249961 ⎘
Severing by tearing or breaking; Breaking or tearing apparatus Including means to apply thermal shock to work
Glass bottle cutter based on electric heating
#2Method of separating a back layer on a singulated semiconductor wafer attached to carrier substrate
#3Method of separating a back layer on a singulated semiconductor wafer attached to carrier substrates
#4Method of singulating semiconductor wafer having a plurality of die and a back layer disposed along a major surface
#5Method of cutting brittle material, device for cutting brittle material, method of manufacturing cut brittle material and cut brittle material
#6Combined wafer production method with a receiving layer having holes
#7Method for cutting plate-like glass, and cutting device therefor
#8Method of singulating semiconductor wafer having back layer
#9Waste fluorescent light end-cutting apparatus
#10Systems and methods for producing silicon slim rods
#11Method and apparatus for producing an elastically deformable glass plate
#12Wafer cutting method and a system thereof
#13Method for separating a sheet of brittle material
#14Device for the separative machining of components made from brittle material
#15Method of Separating Non-Metallic Material Using Microwave Radiation
#16Method for cutting nonmetal material
#17Method and apparatus for forming cracks
#18Substrate dividing apparatus and method for dividing substrate
#19IN-LINE SYSTEM AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY
#20Method of cutting laminated glass with laser beams
#21Glass-plate cutting machine
#22Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus, and substrate cutting method using the substrate cutting apparatus
#23Brittle workpiece splitting system and brittle workpiece splitting method
#24Method for cutting an LCD substrate using coolant having low surface tension and low viscosity properties in which a partial cut, cooling with coolant and then a full cut takes place after coolant is removed
#25Process and apparatus for scoring a brittle material
#26Method of breaking a brittle substrate
#27Apparatus and method for scribing substrate
#28Method and device for cutting flat work pieces made of a brittle material