251971 ⎘
Stock material or miscellaneous articles; All metal or with adjacent metals; Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]; Deflectable by temperature change [e.g., thermostat element] One component Cu-based
Carrier-attached copper foil
#2Substrate structure and method of manufacturing the same
#3Carrier-attached copper foil and method for manufacturing the same
#4Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using same
#5Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using same
#6Copper foil for printed circuit
#7Support Layer for Thin Copper Foil
#8Metallic laminate and manufacturing method of light emitting diode package using the same
#9Ultrathin copper foil with carrier and printed circuit board using same
#10Dielectric device and method of manufacturing dielectric device
#11Printed circuit board with multiple metallic layers and method of manufacturing the same
#12Formation method of metal layer on resin layer, printed wiring board, and production method thereof
#13METHOD OF CROSS-LINKING A FILLED POLYMER BASED ON POLYETHYLENE
#14Plated article having metal thin film formed by electroless plating, and manufacturing method thereof
#15Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof
#16Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
#17FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOARD, AND PRODUCTION METHOD THEREOF
#18Formation method of metal layer on resin layer
#19Method of cross-linking a filled polymer based on polyethylene
#20Ultrathin copper foil with carrier and printed circuit board using same
#21Method for manufacturing a composite material including copper foil and support layer
#22Microfabrication using patterned topography and self-assembled monolayers
#23Copper-tin-oxygen alloy plating
#24Copper alloy for electronic machinery and tools and method of producing the same
#25Sintered sliding material, sliding member, connection device and device provided with sliding member
#26Bearing material coated slide member and method for manufacturing the same
#27Sintered sliding member and connecting device
#28Selective application of conductive material to substrates by pick and place of compliant contact arrays
#29Process for forming a composite Ni and Cu alloy plating film
#30Microfabrication using patterned topography and self-assembled monolayers
#31Highly reflective and corrosion-resistant reflective layer film and its sputtering target
#32Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer
#33Method and structure for arresting/preventing fires in titanium clad compositions
#34Tin-coated printed circuit boards with low tendency to whisker formation
#35Copper foil for high-density ultra-fine printed wiring board
#36Copper-tin-oxygen alloy plating
#37Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
#38Metallic-based adhesion materials
#39Copper foil with low profile bond enhancement
#40Formation method of metal layer on resin layer, printed wiring board, and production method thereof
#41Support layer for thin copper foil
#42Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board
#43Selective application of conductive material to circuit boards by pick and place