ClassID:

242157

Y10S451/921 - CPC Classification

Classification description:

Abrading Pad for lens shaping tool

Recent Application in this class:
#1
20130171916
2013-07-04

Polishing instrument for optical components

#2
20120231713
2012-09-13

Optical quality surfacing tool

#3
20110275295
2011-11-10

Polishing tool for processing optical surfaces

#4
20100159811
2010-06-24

High-rate groove pattern

#5
20100105303
2010-04-29

Polishing pad

#6
20090124179
2009-05-14

Oscillating grinding machine

#7
20080171502
2008-07-17

Tool for surfacing an optical surface

#8
20070224924
2007-09-27

Oscillating grinding machine

#9
20060199481
2006-09-07

Polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular

#10
20060189262
2006-08-24

Shaped polishing pads for beveling microfeature workpiece edges, and associated systems and methods

#11
20060189261
2006-08-24

Shaped polishing pads for beveling microfeature workpiece edges, and associated systems and methods

#12
20060178095
2006-08-10

Polishing media stabilizer

#13
20060154581
2006-07-13

Optical surface-finishing tool

#14
20060154568
2006-07-13

Multilayer polishing pad and method of making

#15
20060094341
2006-05-04

Polishing tool with several pressure zones

#16
20060030242
2006-02-09

Shaped polishing pads for beveling microfeature workpiece edges, and associate system and methods

#17
20060025061
2006-02-02

Polishing pad having grooves configured to promote mixing wakes during polishing

#18
20050282479
2005-12-22

Polishing pad having grooves configured to promote mixing wakes during polishing

#19
20050170757
2005-08-04

Grooved polishing pad and method

#20
20050113011
2005-05-26

Chemical mechanical polishing pad

#21
20050107009
2005-05-19

Polishing pad having slurry utilization enhancing grooves

#22
20050064798
2005-03-24

Methods and compositions for chemical mechanical planarization of ruthenium

#23
20050026552
2005-02-03

Porous polyurethane polishing pads

#24
20050003738
2005-01-06

Edge-sealed pad for CMP process