ClassID:

249860

Y10T156/1961 - CPC Classification

Classification description:

Adhesive bonding and miscellaneous chemical manufacture; Delaminating means Severing delaminating means [e.g., chisel, etc.]

Sub-classes:
Recent Application in this class:
#1
20240227381
2024-07-11

APPARATUS FOR MANUFACTURING DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

#2
20240131835
2024-04-25

Apparatus for manufacturing display device and method for manufacturing display device

#3
20220356036
2022-11-10

Hand-held liner removal tool for pressure sensitive tape

#4
20220134729
2022-05-05

Apparatus for manufacturing display device and method for manufacturing display device

#5
20220130694
2022-04-28

Dynamic release tapes for assembly of discrete components

#6
20210375649
2021-12-02

DYNAMIC RELEASE TAPES FOR ASSEMBLY OF DISCRETE COMPONENTS

#7
20210283794
2021-09-16

Stand-alone cutting apparatus

#8
20210187777
2021-06-24

Material removal apparatus, system, and method

#9
20200131789
2020-04-30

Caulking assisting device

#10
20200095003
2020-03-26

Combination printer and cutting apparatus

#11
20190104654
2019-04-04

Components feeder

#12
20190099921
2019-04-04

Carbon fiber recovery method

#13
20180354251
2018-12-13

Methods for processing a first substrate bonded to a second substrate

#14
20180345645
2018-12-06

Method and apparatus to remove a protective layer

#15
20180312289
2018-11-01

Method for reducing label waste using a cutting apparatus

#16
20180311856
2018-11-01

Stand-alone cutting apparatus

#17
20180254364
2018-09-06

Method of recycling solar cell module

#18
20180160576
2018-06-07

Feeder

#19
20180154623
2018-06-07

Preparing laminate materials for testing

#20
20180126719
2018-05-10

Carpet Divider System

#21
20180108558
2018-04-19

Wafer de-bonding device

#22
20180093466
2018-04-05

System for disassembling display device and method for disassembling display device using the same

#23
20180093465
2018-04-05

Systems and methods for separation of thermal interface bond

#24
20180065356
2018-03-08

Carpet divider system

#25
20170334187
2017-11-23

Processing apparatus and processing method of stack

#26
20170305134
2017-10-26

Peeling method and manufacturing method of flexible device

#27
20170266947
2017-09-21

Method for creating separation start portion for layered bodies, device for creating separation start portion, and electronic device manufacturing method

#28
20170072676
2017-03-16

Adhesive film remover

#29
20160361912
2016-12-15

Masking removal system and method

#30
20160324043
2016-11-03

Component supplying apparatus and component supplying method

#31
20160311213
2016-10-27

Cartridge and tubular container trimming and refinishing apparatus for ink and label removal

#32
20160311212
2016-10-27

System and method for automated backing film removal

#33
20160288478
2016-10-06

Apparatus for removal of flooring

#34
20160243812
2016-08-25

Processing apparatus and processing method of stack

#35
20160225670
2016-08-04

Peeling apparatus, peeling system, and peeling method

#36
20160167360
2016-06-16

Debonders with a recess and a side wall opening for semiconductor fabrication

#37
20160167359
2016-06-16

Debonders with a recess and a heater for semiconductor fabrication

#38
20160020124
2016-01-21

Bendable carrier mount, device and method for releasing a carrier substrate

#39
20150375495
2015-12-31

Clamping apparatus for cleaving a bonded wafer structure and methods for cleaving

#40
20150343754
2015-12-03

Sheet material detaching device and detaching method

#41
20150318200
2015-11-05

Substrate separation apparatus for stacked body

#42
20150239227
2015-08-27

Delamination method, delamination device, and delamination system

#43
20150231790
2015-08-20

Device for separating two substrates

#44
20150202857
2015-07-23

Separation apparatus

#45
20150195963
2015-07-09

Component supplying apparatus and component supplying method

#46
20150174782
2015-06-25

Polarizing sheet removing tool and removing method

#47
20150174779
2015-06-25

Polarizing sheet removing tool and removing method

#48
20150101744
2015-04-16

Debonding temporarily bonded semiconductor wafers

#49
20150096690
2015-04-09

Method for stripping a product substrate from a carrier substrate

#50
20150075725
2015-03-19

Device for stripping a product substrate from a carrier substrate

#51
20150064385
2015-03-05

Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substrates

#52
20150059987
2015-03-05

Processing apparatus and processing method of stack

#53
20150059986
2015-03-05

Device for forming separation starting point, stack manufacturing apparatus, and method for forming separation starting point

#54
20150053353
2015-02-26

Component supplying apparatus and component supplying method

#55
20140338828
2014-11-20

Substrate separation apparatus and method

#56
20140332166
2014-11-13

Peeling device, peeling system, and peeling method

#57
20140262053
2014-09-18

Debonders and related devices and methods for semiconductor fabrication

#58
20140196855
2014-07-17

Separating apparatus

#59
20140096914
2014-04-10

Cartridge and tubular container trimming and refinishing apparatus for ink and label removal and method of use

#60
20140076498
2014-03-20

Film peeling method and film peeling device for film-coated flat wire

#61
20130105539
2013-05-02

Clamping apparatus for cleaving a bonded wafer structure

#62
20130105538
2013-05-02

Methods for cleaving a bonded wafer structure

#63
20130048224
2013-02-28

Debonding temporarily bonded semiconductor wafers

#64
20130029002
2013-01-31

Double tread mold

#65
20130022696
2013-01-24

Double tread separation apparatus

#66
20130020031
2013-01-24

METHOD AND APPARATUS FOR DETACHING PLATES JOINED TO EACH OTHER

#67
20120237678
2012-09-20

Tool for harvesting polycrystalline silicon-coated rods from a chemical vapor deposition reactor

#68
20120152465
2012-06-21

Device and method for detaching a semiconductor wafer from a substrate

#69
20120132344
2012-05-31

Method for repairing a wall consisting of a plurality of layers

#70
20120080150
2012-04-05

Fixtures and methods for unbonding wafers by shear force

#71
20120048906
2012-03-01

Substrate cutting device and method

#72
20110308738
2011-12-22

Die bonder, pickup method, and pickup device

#73
20110297329
2011-12-08

Debonders and related devices and methods for semiconductor fabrication

#74
20110277941
2011-11-17

Tape removal apparatus and process

#75
20110253316
2011-10-20

Double tread

#76
20110220294
2011-09-15

Method of processing terminus of optical fiber and terminus processing tool

#77
20110180218
2011-07-28

Semi-automated reworkability process for de-bonding a display

#78
20110088845
2011-04-21

Universal die detachment apparatus

#79
20110041993
2011-02-24

Sheet peeling machine and method for manufacturing display device

#80
20110023672
2011-02-03

Method and apparatus for debonding a submounted substrate

#81
20100277083
2010-11-04

LIGHTING DEVICE

#82
20100126665
2010-05-27

Laser-based methods of stripping fiber optic cables

#83
20100107834
2010-05-06

Separation apparatus and separation method

#84
20100043972
2010-02-25

APPARATUS FOR HARVESTING POLYCRYSTALLINE SILICON RODS AND METHODS OF USING THE SAME

#85
20090314430
2009-12-24

Separating apparatus and separating method

#86
20090183615
2009-07-23

System and method for disassembling laminated substrates

#87
20090025875
2009-01-29

Tape removal apparatus and process

#88
20090007737
2009-01-08

Bottle label removal apparatus

#89
20080295972
2008-12-04

Label remover

#90
20080289771
2008-11-27

Label removing tool

#91
20070284038
2007-12-13

Method for separating protective tape, and apparatus using the same

#92
20070221328
2007-09-27

Fixture and method of holding and debonding a workpiece with the fixture

#93
20070215277
2007-09-20

Laminae separating dispenser and method of use

#94
20070119893
2007-05-31

Substrate cutting device and method

#95
20060254723
2006-11-16

Label remover

#96
20060102199
2006-05-18

Game ticket scratching device and method

#97
20060090843
2006-05-04

Laminae separating dispenser and method of use

#98
20050126359
2005-06-16

Cutting assembly for removing a windshield and method relating to same

#99
20050000649
2005-01-06

Substrate cutting device and method

#100
17566302
2023-02-07

Thermoplastic laminate induction welding system and method

#101
17519700
2022-11-08

Solar module exterior disassembling apparatus

#102
17519699
2022-11-08

Solar panel disassembling apparatus

#103
15156592
2017-10-17

Cleaving device

#104
14587972
2016-04-26

Controlled spalling using a reactive material stack

#105
14465688
2019-11-26

Prescription label remover