249773 ⎘
Adhesive bonding and miscellaneous chemical manufacture; Methods of delaminating, ; i.e. , separating at bonding face Gripping and pulling work apart during delaminating
Sub-classes:PELLICLE REMOVAL TOOL
#2PROTECTIVE FILMS
#3PAD REMOVAL METHOD AND DEVICE
#4PROTECTIVE MATERIAL APPLICATOR DEVICE
#5Pellicle removal tool
#6Systems And Methods For Managing Surgical Sponges
#7Mobile dismantling system for dismantling solar cell module
#8Pellicle removal tool
#9Pad removal method and device
#10Film-removing apparatus
#11Sheet peeling method and sheet peeling apparatus using peeling tool
#12Dry apply protective methods
#13Sheet separation device, laminator, image forming apparatus, and image forming system
#14Film peeling device and method of peeling film
#15Hand-held liner removal tool for pressure sensitive tape
#16Semiconductor removing apparatus and operation method thereof
#17Peeling apparatus
#18Double-sided pressure-sensitive adhesive tape
#19Method for forming a label web
#20Film peeling device and method of peeling film
#21Carrier plate removing method
#22Method of manufacturing dimming element
#23Pellicle removal tool
#24Transferring large-area group III-nitride semiconductor material and devices to arbitrary substrates
#25Sheet separation device, sheet laminator, image forming apparatus, and image forming system
#26Substrate holding apparatus
#27Sheet separation device, laminator, image forming apparatus, and image forming system
#28Apparatus and method for removing a film from a surface
#29Pad removal method
#30Element pickup device, method for manufacturing the same and method for using the same
#31Conductive films
#32Material removal apparatus, system, and method
#33Method of dismantling a stack of at least three substrates
#34Manufacturing method and manufacturing device of flexible display panel
#35Method of removing carrier plate
#36Removal method of carrier plate
#37Protective film peeling apparatus and method of peeling a protective film using the same
#38Method of peeling protective sheet for prepreg sheet and apparatus for peeling protective sheet from prepreg sheet
#39Protective material applicator device
#40Method of peeling off protective film and a method of manufacturing a display device
#41Peel-off device
#42Carrier plate removing method
#43Peeling apparatus
#44Method for separating label assembly
#45Disassembling method of display module and remanufacturing method of disassembled display module
#46Label peeling device
#47Glue filling method for multilayer thin film sensor structure
#48Apparatus of separating flexible panel from glass substrate and method thereof
#49Dry apply protective methods
#50Methods for processing a substrate
#51Pad removal device and method
#52Separation apparatus and separation method for flexible display panel
#53Method for transferring two-dimensional nanomaterials
#54Image removing device, method for recycling recording material, and image removing method
#55Temporary carrier debond initiation, and associated systems and methods
#56Foil peeling apparatus
#57Film-peeling apparatus
#58Cuff-blade attachment bushing removal
#59Protective film peeling apparatus and method of peeling a protective film using the same
#60Separating device and separating method
#61Methods and systems for separating a plurality of directed self-assembled diamagnetic components
#62Systems and methods of forming a composite layup structure
#63Film and device for tearing film
#64Carpet pulling apparatus
#65Laminate, and element comprising substrate manufactured using same
#66Protective material applicator device
#67Pellicle removal tool
#68Pad removal device and method
#69Fixture for use with a medical device label printing system
#70Film-like structure, film removing device and film removing method
#71Apparatus for facilitating peeling of lined containers
#72Method of recycling solar cell module
#73Device for delaminating laminate, delamination method, and method for manufacturing electronic device
#74Apparatus and method for simultaneously performing delamination and adhesion processes
#75Nanofiber sheet
#76Label peeling device
#77Methods for Efficient Application of Paint To and Removal of Paint From a Surface
#78Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same
#79Film application method
#80Method for manufacturing liquid discharge head
#81Preparing laminate materials for testing
#82Manufacturing apparatus for flexible electronics
#83Carpet Divider System
#84Systems and methods for separation of thermal interface bond
#85Film peeling machine movement assembly
#86Carpet divider system
#87Turntable cloth peeling jig
#88Peeling apparatus
#89Labeling device
#90Film peeling apparatus and a method of peeling film
#91Method of manufacturing anti-theft labels
#92Processing apparatus and processing method of stack
#93Film peeling device
#94Carpet removal tool
#95Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same
#96Method for forming separation starting point and separation method
#97Foil removal device and a method for removing a foil from a tire tread
#98Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same
#99Disassembly device
#100Apparatus for separating substrate and method of separating substrate by using the same
#101Techniques for low temperature direct graphene growth on glass
#102Masking removal system and method
#103Method of preparing laminate, and method of separating support
#104Device and method for loosening a first substrate
#105Label winding device and printing system
#106System and method for automated backing film removal
#107Debonding temporarily bonded semiconductor wafers
#108Processing apparatus and processing method of stack
#109Label affixing machine
#110Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same
#111Formation of dielectric with smooth surface
#112Automatic film peeling machine and film peeling method
#113Method of detaching sub-substrate from substrate
#114Chip removing device
#115Stripping device and method
#116Bendable carrier mount, device and method for releasing a carrier substrate
#117Clamping apparatus for cleaving a bonded wafer structure and methods for cleaving
#118Table for weeding heat transfers
#119Tape feeder and tape feeding method for chip mounter
#120Automatic label stripping machine
#121Peeling device, peeling system and peeling method
#122Sheet material detaching device and detaching method
#123Protective material applicator device
#124Substrate separation apparatus for stacked body
#125Apparatus and method for weeding a multilayer sheet comprising a support liner and at least one adhesive film coupled with the liner
#126Device for the fine weeding of a multilayer sheet comprising a support liner and at least one adhesive film coupled with the liner
#127Substrate separation device and substrate separation system
#128Substrate peeling apparatus and method of fabricating device using the same
#129Handling of epoxy resins
#130Method for detaching a product substrate off a carrier substrate
#131Delamination method, delamination device, and delamination system
#132Laminite, and element comprising substrate manufactured using same
#133System and method for extracting components
#134Substrate peeling apparatus and method of peeling substrate using the same
#135Method of forming individual metallic microstructures
#136Polarizing sheet removing tool and removing method
#137Polarizing sheet removing tool and removing method
#138Peeling device
#139Peeling system
#140Peeling method and light-emitting device
#141Flexible display panel peeling apparatus and peeling method using the same
#142Peel-off apparatus, peel-off system, peel-off method and computer storage medium
#143Debonding temporarily bonded semiconductor wafers
#144Peeling mechanism and peeling method using the same
#145Flexible substrate holder, device and method for detaching a first substrate
#146Method for thermal-slide debonding of temporary bonded semiconductor wafers
#147Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substrates
#148Processing apparatus and processing method of stack
#149Device for forming separation starting point, stack manufacturing apparatus, and method for forming separation starting point
#150Apparatus and method for separating a stacked arrangement
#151Device and method for removing a peelable seal
#152Apparatus for separating wafer from carrier
#153Substrate separation apparatus and method
#154Substrate separation apparatus and method
#155Peeling device, peeling system, and peeling method
#156Supporting member separation apparatus and supporting member separation method
#157Label application devices
#158Delamination apparatus and inline thermal imaging system
#159Method for improving surface quality of spalled substrates
#160Automatic removing machine, automatic corner lift-off apparatus for polarizer of LCD panel
#161Container label and related methods
#162Apparatus and method for removing a CMP pad from a platen
#163Method for removing a sealing film from a container and a device for actuating the method
#164System and method for improved epitaxial lift off
#165Delamination device
#166Electronic component carrier tape feeding device and electronic component carrier tape feeding method
#167Bendable carrier mount, device and method for releasing a carrier substrate
#168Separation method, separation apparatus, and separation system
#169BOARD SEPARATION APPARATUS AND OPERATING METHOD THEREOF
#170Device for detaching a product substrate off a carrier substrate
#171Method for detaching a semiconductor chip from a foil
#172Apparatus and method of separating wafer from carrier
#173Protective material applicator device
#174Apparatus and method for removing a CMP pad from a platen
#175Device for separating a substrate from a carrier substrate
#176Shapeable short circuit resistant capacitor
#177Separation system, separation method, program and computer storage medium
#178Apparatus and method for peeling protective film and method for fabricating stereoscopic image display device
#179Method of fully, automatically removing a polarizer of an LCD panel
#180Clamping apparatus for cleaving a bonded wafer structure
#181Methods for cleaving a bonded wafer structure
#182Ultrathin wafer debonding systems
#183Fabrication method of semiconductor devices and fabrication system of semiconductor devices
#184Systems and methods for cleaving a bonded wafer pair
#185Debonding temporarily bonded semiconductor wafers
#186Substrate separating apparatus, load lock apparatus, substrate bonding apparatus, substrate separating method, and manufacturing method of a semiconductor apparatus
#187Method for producing light emitting diode device
#188Device for detaching a product substrate off a carrier substrate
#189Method of making coated glass article, and intermediate product used in same
#190CLEANING METHOD AND CLEANING APPARATUS
#191Tape feeder and method of mounting tape on tape feeder
#192Method and apparatus for peeling electronic component
#193Method and apparatus for peeling protection film for flat display panel
#194Tape feeder and a tape installing method in the tape feeder
#195Tape feeder and method of mounting tape on tape feeder
#196Tape with a longitudinally extending filament
#197System and method for improved epitaxial lift off
#198Device and method for separating a substrate from a carrier substrate
#199Carpet removal device and method of using the same
#200Label ejection device
#201Protective material applicator device
#202Method for forming color filter, method for forming light emitting element layer, method for manufacturing color display device comprising them, or color display device
#203Method for producing organic EL device and substrate for producing organic EL device
#204Adhesive sheet and method for manufacturing adhesive sheets
#205Method for the production of an elastic composite material with a textile surface
#206METHOD FOR DEBONDING COMPONENTS IN A CHAMBER
#207Method for manufacturing flexible flat device
#208Device and method for removing a peelable seal
#209Tape with a Longitudinally Extending Filament
#210Method and apparatus for separating protective tape
#211MULTI-LAYERED SUBSTRATE
#212Device for maintaining sterile integrity of connected fluid pathways
#213Method for forming a MEMS capacitor array
#214Embossing device
#215Tape removal apparatus and process for use with an automated composite tape laying machine
#216Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
#217Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers
#218Debonding equipment and methods for debonding temporary bonded wafers
#219Peeling device
#220Control and monitoring system for thin die detachment and pick-up
#221Integrated device of peeling and mounting board assembly on backlight unit of liquid crystal display
#222Sheet peeling apparatus and peeling method
#223Mounting apparatus and mounting method
#224METHODS FOR MANUFACTURING CHUCKING SYSTEMS
#225Chip sorting apparatus
#226Apparatus for temporary wafer bonding and debonding
#227Wrapping an object with a film using a tape for cutting the film
#228Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers
#229Method of manufacturing a shapeable short-resistant capacitor
#230Graphene wafer, method for manufacturing the graphene wafer, method for releasing a graphene layer, and method for manufacturing a graphene device
#231Fixed jig, chip pickup method and chip pickup apparatus
#232Welding of PTFE parts
#233Methods of making shaped polymeric materials
#234Device for centering wafers
#235Apparatus for mechanically debonding temporary bonded semiconductor wafers
#236Microstructured antimicrobial film
#237INFORMATION RECORDING MEDIUM AND METHOD FOR MANUFACTURING SAME
#238Device for thin die detachment and pick-up
#239BAG FOR HERMETICALLY ENCLOSING AN INFLATABLE LIFERAFT
#240RESIN LAMINATE, PRESSURE SENSITIVE ADHESIVE SHEET, METHOD FOR WORKING ADHEREND USING THE PRESSURE SENSITIVE ADHESIVE SHEET, AND DEVICE FOR SEPARATING THE PRESSURE SENSITIVE ADHESIVE SHEET
#241Apparatus for separating label assembly
#242High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach
#243Method for microcontact printing of MEMS
#244Wafer table, surface protective film peeling apparatus and surface protective film peeling method
#245Peel-off coating compositions
#246Method and system for advanced process control in an etch system by gas flow control on the basis of CD measurements
#247SEPARATION METHODS FOR IMPRINT LITHOGRAPHY
#248Feeder for an auto mounting device
#249SCENTED TATTOO PLASTER
#250MULTI-LAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#251Laser-based methods of stripping fiber optic cables
#252Device and method for removing a peelable seal
#253Method of fabricating multi-layered substrate
#254APPARATUS FOR HARVESTING POLYCRYSTALLINE SILICON RODS AND METHODS OF USING THE SAME
#255LABEL INFORMATION REDACTOR
#256Method and assembly for validating bond line
#257Microchip manufacturing method
#258Method for manufacturing liquid crystal device
#259Apparatus and process for removing flexible film seals from tubular specimen containers
#260Separating apparatus and separating method
#261Adjustable micro device feeder system and method of operation thereof
#262Remote center compliant flexure device
#263Multi-ply rolled paper separating device and method of use
#264Method and apparatus for peeling electronic component
#265Apparatus and method for the removal of pellicles from masks
#266Automatic mask peeling apparatus
#267Adhesive tape joining apparatus
#268COLD WEATHER INSULATOR FILM REMOVAL AND EMERGENCY ESCAPE DEVICE
#269Peeling apparatus, peeling method, and method of manufacturing information recording medium
#270Apparatus for disassembling a tire building core
#271Paint masking for corners
#272Film peeling method and film peeling device
#273METHOD, SYSTEM, AND APPARATUS FOR DETACHING AND COLLECTING AN IC TAG FROM A PAPER SHEET TO WHICH IT IS ATTACHED
#274METHOD, SYSTEM, AND APPARATUS FOR DETACHING AND COLLECTING AN IC TAG FROM A PAPER SHEET TO WHICH IT IS ATTACHED
#275Tape removal apparatus and process for use with an automated composite tape laying machine
#276Remote Center Compliant Flexure Device
#277Adhesion device for applying and releasing biomimetic microstructure adhesive from a contact surface
#278Sheet peeling apparatus and peeling method
#279METHOD AND APPARATUS FOR USING TAPES TO REMOVE MATERIALS FROM SUBSTRATE SURFACES
#280Method of making coated glass article, and intermediate product used in same
#281Transferring device and transferring method
#282Methods for forming an assembly for transfer of a useful layer using a peripheral recess area to facilitate transfer
#283Adhesive-film exfoliating device and manufacturing method of liquid crystal display panel using the device
#284APPARATUS FOR REMOVING A POLARIZER AND METHOD THEREOF
#285Device and method for removing a peelable seal
#286Method for continuous production of a functional film
#287HIGH-TEMPERATURE, SPIN-ON, BONDING COMPOSITIONS FOR TEMPORARY WAFER BONDING USING SLIDING APPROACH
#288Method for forming color filter, method for forming light emitting element layer, method for manufacturing color display device comprising them, or color display device
#289APPARATUS AND METHOD FOR A SEPARATING FILM
#290Method for removing press-fit components from printed circuit boards
#291Biomimetic modular adhesive complex: materials, methods and applications therefore
#292Method for forming color filter, method for forming light emitting element layer, method for manufacturing color display device comprising them, or color display device
#293Roll-to-roll method and system for micro-replication of a pattern of large relief three-dimensional microstructures
#294Method and apparatus for optical fiber coating removal
#295Film-affixing device
#296Method for joining adhesive tape to semiconductor wafer, method for separating protective tape from semiconductor wafer, and apparatuses using the methods
#297Method for joining adhesive tape to semiconductor wafer, method for separating protective tape from semiconductor wafer, and apparatuses using the methods
#298Sheet peeling apparatus and peeling method
#299Film stripping method and apparatus
#300Printing machine comprising an embossing device