ClassID:

252128

Y10T428/238 - CPC Classification

Classification description:

Stock material or miscellaneous articles; Sheet including cover or casing; Noninterengaged fibered material encased [e.g., mat, batt, etc.] Metal cover or casing

Recent Application in this class:
#1
20190255804
2019-08-22

Inorganic fiber laminate, vacuum insulation material using same, and manufacturing method for same

#2
20130295809
2013-11-07

Heat resistance using titanium dioxide nanofibers

#3
20110030892
2011-02-10

Vacuum heat insulating material, method of producing vacuum heat insulating material, and heat insulating box body using vacuum heat insulating material

#4
20100285264
2010-11-11

Heat resistance using titanium dioxide nanofibers

#5
20100155120
2010-06-24

Thermosetting oligomer or polymer, thermosetting resin composition including the oligomer or polymer, and printed circuit board using the composition

#6
20100086766
2010-04-08

SHIELDING COMPONENT, IN PARTICULAR A HEAT SHIELD

#7
20090186176
2009-07-23

Vacuum Heat Insulating Material, Method of Producing Vacuum Heat Insulating Material, and Heat Insulating Box Body Using Vacuum Heat Insulating Material

#8
20090152519
2009-06-18

Light weight metal fire door core

#9
20090142545
2009-06-04

Method for treating nanofiber material and composition of nanofiber material

#10
20090100778
2009-04-23

FACED FIBERGLASS BOARD WITH IMPROVED SURFACE TOUGHNESS

#11
20080193703
2008-08-14

Composition with wooden quality, and a method of its preparation

#12
20080075912
2008-03-27

Shielding component, in particular a heat shield

#13
20060228522
2006-10-12

Mineral fibre-based sandwich structure and method for the production thereof

#14
20050229518
2005-10-20

Faced fiberglass board with improved surface toughness

#15
20050151287
2005-07-14

Process for preparing a non-woven fibrous web

#16
20050136774
2005-06-23

Process for preparing a non-woven fibrous web

#17
20050118384
2005-06-02

Multicompartment structure for insulation and other materials

#18
20050022375
2005-02-03

Method of a supporting a CGA integrated package on a circuit board with improved shock and vibration isolation