249860 ⎘
Adhesive bonding and miscellaneous chemical manufacture; Delaminating means Severing delaminating means [e.g., chisel, etc.]
Sub-classes:APPARATUS FOR MANUFACTURING DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
#2Apparatus for manufacturing display device and method for manufacturing display device
#3Hand-held liner removal tool for pressure sensitive tape
#4Apparatus for manufacturing display device and method for manufacturing display device
#5Dynamic release tapes for assembly of discrete components
#6DYNAMIC RELEASE TAPES FOR ASSEMBLY OF DISCRETE COMPONENTS
#7Stand-alone cutting apparatus
#8Material removal apparatus, system, and method
#9Caulking assisting device
#10Combination printer and cutting apparatus
#11Components feeder
#12Carbon fiber recovery method
#13Methods for processing a first substrate bonded to a second substrate
#14Method and apparatus to remove a protective layer
#15Method for reducing label waste using a cutting apparatus
#16Stand-alone cutting apparatus
#17Method of recycling solar cell module
#18Feeder
#19Preparing laminate materials for testing
#20Carpet Divider System
#21Wafer de-bonding device
#22System for disassembling display device and method for disassembling display device using the same
#23Systems and methods for separation of thermal interface bond
#24Carpet divider system
#25Processing apparatus and processing method of stack
#26Peeling method and manufacturing method of flexible device
#27Method for creating separation start portion for layered bodies, device for creating separation start portion, and electronic device manufacturing method
#28Adhesive film remover
#29Masking removal system and method
#30Component supplying apparatus and component supplying method
#31Cartridge and tubular container trimming and refinishing apparatus for ink and label removal
#32System and method for automated backing film removal
#33Apparatus for removal of flooring
#34Processing apparatus and processing method of stack
#35Peeling apparatus, peeling system, and peeling method
#36Debonders with a recess and a side wall opening for semiconductor fabrication
#37Debonders with a recess and a heater for semiconductor fabrication
#38Bendable carrier mount, device and method for releasing a carrier substrate
#39Clamping apparatus for cleaving a bonded wafer structure and methods for cleaving
#40Sheet material detaching device and detaching method
#41Substrate separation apparatus for stacked body
#42Delamination method, delamination device, and delamination system
#43Device for separating two substrates
#44Separation apparatus
#45Component supplying apparatus and component supplying method
#46Polarizing sheet removing tool and removing method
#47Polarizing sheet removing tool and removing method
#48Debonding temporarily bonded semiconductor wafers
#49Method for stripping a product substrate from a carrier substrate
#50Device for stripping a product substrate from a carrier substrate
#51Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substrates
#52Processing apparatus and processing method of stack
#53Device for forming separation starting point, stack manufacturing apparatus, and method for forming separation starting point
#54Component supplying apparatus and component supplying method
#55Substrate separation apparatus and method
#56Peeling device, peeling system, and peeling method
#57Debonders and related devices and methods for semiconductor fabrication
#58Separating apparatus
#59Cartridge and tubular container trimming and refinishing apparatus for ink and label removal and method of use
#60Film peeling method and film peeling device for film-coated flat wire
#61Clamping apparatus for cleaving a bonded wafer structure
#62Methods for cleaving a bonded wafer structure
#63Debonding temporarily bonded semiconductor wafers
#64Double tread mold
#65Double tread separation apparatus
#66METHOD AND APPARATUS FOR DETACHING PLATES JOINED TO EACH OTHER
#67Tool for harvesting polycrystalline silicon-coated rods from a chemical vapor deposition reactor
#68Device and method for detaching a semiconductor wafer from a substrate
#69Method for repairing a wall consisting of a plurality of layers
#70Fixtures and methods for unbonding wafers by shear force
#71Substrate cutting device and method
#72Die bonder, pickup method, and pickup device
#73Debonders and related devices and methods for semiconductor fabrication
#74Tape removal apparatus and process
#75Double tread
#76Method of processing terminus of optical fiber and terminus processing tool
#77Semi-automated reworkability process for de-bonding a display
#78Universal die detachment apparatus
#79Sheet peeling machine and method for manufacturing display device
#80Method and apparatus for debonding a submounted substrate
#81LIGHTING DEVICE
#82Laser-based methods of stripping fiber optic cables
#83Separation apparatus and separation method
#84APPARATUS FOR HARVESTING POLYCRYSTALLINE SILICON RODS AND METHODS OF USING THE SAME
#85Separating apparatus and separating method
#86System and method for disassembling laminated substrates
#87Tape removal apparatus and process
#88Bottle label removal apparatus
#89Label remover
#90Label removing tool
#91Method for separating protective tape, and apparatus using the same
#92Fixture and method of holding and debonding a workpiece with the fixture
#93Laminae separating dispenser and method of use
#94Substrate cutting device and method
#95Label remover
#96Game ticket scratching device and method
#97Laminae separating dispenser and method of use
#98Cutting assembly for removing a windshield and method relating to same
#99Substrate cutting device and method
#100Thermoplastic laminate induction welding system and method
#101Solar module exterior disassembling apparatus
#102Solar panel disassembling apparatus
#103Cleaving device
#104Controlled spalling using a reactive material stack
#105Prescription label remover