ClassID:

249961

Y10T225/304 - CPC Classification

Classification description:

Severing by tearing or breaking; Breaking or tearing apparatus Including means to apply thermal shock to work

Recent Application in this class:
#1
20210331962
2021-10-28

Glass bottle cutter based on electric heating

#2
20200118878
2020-04-16

Method of separating a back layer on a singulated semiconductor wafer attached to carrier substrate

#3
20190214301
2019-07-11

Method of separating a back layer on a singulated semiconductor wafer attached to carrier substrates

#4
20180269104
2018-09-20

Method of singulating semiconductor wafer having a plurality of die and a back layer disposed along a major surface

#5
20170361486
2017-12-21

Method of cutting brittle material, device for cutting brittle material, method of manufacturing cut brittle material and cut brittle material

#6
20170217048
2017-08-03

Combined wafer production method with a receiving layer having holes

#7
20160122228
2016-05-05

Method for cutting plate-like glass, and cutting device therefor

#8
20150332969
2015-11-19

Method of singulating semiconductor wafer having back layer

#9
20150122097
2015-05-07

Waste fluorescent light end-cutting apparatus

#10
20130174607
2013-07-11

Systems and methods for producing silicon slim rods

#11
20120061440
2012-03-15

Method and apparatus for producing an elastically deformable glass plate

#12
20110244659
2011-10-06

Wafer cutting method and a system thereof

#13
20100294748
2010-11-25

Method for separating a sheet of brittle material

#14
20090014492
2009-01-15

Device for the separative machining of components made from brittle material

#15
20080236199
2008-10-02

Method of Separating Non-Metallic Material Using Microwave Radiation

#16
20080074747
2008-03-27

Method for cutting nonmetal material

#17
20070228100
2007-10-04

Method and apparatus for forming cracks

#18
20070164072
2007-07-19

Substrate dividing apparatus and method for dividing substrate

#19
20070056686
2007-03-15

IN-LINE SYSTEM AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY

#20
20060201983
2006-09-14

Method of cutting laminated glass with laser beams

#21
20060151450
2006-07-13

Glass-plate cutting machine

#22
20060097022
2006-05-11

Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus, and substrate cutting method using the substrate cutting apparatus

#23
20060081101
2006-04-20

Brittle workpiece splitting system and brittle workpiece splitting method

#24
20060065647
2006-03-30

Method for cutting an LCD substrate using coolant having low surface tension and low viscosity properties in which a partial cut, cooling with coolant and then a full cut takes place after coolant is removed

#25
20060022008
2006-02-02

Process and apparatus for scoring a brittle material

#26
20050263503
2005-12-01

Method of breaking a brittle substrate

#27
20050252943
2005-11-17

Apparatus and method for scribing substrate

#28
20050029321
2005-02-10

Method and device for cutting flat work pieces made of a brittle material