251973 ⎘
Stock material or miscellaneous articles; All metal or with adjacent metals; Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] Semiconductor component
TEMPLATED FABRICATION OF MATERIALS USING COLD SPRAY DEPOSITION
#2Products and applications for the templated fabrication of materials using cold spray deposition
#3Temperature sensor element
#4Semiconductor devices comprising nickel— and copper—containing interconnects
#5Silicide alloy film for semiconductor device electrode, and production method for silicide alloy film
#6Growth of epitaxial gallium nitride material using a thermally matched substrate
#7Semiconductor devices comprising nickel- and copper-containing interconnects
#8Adjustable process spacing, centering, and improved gas conductance
#9Method for obtaining a bonding surface for direct bonding
#10Adjustable process spacing, centering, and improved gas conductance
#11Process kit shield for plasma enhanced processing chamber
#12Methods of forming interconnects and semiconductor structures
#13Thin film semiconductor material produced through reactive sputtering of zinc target using nitrogen gases
#14Through-hole-vias in multi-layer printed circuit boards
#15Adjustable process spacing, centering, and improved gas conductance
#16Sensor assembly for use in medical position and orientation tracking
#17Process kit shield for plasma enhanced processing chamber
#18Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing
#19Devices comprising coated semiconductor nanocrystal heterostructures
#20Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing
#21Through-hole-vias in multi-layer printed circuit boards
#22Through-hole-vias in multi-layer printed circuit boards
#23Passivation of aluminum nitride substrates
#24ELECTRICAL COMPONENT AND METHOD FOR MANUFACTURING ELECTRICAL COMPONENTS
#25Polymer and polymerization method
#26Adjustable process spacing, centering, and improved gas conductance
#27Thin film semiconductor material produced through reactive sputtering of zinc target using nitrogen gases
#28Nanostructures and process of preparing same
#29Zinc oxide film and method for making
#30Passivation of aluminum nitride substrates
#31Methods and apparatuses for manufacturing cast silicon from seed crystals
#32Graded core/shell semiconductor nanorods and nanorod barcodes
#33Antireflection structures with an exceptional low refractive index and devices containing the same
#34Epitaxial wafer and production method thereof
#35Through hole-vias in multi-layer printed circuit boards
#36Semiconductor nanocrystal heterostructures
#37Polymers
#38Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing
#39Methods and Apparatuses for Manufacturing Cast Silicon from Seed Crystals
#40Methods and Apparatuses for Manufacturing Cast Silicon From Seed Crystals
#41Film growth system and method
#42Methods of forming particle-containing materials
#43Passivation of aluminum nitride substrates
#44Method for the production of a ceramic substrate, and a ceramic substrate
#45Defect-free hybrid orientation technology for semiconductor devices
#46Devices comprising coated semiconductor nanocrystals heterostructures
#47Growth of boron nanostructures with controlled diameter
#48Nanocrystal structures
#49Methods of forming interconnects in a semiconductor structure
#50Bonding pad structure and semiconductor device including the bonding pad structure
#51FLEXIBLE FILM AND DISPLAY DEVICE COMPRISING THE SAME
#52SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD FOR FABRICATING THE SAME
#53Solar absorptive material for a solar selective surface coating
#54Gradient thin film
#55METHOD OF THERMAL STRESS COMPENSATION
#56Circuit system with circuit element and reference plane
#57PRETREATMENT COMPOSITIONS
#58Film growth system and method
#59Zinc oxide film and method for making
#60SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING BOAC/COA
#61COPPER-METALLIZED INTEGRATED CIRCUITS HAVING ELECTROLESS THICK COPPER BOND PADS
#62Thin film semiconductor material produced through reactive sputtering of zinc target using nitrogen gases
#63Circuit materials, multilayer circuits, and methods of manufacture thereof
#64Piezoelectric element and film formation method for crystalline ceramic
#65SELECTIVE ALUMINUM DOPING OF COPPER INTERCONNECTS AND STRUCTURES FORMED THEREBY
#66SEMICONDUCTOR DEVICE HAVING STRUCTURE WITH SUB-LITHOGRAPHY DIMENSIONS
#67Defect-free hybrid orientation technology for semiconductor devices
#68Methods of manufacturing a semiconductor device; method of manufacturing a memory cell; semiconductor device; semiconductor processing device; integrated circuit having a memory cell
#69Layer sequence and method of manufacturing a layer sequence
#70Precursors for porous low-dielectric constant materials for use in electronic devices
#71PREPARATION METHOD OF A COATING OF GALLIUM NITRIDE
#72Graded core/shell semiconductor nanorods and nanorod barcodes
#73PREPARATION METHOD OF A COATING OF GALLIUM NITRIDE
#74LOW TEMPERATURE COFIRED CERAMIC MATERIALS
#75Metal catalyzed selective deposition of materials including germanium and antimony
#76Method for fabricating metal substrates with high-quality surfaces
#77Method of Manufacturing Thin Film, Method of Manufacturing P-Type Zinc Oxide Thin Film and Semiconductor Device
#78Semiconductor chip, semiconductor device and methods for producing the same
#79Refractory Metal Substrate with Improved Thermal Conductivity
#803-dimensional substrate for embodying multi-packages and method of fabricating the same
#81Preparation method of a coating of gallium nitride
#82Preparation method of a coating of gallium nitride
#83Method for forming a pattern on a semiconductor device and semiconductor device resulting from the same
#84Diffusion soldered semiconductor device
#85Ball Limiting Metallurgy, Interconnection Structure Including the Same, and Method of Forming an Interconnection Structure
#86Wafer bonding material with embedded conductive particles
#87Pad Metallisation Process
#88LIGHT ABSORBENT AGENT POLYMER USEFUL FOR ORGANIC ANTI-REFLECTIVE COATING, AND PREPARATION METHOD FOR THE SAME
#89SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD FOR FABRICATING THE SAME
#90Solder layer and electronic device bonding substrate and submount using the same
#91Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures
#92High-temperature solder, high-temperature solder paste and power semiconductor using same
#93Method of forming patterned film
#94Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
#95Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
#96Bonding structure of substrate and component and method of manufacturing the same
#97Nanocrystal structures
#98Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
#99Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology
#100Tantalum and niobium compounds and their use for chemical vapour deposition (CVD)
#101Low voltage CMOS structure with dynamic threshold voltage
#102Copper-metallized integrated circuits having electroless thick copper bond pads
#103Spin-coating apparatus and coated substrates prepared using the same
#104Selective activation of aluminum, copper, and tungsten structures
#105Pretreatment compositions
#106Semiconductor device
#107Methods of forming particle-containing materials
#108Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
#109Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
#110Semiconductor constructions comprising particle-containing materials
#111STRUCTURE AND METHOD OF THERMAL STRESS COMPENSATION
#112Method of manufacturing porous body
#113Member having plasma-resistance for semiconductor manufacturing apparatus and method for producing the same
#114Electrically conductive body including an adhesion promoter layer, and process for depositing an adhesion promoter layer
#115Ceramic substrate, ceramic package for housing light emitting element
#116Optical film
#117Refractory metal substrate with improved thermal conductivity
#118Porous material and production process thereof
#119Solder foil, semiconductor device and electronic device
#120Selective nickel plating of aluminum, copper, and tungsten structures
#121Semiconductor workpiece
#122Semiconductor nanocrystal complexes comprising a metal coating and methods of making same
#123Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device
#124Light absorbent agent polymer useful for organic anti-reflective coating, its preparation method and organic anti-reflective coating composition comprising the same
#125III-V semiconductor nanocrystal complexes and methods of making same
#126Metal matrix composite structure and method
#127Semiconductor processing equipment for forming films of uniform properties on semiconductor substrates
#128Composite material, method for producing same and member using same
#129Superconducting boron nanostructures
#130Underfilling with acid-cleavable acetal and ketal epoxy oligomers
#131Immersion plating and plated structures
#132Vacancy-dominated, defect-free silicon
#133Semiconductor assembly using dual-cure die attach adhesive
#134Lead frame and method of manufacturing the same
#135Method for treating substrates for microelectronics and substrates obtained by said method
#136Method for electroplating on resistive substrates
#137Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
#138Method of cleaning reaction chamber using substrate having catalyst layer thereon
#139Low voltage CMOS structure with dynamic threshold voltage
#140Process for fabricating films of uniform properties on semiconductor devices
#141Methods of forming particle-containing materials
#142Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure
#143Aluminate coating for a silicon containing substrate
#144Graded core/shell semiconductor nanorods and nanorod barcodes
#145Heat spreading thermal interface structure
#146Low-expansion unit, method of manufacturing the same and semiconductor provided with the same
#147Poly(arylene ether)s bearing grafted hydroxyalkyls for use in electrically conductive adhesives
#148Laminated sheet
#149Semiconductor light emitting element and method for fabricating the same