Y10T156/1922 - CPC Classification Index

ClassID:

249853 ⎘

Y10T156/1922 - CPC Classification

Classification description:

Adhesive bonding and miscellaneous chemical manufacture; Delaminating means Vibrating delaminating means

Recent Application in this class:

20220028723

2022-01-27

Carrier plate removing method

20210178744

2021-06-17

Separation/recovery method for laminated film

20210066110

2021-03-04

Method of removing carrier plate

20210060921

2021-03-04

Removal method of carrier plate

20200230936

2020-07-23

Carrier plate removing method

20190160804

2019-05-30

Peeling apparatus

20170355537

2017-12-14

System and method for inducing vibration on a stack of non-ferrous panels to improve the ease destacking the panels

20170165953

2017-06-15

Apparatus and method to extract an object from a base surface using vibration

20170117183

2017-04-27

Method and apparatus for separating semiconductor devices from a wafer

#10

20160332826

2016-11-17

Support supply apparatus and method for supplying support

#11

20160214368

2016-07-28

Method for separating multilayer systems

#12

20160013613

2016-01-14

Lift-off method

#13

20150251404

2015-09-10

Method for detaching a product substrate off a carrier substrate

#14

20150225876

2015-08-13

Methods and apparatus for forming semiconductor

#15

20150096690

2015-04-09

Method for stripping a product substrate from a carrier substrate

#16

20150075725

2015-03-19

Device for stripping a product substrate from a carrier substrate

#17

20140367015

2014-12-18

Method and apparatus for separating semiconductor devices from a wafer

#18

20140034247

2014-02-06

Thermoplastic coating and removal using bonding interface with catalytic nanoparticles

#19

20130276990

2013-10-24

Device for detaching a product substrate off a carrier substrate

#20

20130105090

2013-05-02

Ultrathin wafer debonding systems

#21

20130032297

2013-02-07

Method and apparatus for separating laminations

#22

20130025796

2013-01-31

Device for detaching a product substrate off a carrier substrate

#23

20130000852

2013-01-03

Stripping device and stripping method

#24

20120152465

2012-06-21

Device and method for detaching a semiconductor wafer from a substrate

#25

20110259527

2011-10-27

Stripping device and stripping method

#26

20110225783

2011-09-22

Method and apparatus of removing weft of cord fabric for topping sheet

#27

20110174445

2011-07-21

SEMI-AUTOMATED REWORKABILITY EQUIPMENT FOR DE-BONDING A DISPLAY

#28

20110114260

2011-05-19

Thermoplastic coating and removal using bonding interface with catalytic nanoparticles

#29

20110048641

2011-03-03

METHOD FOR SEPARATING AND REMOVING DICING SURFACE PROTECTION TAPE FROM OBJECT TO BE CUT

#30

20100206005

2010-08-19

Interlayer film separation method

#31

20090277591

2009-11-12

Auxiliary fixture for debonding sliders and method for manufacturing sliders using the same

#32

20090249597

2009-10-08

Method and apparatus of removing weft of cord fabric for topping sheet

#33

20090218050

2009-09-03

Treatment liquid permeation unit and treating apparatus

#34

20090032186

2009-02-05

Vibration-induced die detachment system

#35

20080230183

2008-09-25

Releasing method and releasing apparatus of work having adhesive tape

#36

20080223520

2008-09-18

SEPARATING APPARATUS, SEPARATING/TAKING-OUT APPARATUS, PROCESSING APPARATUS, SEPARATING METHOD, AND SEPARATING/TAKING-OUT METHOD FOR SHEET MATERIALS

#37

20070261783

2007-11-15

Methods and systems for removing protective films from microfeature workpieces

#38

20070228539

2007-10-04

Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips

#39

20070034331

2007-02-15

Releasing method and releasing apparatus of work having adhesive tape

#40

20050224965

2005-10-13

Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips

#41

20050067097

2005-03-31

Releasing method and releasing apparatus of work having adhesive tape