ClassID:

251975

Y10T428/12542 - CPC Classification

Classification description:

Stock material or miscellaneous articles; All metal or with adjacent metals; Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component More than one such component

Sub-classes:
Recent Application in this class:
#1
20240286952
2024-08-29

Solar Control Coating With Discontinuous Metal Layer

#2
20240140860
2024-05-02

Solar control coatings providing increased absorption or tint

#3
20230092570
2023-03-23

Method for conditioning semiconductor processing chamber components

#4
20230029350
2023-01-26

METALLIC COATED SUBSTRATES

#5
20220332634
2022-10-20

Solar control coatings providing increased absorption or tint

#6
20220144697
2022-05-12

Solar control coating with discontinuous metal layer

#7
20220010429
2022-01-13

HYDROGEN PERMEATION BARRIER COATINGS AND METHODS OF MAKING THE SAME

#8
20210381905
2021-12-09

Temperature sensor element

#9
20200255332
2020-08-13

Solar control coatings providing increased absorption or tint

#10
20200216353
2020-07-09

Solar control coating with discontinuous metal layer

#11
20190305250
2019-10-03

Encapsulation structure, electronic device and encapsulation method

#12
20190276353
2019-09-12

Solar control coatings providing increased absorption or tint

#13
20190276352
2019-09-12

Solar control coating with discontinuous metal layer

#14
20190110364
2019-04-11

Multilayer laminate and method for producing multilayer printed wiring board using same

#15
20180154609
2018-06-07

Thin diamond film bonding providing low vapor pressure at high temperature

#16
20180148371
2018-05-31

Solar control coatings with discontinuous metal layer

#17
20170341977
2017-11-30

Solar control coatings providing increased absorption or tint

#18
20170034905
2017-02-02

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

#19
20160168683
2016-06-16

Methods for producing a pre-lacquered metal sheet having Zn—Al—Mg coatings and corresponding metal sheet

#20
20160089740
2016-03-31

Bonding method for thin film diamond providing low vapor pressure at high temperature

#21
20150369090
2015-12-24

Highly wear-resistant valve seat for use in internal combustion engine

#22
20150208496
2015-07-23

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

#23
20150104569
2015-04-16

Barrier layers for silver reflective coatings and HPC workflows for rapid screening of materials for such barrier layers

#24
20150079419
2015-03-19

Process for manufacturing a recovery annealed coated steel substrate for packaging applications and a packaging steel product produced thereby

#25
20150044500
2015-02-12

Process for manufacturing a recovery annealed coated steel substrate for packaging applications and a packaging steel product produced thereby

#26
20150044497
2015-02-12

Thin diamond film bonding providing low vapor pressure at high temperature

#27
20150041674
2015-02-12

Chemically stable visible light photoemission electron source

#28
20150037604
2015-02-05

Polymer coated substrate for packaging applications and a method for producing said coated substrate

#29
20140231300
2014-08-21

Material impermeable to humidity and oxygen for packaging dietary products, cosmetics and medicinal specialities

#30
20130288071
2013-10-31

Gold or silver metallized plastic product free of any gold and silver element and method for manufacturing it

#31
20130244052
2013-09-19

Forming a Metallic Cladding on an Architectural Component

#32
20130170059
2013-07-04

MIRROR WITH OPTIONAL PERMANENT PROTECTIVE FILM, AND/OR METHODS OF MAKING THE SAME

#33
20130022836
2013-01-24

BRAZED COATED DIAMOND-CONTAINING MATERIALS

#34
20130022835
2013-01-24

COATED ARTICLE HAVING ANTIBACTERIAL EFFECT AND METHOD FOR MAKING THE SAME

#35
20120318568
2012-12-20

ELECTRONIC CIRCUIT, METHOD FOR FORMING SAME, AND COPPER CLAD LAMINATE FOR FORMING ELECTRONIC CIRCUIT

#36
20120263944
2012-10-18

Rotation tool

#37
20120244381
2012-09-27

COATED ARTICLE HAVING ANTIBACTERIAL EFFECT AND METHOD FOR MAKING THE SAME

#38
20120244380
2012-09-27

Coated article having antibacterial effect and method for making the same

#39
20120244379
2012-09-27

Coated article having antibacterial effect and method for making the same

#40
20120244378
2012-09-27

Coated article having antibacterial effect and method for making the same

#41
20120189869
2012-07-26

COATED ARTICLE HAVING ANTIBACTERIAL EFFECT AND METHOD FOR MAKING THE SAME

#42
20120148863
2012-06-14

Insulating glass unit with crack-resistant low-emissivity suspended film

#43
20120107642
2012-05-03

Metal-ceramic substrate and method for manufacturing such a substrate

#44
20120070955
2012-03-22

Methods of forming conductive contacts to source/drain regions and methods of forming local interconnects

#45
20120064363
2012-03-15

Coated article and method of making the same

#46
20120003499
2012-01-05

Flexible board

#47
20110248073
2011-10-13

High temperature seal for joining ceramic components such as cells in a ceramic oxygen generator

#48
20110236715
2011-09-29

Solar control coatings with discontinuous metal layer

#49
20110212312
2011-09-01

Coated article with sputter-deposited transparent conductive coating capable of surviving harsh environments, and method of making the same

#50
20110206942
2011-08-25

Connections between a monolithic metal component and a continuous-fiber reinforced laminate component, and method for production of the same

#51
20110177349
2011-07-21

Process for the modification of substrate surfaces through the deposition of amorphous silicon layers followed by surface functionalization with organic molecules and functionalized structures

#52
20110171137
2011-07-14

Nanostructures and process of preparing same

#53
20110124185
2011-05-26

Graded core/shell semiconductor nanorods and nanorod barcodes

#54
20110048925
2011-03-03

Coated article with sputter-deposited transparent conductive coating capable of surviving harsh environments, and method of making the same

#55
20100255342
2010-10-07

Metal plating using seed film

#56
20100247883
2010-09-30

Corrosion resistant coating for copper substrate

#57
20100224303
2010-09-09

Method to build robust mechanical structures on substrate surfaces

#58
20100209729
2010-08-19

Coated article with sputter-deposited transparent conductive coating capable of surviving harsh environments, and method of making the same

#59
20100209663
2010-08-19

Roofing underlay screen

#60
20100203351
2010-08-12

HIGH STRENGTH COMPOSITE MATERIALS AND RELATED PROCESSES

#61
20090321210
2009-12-31

Coatings for clutch plates

#62
20090317708
2009-12-24

PLASTIC LAMINATE FILM

#63
20090309145
2009-12-17

METHOD AND SYSTEM FOR PATTERNING OF MAGNETIC THIN FLIMS USING GASEOUS TRANSFORMATION

#64
20090246114
2009-10-01

Microporous molecular separation membrane with high hydrothermal stability

#65
20090092850
2009-04-09

Extreme low resistivity light attenuation anti-reflection coating structure and method for manufacturing the same

#66
20090092825
2009-04-09

Extreme low resistivity light attenuation anti-reflection coating structure and method for manufacturing the same

#67
20090068781
2009-03-12

Method of manufacture for microelectromechanical devices

#68
20090045516
2009-02-19

Top layers of metal for high performance IC's

#69
20090032956
2009-02-05

Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics

#70
20090029178
2009-01-29

Process for the modification of substrate surfaces through the deposition of amorphous silicon layers followed by surface functionalization with organic molecules and functionalized structures

#71
20080317998
2008-12-25

Wear-resistant coating

#72
20080230585
2008-09-25

Different materials bonded member and production method thereof

#73
20080188063
2008-08-07

Graded core/shell semiconductor nanorods and nanorod barcodes

#74
20080146020
2008-06-19

Top layers of metal for high performance IC's

#75
20080142981
2008-06-19

Top layers of metal for high performance IC's

#76
20080142980
2008-06-19

Top layers of metal for high performance IC's

#77
20080090094
2008-04-17

Interlayer dielectric film

#78
20080083988
2008-04-10

Top layers of metal for high performance IC's

#79
20080083987
2008-04-10

Top layers of metal for high performance IC's

#80
20080050913
2008-02-28

Top layers of metal for high performance IC's

#81
20080048329
2008-02-28

Top layers of metal for high performance IC's

#82
20080020227
2008-01-24

Method to build robust mechanical structures on substrate surfaces

#83
20080009142
2008-01-10

EVAPORATION CONTROL USING COATING

#84
20070293037
2007-12-20

Top layers of metal for high performance IC's

#85
20070293036
2007-12-20

Top layers of metal for high performance IC's

#86
20070290368
2007-12-20

Top layers of metal for high performance IC's

#87
20070290358
2007-12-20

Top layers of metal for high performance IC's

#88
20070290357
2007-12-20

Top layers of metal for high performance IC's

#89
20070290356
2007-12-20

Top layers of metal for high performance IC's

#90
20070290355
2007-12-20

Top layers of metal for high performance IC's

#91
20070290354
2007-12-20

Top layers of metal for high performance IC's

#92
20070290353
2007-12-20

Top layers of metal for high performance IC's

#93
20070290352
2007-12-20

Top layers of metal for high performance IC's

#94
20070290351
2007-12-20

Top layers of metal for high performance IC's

#95
20070290350
2007-12-20

Top layers of metal for high performance IC's

#96
20070290349
2007-12-20

Top layers of metal for high performance IC's

#97
20070290348
2007-12-20

Top layers of metal for high performance IC's

#98
20070288880
2007-12-13

Top layers of metal for high performance IC's

#99
20070284753
2007-12-13

Top layers of metal for high performance IC's

#100
20070284752
2007-12-13

Top layers of metal for high performance IC's

#101
20070284751
2007-12-13

Top layers of metal for high performance IC's

#102
20070284750
2007-12-13

Top layers of metal for high performance IC's

#103
20070284739
2007-12-13

Top layers of metal for high performance IC's

#104
20070281468
2007-12-06

Top layers of metal for high performance IC's

#105
20070281467
2007-12-06

Top layers of metal for high performance IC's

#106
20070281463
2007-12-06

Top layers of metal for high performance IC's

#107
20070281458
2007-12-06

Top layers of metal for high performance IC's

#108
20070278691
2007-12-06

Top layers of metal for high performance IC's

#109
20070278690
2007-12-06

Top layers of metal for high performance IC's

#110
20070278689
2007-12-06

Top layers of metal for high performance IC's

#111
20070278688
2007-12-06

Top layers of metal for high performance IC's

#112
20070278687
2007-12-06

Top layers of metal for high performance IC's

#113
20070278686
2007-12-06

Top layers of metal for high performance IC's

#114
20070278685
2007-12-06

Top layers of metal for high performance IC's

#115
20070278684
2007-12-06

Top layers of metal for high performance IC's

#116
20070278679
2007-12-06

Top layers of metal for high performance IC's

#117
20070273041
2007-11-29

Top layers of metal for high performance IC's

#118
20070273040
2007-11-29

Top layers of metal for high performance IC's

#119
20070273039
2007-11-29

Top layers of metal for high performance IC's

#120
20070273038
2007-11-29

Top layers of metal for high performance IC's

#121
20070273037
2007-11-29

Top layers of metal for high performance IC's

#122
20070273036
2007-11-29

Top layers of metal for high performance IC's

#123
20070273035
2007-11-29

Top layers of metal for high performance IC's

#124
20070273034
2007-11-29

Top layers of metal for high performance IC's

#125
20070273033
2007-11-29

Top layers of metal for high performance IC's

#126
20070273032
2007-11-29

Top layers of metal for high performance IC's

#127
20070267714
2007-11-22

Top layers of metal for high performance IC's

#128
20070262460
2007-11-15

Top layers of metal for high performance IC's

#129
20070262459
2007-11-15

Top layers of metal for high performance IC's

#130
20070262458
2007-11-15

Top layers of metal for high performance IC's

#131
20070262457
2007-11-15

Top layers of metal for high performance IC's

#132
20070262456
2007-11-15

Top layers of metal for high performance IC's

#133
20070262455
2007-11-15

Top layers of metal for high performance IC's

#134
20070190351
2007-08-16

Wear-resistant coating and a component having a wear-resistant coating

#135
20070077441
2007-04-05

Metal plating using seed film

#136
20070072008
2007-03-29

Metal strip product

#137
20070063245
2007-03-22

Metal plating using seed film

#138
20070042205
2007-02-22

Metal strip product

#139
20070042204
2007-02-22

Metal strip product

#140
20070034912
2007-02-15

Low voltage CMOS structure with dynamic threshold voltage

#141
20070034605
2007-02-15

Evaporation control using coating

#142
20070015359
2007-01-18

Methods of forming conductive contacts to source/drain regions and methods of forming local interconnects

#143
20070015358
2007-01-18

Methods of forming conductive contacts to source/drain regions and methods of forming local interconnects

#144
20060246697
2006-11-02

Methods of forming conductive contacts to source/drain regions and methods of forming local interconnects

#145
20060118960
2006-06-08

Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics

#146
20060063665
2006-03-23

Catalyst system with improved corrosion resistance

#147
20060051955
2006-03-09

Top layers of metal for high performance IC's

#148
20060046473
2006-03-02

Methods of forming conductive contacts to source/drain regions and methods of forming local interconnects

#149
20060043594
2006-03-02

Top layers of metal for high performance IC's

#150
20060012049
2006-01-19

Top layers of metal for high performance IC's

#151
20050266612
2005-12-01

Top layers of metal for high performance IC's

#152
20050260849
2005-11-24

Top layers of metal for high performance IC's

#153
20050260432
2005-11-24

Composite material

#154
20050255408
2005-11-17

Method to build robust mechanical structures on substrate surfaces

#155
20050249966
2005-11-10

Method of manufacture for microelectromechanical devices

#156
20050245067
2005-11-03

Top layers of metal for high performance IC's

#157
20050218411
2005-10-06

Hafnium nitride buffer layers for growth of GaN on silicon

#158
20050214564
2005-09-29

Process for manufacturing device having honeycomb-structure thermal barrier coating

#159
20050208757
2005-09-22

Top layers of metal for high performance IC's

#160
20050200023
2005-09-15

Top layers of metal for high performance IC's

#161
20050170645
2005-08-04

Metal plating using seed film

#162
20050158991
2005-07-21

Metal plating using seed film

#163
20050148126
2005-07-07

Low voltage CMOS structure with dynamic threshold voltage

#164
20050145899
2005-07-07

Manufacturing method of semiconductor device

#165
20050092818
2005-05-05

High temperature seal for joining ceramic components such as cells in a ceramic oxygen generator

#166
20050079647
2005-04-14

Method and system for patterning of magnetic thin films using gaseous transformation to transform a magnetic portion to a non-magnetic portion

#167
20050064215
2005-03-24

Metal strip product

#168
20050064214
2005-03-24

Metal strip product

#169
20050054004
2005-03-10

Graded core/shell semiconductor nanorods and nanorod barcodes

#170
20050039459
2005-02-24

High temperature splash plate for temperature reduction by optical reflection and process for manufacturing