249762 ⎘
Adhesive bonding and miscellaneous chemical manufacture; Methods of delaminating, ; i.e. , separating at bonding face Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during delamination, etc.]
Sub-classes:PEELING DEVICE AND PEELING METHOD USING THE SAME
#2BINDER COMPOSITION FOR SECONDARY BATTERY
#3Method for composite delamination
#4METHOD FOR COMPOSITE DELAMINATION
#5SEMICONDUCTOR SUBSTRATE CLEANING METHOD, PROCESSED SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD, AND COMPOSITION FOR PEELING
#6Method for composite delamination
#7Use of mixtures of water and essential oil for separating multilayered composites for the segregated recycling of polymer/metal films
#8Manufacturing method of adhesive layer and display device comprising the adhesive layer manufactured thereby
#9Method for manufacturing a display device
#10Peeling device and peeling method using the same
#11Emissive element harvest
#12Carrier plate removing method
#13Method of manufacturing dimming element
#14Manufacturing method of adhesive layer and display device comprising the adhesive layer manufactured thereby
#15Method for peeling pressure-sensitive adhesive sheet
#16Separation/recovery method for laminated film
#17Method of removing carrier plate
#18Removal method of carrier plate
#19Method and apparatus for display screen shield replacement
#20Carrier plate removing method
#21Composition for forming a coating film for removing foreign matters
#22Method for manufacturing substrate and liquid ejection head substrate
#23Method for recovering constituent members from used absorbent article
#24Method and apparatus for recycling packaging material
#25Method of debonding work-carrier pair with thin devices
#26Method and Apparatus for Display Screen Shield Replacement
#27Separating device for bonded cine film and method therefor
#28Method for transferring two-dimensional nanomaterials
#29Separating polymer from composite structures
#30Temporary carrier debond initiation, and associated systems and methods
#31Methods and systems for separating a plurality of directed self-assembled diamagnetic components
#32Floor covering with universal backing and methods of making and recycling
#33Removable adhesive label containing inherently shrinkable polymeric film
#34Method for debonding temporarily adhesive-bonded carrier-workpiece pair by using high pressure solvent
#35Method for debonding temporarily adhesive-bonded carrier-workpiece pair by using chemical and mechanical means
#36Peeling device of sheet material including optimized outlet
#37In-mould labelling process
#38Floor covering with universal backing and methods of making and recycling
#39CONTROLLED-ORIENTATION FILMS AND NANOCOMPOSITES INCLUDING NANOTUBES OR OTHER NANOSTRUCTURES
#40Device and method for at least partly dissolving a connecting layer of a temporarily bonded substrate stack
#41Flexible display motherboard and manufacturing method of flexible display panel
#42DISSOLVABLE THERMAL DIRECT ADHESIVE LABEL AND METHODS OF ASSEMBLY AND USE OF THE SAME
#43De-bonding and cleaning process and system
#44Method for removing screen coating film
#45Disassembly device
#46Adhesive acrylate-olefin copolymers, methods for producing same and compositions utilizing same
#47Floor coverings with universal backing and methods of making, installing, and recycling
#48De-bonding and cleaning process and system
#49Procedure of processing a workpiece and an apparatus designed for the procedure
#50Peeling apparatus and stack manufacturing apparatus
#51Emulsion adhesive for washable film
#52Dissolvable thermal direct adhesive label and methods of assembly and use of the same
#53Method of separating a carrier-workpiece bonded stack
#54Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability
#55Wet glue
#56Floor coverings with universal backing and methods of making, installing, and recycling
#57Method for separating multilayer systems
#58Support for bonding a workpiece and method thereof
#59Cassette fixture for holding film frames with affixed thin substrates during liquid chemical batch removal of carriers
#60De-bonding and cleaning process and system
#61Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability
#62Articles with adhesive separation layer
#63Semiconductor device manufacturing method
#64Method of producing a removable wafer connection and carrier for wafer support
#65Ophthalmic lens that can be edged, comprising a hydrophobic bilayer and a temporary metal fluoride layer
#66Supporting member separation method
#67Hybrid material of crosslinked microgel particles dispersed in an adhesive
#68Methods for operating a debonder
#69Removable adhesive label containing inherently shrinkable polymeric film
#70Removable adhesive label containing polymeric film layer having water affinity
#71Method for detaching a product substrate off a carrier substrate
#72Immersion de-taping
#73Polarizing sheet removing tool and removing method
#74Polarizing sheet removing tool and removing method
#75Peeling apparatus and stack manufacturing apparatus
#76Method for stripping a product substrate from a carrier substrate
#77Device for stripping a product substrate from a carrier substrate
#78Apparatus and method for separating a stacked arrangement
#79Processing method and processing apparatus
#80In-mould labelling process
#81Epitaxial lift off systems and methods
#82System and method for improved epitaxial lift off
#83Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus
#84Wafer separating apparatus and wafer separating method
#85Method and apparatus for display screen shield replacement
#86Labels compatible with recycling
#87Device for detaching a product substrate off a carrier substrate
#88Method of thin printed circuit board wet process consistency on the same carrier
#89System and method for removing the outer layer of a layered article
#90Recyclable circuit assembly
#91Methods and systems for recycling of laminated materials
#92ENCAPSULATION OF EMS DEVICES ON GLASS
#93Adhesive Acrylate-Olefin Copolymers, Methods for Producing Same and Compositions Utilizing Same
#94Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability
#95TEMPORARY DECORATION FOR FABRIC
#96TEMPORARY DECORATION FOR FABRIC
#97Device for detaching a product substrate off a carrier substrate
#98Removable adhesive label containing high tensile modulus polymeric film layer
#99Stripping device and stripping method
#100Mechanical abrasive surface conditioning for wallcovering removal
#101Process for delamination of laminated packaging
#102System and method for improved epitaxial lift off
#103REMOVABLE LABEL WITH A DOUBLE-LAYER ADHESIVE
#104Device and method for detaching a semiconductor wafer from a substrate
#105Lifting-off method and method for manufacturing TFT array substrate
#106Systems, methods and materials for delivery and debonding on demand
#107USE OF PVA STRIPS FOR ATTACHING AN OBJECT TO A DISPLAY BACKER
#108Removable Adhesive Label Containing Polymeric Film Layer Having Water Affinity
#109Removable Adhesive Label Containing Inherently Shrinkable Polymeric Film
#110Device for stripping a wafer from a carrier
#111Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
#112Laser ablation for integrated circuit fabrication
#113Method of forming temporary carrier structure and associated release techniques
#114Stripping device and stripping method
#115Film removing device and film removing method
#116Stripping method and stripping solution
#117Epitaxial lift off systems and methods
#118Semi-automated reworkability process for de-bonding a display
#119Supporting plate, apparatus and method for stripping supporting plate
#120Chip sorting apparatus
#121Sticking method and sticking apparatus
#122Compositions and methods for selective deposition modeling
#123Image forming method and method of recycling image forming material
#124Separating method for dark ceramics sintered body
#125Interlayer film separation method
#126Controlled-orientation films and nanocomposites including nanotubes or other nanostructures
#127HMPSA for removable self-adhesive label
#128Method for manufacturing liquid ejection head
#129Removal method, adhesive agent for substrate, and laminate including substrate
#130Separating device and method thereof
#131Emulsion adhesive for washable film
#132Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
#133Apparatus for manufacturing ultrathin substrate using a laminate body
#134Liquid solvent abutment unit
#135Separating apparatus and separating method
#136Supporting plate peeling apparatus
#137Separating apparatus and separating method
#138Dissolvable thermal direct adhesive label and label assembly including the same
#139Auxiliary fixture for debonding sliders and method for manufacturing sliders using the same
#140THICK FILM RECYCLING METHOD
#141Method for disassembling bonded structure
#142Label for removable attachment to an article
#143Treatment liquid permeation unit and treating apparatus
#144Method of forming temporary carrier structure and associated release techniques
#145Separating device
#146Nanoparticulate preparation
#147Amylolytic enzyme extracted from sp. A 7-7 (DSM 12368) and washing and cleaning agents containing this novel amylolytic enzyme
#148METHOD, SYSTEM, AND APPARATUS FOR DETACHING AND COLLECTING AN IC TAG FROM A PAPER SHEET TO WHICH IT IS ATTACHED
#149METHOD, SYSTEM, AND APPARATUS FOR DETACHING AND COLLECTING AN IC TAG FROM A PAPER SHEET TO WHICH IT IS ATTACHED
#150Stripping liquid for use in separating paper from plaster/paper laminate
#151Nanoparticulate preparation
#152Apparatus and Method to Enable Easy Removal of One Substrate from Another for Enhanced Reworkability and Recyclability
#153METHOD FOR MANUFACTURING CERAMIC PLATES
#154Thin film removing device and thin film removing method
#155Process for forming a patterned thin film structure on a substrate
#156Film removing device and film removing method
#157Method for applying an optical coating to a surface of an article
#158SUBSTRATE SUPPORTING PLATE
#159Stripping device and stripping apparatus
#160Novel organic remover for advanced reticle contamination cleaning
#161Supporting plate, apparatus, and method for stripping supporting plate
#162Amylolytic enzyme extracted from sp. A 7-7 (DSM 12368) and washing and cleaning agents containing this novel amylolytic enzyme
#163Method, system, and apparatus for detaching and collecting an IC tag from a paper sheet to which it is attached
#164Protective tape separation method, and apparatus using the same
#165Substrate supporting plate and stripping method for supporting plate
#166Method for applying an optical coating to a surface of an article
#167Methods of disassembling apparel products having imine adhesives
#168Methods of disassembling apparel products having cyclodextrin-azobenzene adhesives
#169Methods of disassembling apparel products having thioester adhesives
#170Water based solution for decoupling graphene from copper substrates by oxidation