ClassID:

239734

Y10S204/07 - CPC Classification

Classification description:

Chemistry: electrical and wave energy Current distribution within the bath

Recent Application in this class:
#1
20120000785
2012-01-05

Device and method to conduct an electrochemical reaction on a surface of a semi-conductor substrate

#2
20110220020
2011-09-15

Apparatus for an enhanced magnetic plating method

#3
20110198229
2011-08-18

ELECTROPLATING APPARATUS BASED ON AN ARRAY OF ANODES

#4
20100116671
2010-05-13

Apparatus and method for electrochemically depositing metal on a semiconductor workpiece

#5
20100032304
2010-02-11

Method of electroplating using a high resistance ionic current source

#6
20090050486
2009-02-26

Enhanced magnetic plating method

#7
20080302667
2008-12-11

Method for airfoil electroplating

#8
20080041726
2008-02-21

Metal plating process

#9
20080000777
2008-01-03

Selective shield/material flow mechanism

#10
20070068819
2007-03-29

Electroplating apparatus and method based on an array of anodes

#11
20060275624
2006-12-07

Method and apparatus for airfoil electroplating, and airfoil

#12
20060151326
2006-07-13

Electrolytic apparatus for use in oxide electrowinning method

#13
20060000716
2006-01-05

Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece

#14
20050245083
2005-11-03

Apparatus and method for electrochemically depositing metal on a semiconductor workpiece

#15
20050224340
2005-10-13

System for electrochemically processing a workpiece

#16
20050218002
2005-10-06

Selective shield/material flow mechanism

#17
20050167265
2005-08-04

System for electrochemically processing a workpiece

#18
20050109633
2005-05-26

System for electrochemically processing a workpiece

#19
20050109629
2005-05-26

System for electrochemically processing a workpiece

#20
20050109628
2005-05-26

System for electrochemically processing a workpiece

#21
20050109625
2005-05-26

System for electrochemically processing a workpiece

#22
20050077183
2005-04-14

Anodic oxidation apparatus

#23
20050056544
2005-03-17

Dual contact ring and method for metal ECP process