249863 ⎘
Adhesive bonding and miscellaneous chemical manufacture; Delaminating means Delaminating bending means
Sub-classes:APPARATUS FOR APPLYING RUBBERIZED ELECTRONIC TAGS TO A TYRE BEING PROCESSED
#2PAD REMOVAL METHOD AND DEVICE
#3PROTECTIVE MATERIAL APPLICATOR DEVICE
#4Mobile dismantling system for dismantling solar cell module
#5METHOD AND APPARATUS FOR APPLYING RUBBERIZED ELECTRONIC TAGS TO A TYRE BEING PROCESSED
#6Machines and methods to apply tape to a surface
#7Pad removal method and device
#8Film-removing apparatus
#9Film peeling device and method of peeling film
#10Semiconductor removing apparatus and operation method thereof
#11Peeling apparatus
#12Method for forming a label web
#13Film peeling device and method of peeling film
#14Method of manufacturing dimming element
#15Sheet separation device, sheet laminator, image forming apparatus, and image forming system
#16Apparatus and method for peeling a liner away from a substrate
#17Apparatus and method for removing a film from a surface
#18Pad removal method
#19Material removal apparatus, system, and method
#20Method and apparatus for transferring micro device, and electronic product using the same
#21Manufacturing method and manufacturing device of flexible display panel
#22Temporary tape removal hub for tape removal machine
#23Protective film peeling apparatus and method of peeling a protective film using the same
#24Protective material applicator device
#25Method of peeling off protective film and a method of manufacturing a display device
#26Peel-off device
#27Method for separating label assembly
#28Substrate separation system and method
#29Label peeling device
#30Apparatus of separating flexible panel from glass substrate and method thereof
#31Methods for processing a substrate
#32Pad removal device and method
#33Laminates, and systems and methods for laminating
#34Separation apparatus and separation method for flexible display panel
#35Temporary carrier debond initiation, and associated systems and methods
#36Foil peeling apparatus
#37Film-peeling apparatus
#38Protective film peeling apparatus and method of peeling a protective film using the same
#39Separating device and separating method
#40Film transfer tool
#41Systems and methods of forming a composite layup structure
#42Film and device for tearing film
#43Carpet pulling apparatus
#44Protective material applicator device
#45Pad removal device and method
#46Fixture for use with a medical device label printing system
#47Film-like structure, film removing device and film removing method
#48Apparatus for facilitating peeling of lined containers
#49Device for delaminating laminate, delamination method, and method for manufacturing electronic device
#50Apparatus and method for simultaneously performing delamination and adhesion processes
#51Label peeling device
#52Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same
#53Manufacturing apparatus for flexible electronics
#54System for disassembling display device and method for disassembling display device using the same
#55Systems and methods for separation of thermal interface bond
#56Film peeling machine movement assembly
#57Turntable cloth peeling jig
#58Peeling apparatus
#59Method and device for separating workpiece consisting of carrier substrate and resin layer
#60Film peeling device
#61Laminate changing device
#62Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same
#63Foil removal device and a method for removing a foil from a tire tread
#64Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same
#65Film stripping device and film stripping method
#66Disassembly device
#67Apparatus for separating substrate and method of separating substrate by using the same
#68Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same
#69Device and method for loosening a first substrate
#70System and method for automated backing film removal
#71Debonding temporarily bonded semiconductor wafers
#72Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same
#73Corner peeling device, film peeling apparatus and film peeling method
#74Formation of dielectric with smooth surface
#75Method of detaching sub-substrate from substrate
#76Debonders with a recess and a side wall opening for semiconductor fabrication
#77Debonders with a recess and a heater for semiconductor fabrication
#78Laminated substrate separating device and method for separating laminated substrate
#79Chip removing device
#80Method and apparatus for separating flexible display film from substrate
#81Stripping device and method
#82Bendable carrier mount, device and method for releasing a carrier substrate
#83Apparatus for stripping flexible device
#84Devices for methodologies related to wafer carriers
#85Clamping apparatus for cleaving a bonded wafer structure and methods for cleaving
#86Label peeling device, fluid ejection device, and label peeling method
#87Automatic label stripping machine
#88Peeling device, peeling system and peeling method
#89Protective material applicator device
#90Substrate separation apparatus for stacked body
#91System and method for automated initial separation of composite ply backing
#92Polarizer removing device and method of using it
#93Film peeling apparatus and film peeling method
#94Substrate separation device and substrate separation system
#95Substrate peeling apparatus and method of fabricating device using the same
#96Handling of epoxy resins
#97Method for detaching a product substrate off a carrier substrate
#98Delamination method, delamination device, and delamination system
#99Substrate peeling apparatus and method of peeling substrate using the same
#100Peeling device
#101Peeling system
#102Peeling method and light-emitting device
#103Flexible display panel peeling apparatus and peeling method using the same
#104Film peeling apparatus
#105Debonding temporarily bonded semiconductor wafers
#106Peeling mechanism and peeling method using the same
#107Flexible substrate holder, device and method for detaching a first substrate
#108Separation device and pickup system
#109Method for thermal-slide debonding of temporary bonded semiconductor wafers
#110Label separator and label printer incorporating the label separator
#111Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substrates
#112Apparatus and method for separating a stacked arrangement
#113Device and method for removing a peelable seal
#114Apparatus for separating wafer from carrier
#115Substrate separation apparatus and method
#116Supporting member separation apparatus and supporting member separation method
#117Label application devices
#118Delamination apparatus and inline thermal imaging system
#119Debonders and related devices and methods for semiconductor fabrication
#120Method for improving surface quality of spalled substrates
#121Apparatus and method for removing a CMP pad from a platen
#122System and method for improved epitaxial lift off
#123Film peeling device
#124Delamination device
#125Electronic component carrier tape feeding device and electronic component carrier tape feeding method
#126Bendable carrier mount, device and method for releasing a carrier substrate
#127Delamination apparatus and inline thermal imaging system
#128Device for detaching a product substrate off a carrier substrate
#129Apparatus and method of separating wafer from carrier
#130Protective material applicator device
#131Apparatus and method for removing a CMP pad from a platen
#132Apparatus and method for peeling protective film and method for fabricating stereoscopic image display device
#133Clamping apparatus for cleaving a bonded wafer structure
#134Methods for cleaving a bonded wafer structure
#135Systems and methods for cleaving a bonded wafer pair
#136Debonding temporarily bonded semiconductor wafers
#137Device for detaching a product substrate off a carrier substrate
#138Label dispensing device and method
#139CLEANING METHOD AND CLEANING APPARATUS
#140Tape feeder and method of mounting tape on tape feeder
#141Method and apparatus for peeling electronic component
#142Method and apparatus for peeling protection film for flat display panel
#143Tape feeder and a tape installing method in the tape feeder
#144Tape feeder and method of mounting tape on tape feeder
#145System and method for improved epitaxial lift off
#146Apparatus and method for tin-tie application
#147Carpet removal device and method of using the same
#148Protective material applicator device
#149Label peeling machine
#150Device and method for removing a peelable seal
#151Method and apparatus for separating protective tape
#152DEVICES FOR METHODOLOGIES RELATED TO WAFER CARRIERS
#153Tape removal apparatus and process for use with an automated composite tape laying machine
#154Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
#155Debonders and related devices and methods for semiconductor fabrication
#156Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers
#157Tape removal apparatus and process
#158Debonding equipment and methods for debonding temporary bonded wafers
#159Debonding equipment and methods for debonding temporary bonded wafers
#160Carrier tape feeder
#161Label separator and label printer incorporating the label separator
#162Peeling device
#163Control and monitoring system for thin die detachment and pick-up
#164Integrated device of peeling and mounting board assembly on backlight unit of liquid crystal display
#165Sheet peeling apparatus and peeling method
#166Sheet peeling apparatus and peeling method
#167Postage label dispensing system and repositionable peeler guide therefor
#168Multi-mode system for dispensing adhesive-backed labels
#169Auto lamination cassette apparatus
#170Apparatus for temporary wafer bonding and debonding
#171Wrapping an object with a film using a tape for cutting the film
#172Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers
#173Trim removal system
#174Fixed jig, chip pickup method and chip pickup apparatus
#175Device for centering wafers
#176Apparatus for mechanically debonding temporary bonded semiconductor wafers
#177Device for thin die detachment and pick-up
#178RESIN LAMINATE, PRESSURE SENSITIVE ADHESIVE SHEET, METHOD FOR WORKING ADHEREND USING THE PRESSURE SENSITIVE ADHESIVE SHEET, AND DEVICE FOR SEPARATING THE PRESSURE SENSITIVE ADHESIVE SHEET
#179Apparatus for separating label assembly
#180Wafer table, surface protective film peeling apparatus and surface protective film peeling method
#181Feeder for an auto mounting device
#182Device and method for removing a peelable seal
#183Label peeling unit and label printer
#184Method for manufacturing liquid crystal device
#185Apparatus and process for removing flexible film seals from tubular specimen containers
#186Adjustable micro device feeder system and method of operation thereof
#187Method and apparatus for peeling electronic component
#188Apparatus and method for the removal of pellicles from masks
#189Automatic mask peeling apparatus
#190Peeling apparatus, peeling method, and method of manufacturing information recording medium
#191Apparatus for disassembling a tire building core
#192Separating device
#193Controlled temperature scrap removal for tape process
#194Tape removal apparatus and process for use with an automated composite tape laying machine
#195Tape removal apparatus and process
#196Sheet peeling apparatus and peeling method
#197LABEL PEELING APPARATUS
#198Cassette apparatus and process
#199METHOD, SYSTEM, AND APPARATUS FOR TRANSFER OF DIES USING A DIE PLATE
#200Adhesive-film exfoliating device and manufacturing method of liquid crystal display panel using the device
#201Releasing method and releasing apparatus of work having adhesive tape
#202Device and method for removing a peelable seal
#203Pattern Copying Apparatus, Pattern Copying Method and Peeling Roller
#204Film-affixing device
#205Adhesive tape cutting method and apparatus using the same
#206Semiconductor wafer mount apparatus
#207Method for joining adhesive tape to semiconductor wafer, method for separating protective tape from semiconductor wafer, and apparatuses using the methods
#208Method for joining adhesive tape to semiconductor wafer, method for separating protective tape from semiconductor wafer, and apparatuses using the methods
#209Sheet peeling apparatus and peeling method
#210Sheet Peeling Apparatus and Peeling Method
#211Tape exfoliation apparatus and tape-affixing apparatus
#212Workpiece processing device
#213Dispensing apparatus for pressure-sensitive adhesive dispensing tape
#214Surface protection film peeling method and surface protection film peeling device
#215Trim removal system
#216Label production apparatus
#217Label production apparatus
#218Method and device for exposing electronic components
#219Sheet peeling apparatus and sheet peeling method
#220Adhesion tape and method for mounting a chip onto a substrate
#221Suction unit
#222Chip transfer method and apparatus
#223Apparatus for attaching a peeling tape
#224Tools and methods for disuniting semiconductor wafers
#225Releasing method and releasing apparatus of work having adhesive tape
#226Systems for assembling components on submounts and methods therefor
#227Film separation method and film separation apparatus
#228Apparatus for refurbishing used cores for rolls of material
#229Apparatus for detaching supporting fabric from elastomeric material
#230Gripping separable-paper peeler
#231Apparatus and method for removing adhesive labels from garment hangers
#232Apparatus for joining a separating adhesive tape
#233Antenna designs for radio frequency identification tags
#234Rectangular substrate dividing apparatus
#235Tool for removing material strip from surface
#236Driving mechanism for chip detachment apparatus
#237Method of transferring a substantially disc-shaped workpiece, and device for carrying out this method
#238Label peeling mechanism and label printer
#239Label removing tool
#240Apparatus for semiconductor chip detachment
#241Method for processing electrical parts, particularly for processing semiconductor chips and electrical components, and device for carrying out said method
#242Binder strip cassette
#243Film-supplying device and film-affixing system
#244Label printer that dispenses labels in non-peel or automatic peel modes
#245Releasing method and releasing apparatus of work having adhesive tape
#246Apparatus for unrolling a web of backing material on a roll with double-sidedly adhesive tape sections
#247Method of manufacturing semiconductor device and manufacturing apparatus of semiconductor device
#248Method, system, and apparatus for transfer of dies using a pin plate
#249Method, system, and apparatus for transfer of dies using a die plate having die cavities
#250Method, system, and apparatus for authenticating devices during assembly
#251Method and apparatus for picking up work piece and mounting machine
#252Method, system, and apparatus for high volume transfer of dies
#253Separation method for object and glue membrane
#254Peeling device
#255Machines and methods to apply tape to a surface
#256Systems and methods of forming a composite layup structure
#257Removal machine to take pavement markings off of paved surfaces