Heat exchange Fluid jets

Recent Application in this class:
#1
20240278263
2024-08-22

Double-sided fluidic oscillator jet

#2
20210134703
2021-05-06

Thermal management of RF devices using embedded microjet arrays

#3
20170142866
2017-05-18

Rack assembly

#4
20130162958
2013-06-27

Thermal management of very small form factor projectors with synthetic jets

#5
20130031914
2013-02-07

Two stage serial impingement cooling for isogrid structures

#6
20120063085
2012-03-15

Jet impingement heat exchanger apparatuses and power electronics modules

#7
20110141690
2011-06-16

Power electronics substrate for direct substrate cooling

#8
20110075353
2011-03-31

Liquid submersion cooling system

#9
20100328890
2010-12-30

Condenser structures with fin cavities facilitating vapor condensation cooling of coolant

#10
20100328889
2010-12-30

Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling

#11
20100328882
2010-12-30

Direct jet impingement-assisted thermosyphon cooling apparatus and method

#12
20100306994
2010-12-09

Multi-fluid cooling of an electronic device

#13
20100246117
2010-09-30

Variable flow computer cooling system for a data center and method of operation

#14
20100241278
2010-09-23

Variable flow computer cooling system for a data center and method of operation

#15
20100110635
2010-05-06

Thermal management of very small form factor projectors with synthetic jets

#16
20100067191
2010-03-18

Thermal management system for embedded environment and method for making same

#17
20100053894
2010-03-04

System and method for cooling using impinging jet control

#18
20100038051
2010-02-18

Combined thermal protection and surface temperature control system

#19
20090303684
2009-12-10

Systems and methods for cooling an electronic device

#20
20090231813
2009-09-17

Cooling facility for cooling a component

#21
20090218078
2009-09-03

Variable flow computer cooling system for a data center and method of operation

#22
20090095444
2009-04-16

Microjet module assembly

#23
20080314565
2008-12-25

Method and apparatus for chip cooling

#24
20080278913
2008-11-13

COOLING APPARATUS AND COOLED ELECTRONIC MODULE WITH A THERMALLY CONDUCTIVE RETURN MANIFOLD STRUCTURE SEALED TO THE PERIPHERY OF A SURFACE TO BE COOLED

#25
20080271458
2008-11-06

Zero-cross-flow impingement via an array of differing length, extended ports

#26
20080196870
2008-08-21

Liquid submersion cooling system

#27
20080156462
2008-07-03

Unique cooling scheme for advanced thermal management of high flux electronics

#28
20080137289
2008-06-12

THERMAL MANAGEMENT SYSTEM FOR EMBEDDED ENVIRONMENT AND METHOD FOR MAKING SAME

#29
20080104970
2008-05-08

Boil cooling method, boil cooling apparatus, flow channel structure, and applied technology field thereof

#30
20080062639
2008-03-13

Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus

#31
20080060792
2008-03-13

HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSITY ICS AND METHOD FOR MANUFACTURING

#32
20080041574
2008-02-21

Cooling systems employing fluidic jets, methods for their use and methods for cooling

#33
20080037221
2008-02-14

Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus

#34
20070295480
2007-12-27

Multi-fluid cooling system, cooled electronics module, and methods of fabrication thereof

#35
20070284090
2007-12-13

Loop type heat dissipating apparatus with sprayer

#36
20070274045
2007-11-29

Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled

#37
20070268669
2007-11-22

Circuit board assembly for a liquid submersion cooled electronic device

#38
20070267741
2007-11-22

Liquid submersion cooling system

#39
20070076375
2007-04-05

Synthetic jet-based heat dissipation device

#40
20070074849
2007-04-05

Heat sink with multiple coolant inlets

#41
20070030655
2007-02-08

Impingement cooled heat sink with uniformly spaced curved channels

#42
20060266497
2006-11-30

High performance integrated MLC cooling device for high power density ICS and method for manufacturing

#43
20060260784
2006-11-23

Microjet module assembly

#44
20060250774
2006-11-09

Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold

#45
20060175041
2006-08-10

Foil slot impingement cooler with effective light-trap cavities

#46
20060050482
2006-03-09

Apparatus and method for enhanced heat transfer

#47
20050280994
2005-12-22

Apparatus, method, and control program for cooling electronic devices

#48
20050252644
2005-11-17

Heat-exchanging device

#49
20050241804
2005-11-03

Liquid cooling device

#50
20050126754
2005-06-16

Heat exchanger

#51
20050111965
2005-05-26

Turbine shroud asymmetrical cooling elements

#52
20050039883
2005-02-24

High flux heat removal system using liquid ice