ClassID:

245268

Y10T29/4914 - CPC Classification

Classification description:

Metal working; Method of mechanical manufacture; Electrical device making; Conductor or circuit manufacturing; On flat or curved insulated base, e.g., printed circuit, etc.; Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal

Recent Application in this class:
#1
20180303016
2018-10-18

System for performing work on substrate and insertion method

#2
20170325352
2017-11-09

Provisioning of lightweight configurable servers with chassis base and cover designed for nested stacking

#3
20160270273
2016-09-15

Lead wire cut-and-clinch apparatus

#4
20150366096
2015-12-17

Provisioning of lightweight configurable servers with chassis base and cover designed for nested stacking

#5
20150222071
2015-08-06

Component mounting method

#6
20130063798
2013-03-14

Light source device, method of assembling light source device, optical scanning device, and image forming apparatus

#7
20120289088
2012-11-15

Cold headed electric plug arm

#8
20120251038
2012-10-04

Opto-electric hybrid board and manufacturing method therefor

#9
20120195008
2012-08-02

Printed circuit board

#10
20120134112
2012-05-31

Circuit module and electronic device using the same

#11
20120005897
2012-01-12

Method for manufacturing a plug arm

#12
20110302763
2011-12-15

Device for attaching a line to a connecting element

#13
20110225817
2011-09-22

Method of manufacturing a printed circuit board

#14
20110222282
2011-09-15

Illumination device comprising two printed circuit boards

#15
20110164371
2011-07-07

Printed circuit board

#16
20110126409
2011-06-02

Method of manufacturing printed circuit board

#17
20100216283
2010-08-26

Electronic device and lead frame

#18
20100112848
2010-05-06

Cold headed electric plug arm

#19
20080196246
2008-08-21

Bundle cable connector assembly, components, tooling and manufacturing method

#20
20080083971
2008-04-10

Electronic device and lead frame

#21
20080066952
2008-03-20

Method of manufacturing alloy circuit board

#22
20080058503
2008-03-06

Methods of manipulating electrical wall fixtures

#23
20070222820
2007-09-27

Micro-fluid ejection head structure

#24
20070037418
2007-02-15

Process of forming socket contacts

#25
20060223345
2006-10-05

SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES

#26
20060169476
2006-08-03

Dip molded wire connector

#27
20060168804
2006-08-03

Method for providing an electrical connection

#28
20060146092
2006-07-06

Method of making a microfluid ejection head structure

#29
20060130319
2006-06-22

Methods for fabricating thin complaint spring contacts

#30
20060108679
2006-05-25

Integrated circuit with offset pins

#31
20060042079
2006-03-02

Method of making twist-on connector

#32
20060028222
2006-02-09

Interconnect for bumped semiconductor components

#33
20050258849
2005-11-24

Method for testing a chip with a package and for mounting the package on a board

#34
20050223553
2005-10-13

Method for providing an electrical connection

#35
20050056451
2005-03-17

Electrical gripping testing and installation device

#36
20050044704
2005-03-03

Method for producing a crimp ear

#37
20050030145
2005-02-10

On-chip high Q inductor

#38
20050022377
2005-02-03

Method for attaching and for ensuring orientation of components

#39
20050017332
2005-01-27

Method for forming a chip package

#40
20050009216
2005-01-13

Integrated circuit with offset pins