Y10T156/1121 - CPC Classification Index

ClassID:

249764 ⎘

Y10T156/1121 - CPC Classification

Classification description:

Adhesive bonding and miscellaneous chemical manufacture; Methods of delaminating, ; i.e. , separating at bonding face Using vibration during delaminating

Recent Application in this class:

20220028723

2022-01-27

Carrier plate removing method

20210178744

2021-06-17

Separation/recovery method for laminated film

20210066110

2021-03-04

Method of removing carrier plate

20210060921

2021-03-04

Removal method of carrier plate

20200238679

2020-07-30

FACILITY FOR SEPARATING LAYERS IN MULTILAYER SYSTEMS

20200230936

2020-07-23

Carrier plate removing method

20190160804

2019-05-30

Peeling apparatus

20190141842

2019-05-09

Method for manufacturing circuit board

20170355537

2017-12-14

System and method for inducing vibration on a stack of non-ferrous panels to improve the ease destacking the panels

#10

20170165953

2017-06-15

Apparatus and method to extract an object from a base surface using vibration

#11

20170117183

2017-04-27

Method and apparatus for separating semiconductor devices from a wafer

#12

20160332826

2016-11-17

Support supply apparatus and method for supplying support

#13

20160214368

2016-07-28

Method for separating multilayer systems

#14

20160013613

2016-01-14

Lift-off method

#15

20150225876

2015-08-13

Methods and apparatus for forming semiconductor

#16

20150096690

2015-04-09

Method for stripping a product substrate from a carrier substrate

#17

20150075725

2015-03-19

Device for stripping a product substrate from a carrier substrate

#18

20140367015

2014-12-18

Method and apparatus for separating semiconductor devices from a wafer

#19

20140106153

2014-04-17

Graphene platelet fabrication method and graphene platelet fabricated thereby

#20

20140034247

2014-02-06

Thermoplastic coating and removal using bonding interface with catalytic nanoparticles

#21

20140030108

2014-01-30

Method of sticking together and un-sticking two parts by means of a filled adhesive

#22

20130105090

2013-05-02

Ultrathin wafer debonding systems

#23

20130032297

2013-02-07

Method and apparatus for separating laminations

#24

20130000852

2013-01-03

Stripping device and stripping method

#25

20120152465

2012-06-21

Device and method for detaching a semiconductor wafer from a substrate

#26

20110259527

2011-10-27

Stripping device and stripping method

#27

20110225783

2011-09-22

Method and apparatus of removing weft of cord fabric for topping sheet

#28

20110180218

2011-07-28

Semi-automated reworkability process for de-bonding a display

#29

20110114260

2011-05-19

Thermoplastic coating and removal using bonding interface with catalytic nanoparticles

#30

20110048641

2011-03-03

METHOD FOR SEPARATING AND REMOVING DICING SURFACE PROTECTION TAPE FROM OBJECT TO BE CUT

#31

20100206005

2010-08-19

Interlayer film separation method

#32

20100015455

2010-01-21

Method and assembly for validating bond line

#33

20090277591

2009-11-12

Auxiliary fixture for debonding sliders and method for manufacturing sliders using the same

#34

20090249597

2009-10-08

Method and apparatus of removing weft of cord fabric for topping sheet

#35

20090032186

2009-02-05

Vibration-induced die detachment system

#36

20080223520

2008-09-18

SEPARATING APPARATUS, SEPARATING/TAKING-OUT APPARATUS, PROCESSING APPARATUS, SEPARATING METHOD, AND SEPARATING/TAKING-OUT METHOD FOR SHEET MATERIALS

#37

20080075839

2008-03-27

Process for forming a patterned thin film structure on a substrate

#38

20070228539

2007-10-04

Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips

#39

20070062643

2007-03-22

Method of separating adhesive-bonded body

#40

20070044912

2007-03-01

Method for the production of a partially metallized carrier substrate

#41

20050224965

2005-10-13

Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips