ClassID:

252380

Y10T428/2874 - CPC Classification

Classification description:

Stock material or miscellaneous articles; Web or sheet containing structurally defined element or component and having an adhesive outermost layer; Adhesive compositions including aldehyde or ketone condensation polymer [e.g., urea formaldehyde polymer, melamine formaldehyde polymer, etc.]

Recent Application in this class:
#1
20210040356
2021-02-11

Multi-layered anisotropic conductive adhesive having conductive fabric and preparation thereof

#2
20180273809
2018-09-27

Multi-layered anisotropic conductive adhesive having conductive fabric and preparation thereof

#3
20150353793
2015-12-10

Temporary adhesive material for wafer processing, wafer processing laminate, and method for manufacturing thin wafer using same

#4
20140311644
2014-10-23

Adhesive composition and pneumatic tire using same

#5
20140227499
2014-08-14

Film for tire inner liner and method for manufacturing the same

#6
20140162060
2014-06-12

Strippable adhesion composition and uses thereof

#7
20130233485
2013-09-12

Reactive conductive pressure-sensitive adhesive tape

#8
20120295104
2012-11-22

Two part polyurea-urethane adhesive with elevated high temperature storage modulus

#9
20120240986
2012-09-27

FLUOROPOLYMER COATED FILMS USEFUL FOR PHOTOVOLTAIC MODULES

#10
20120231689
2012-09-13

FIBER, FIBER AGGREGATE AND ADHESIVE HAVING THE SAME

#11
20120231583
2012-09-13

DIE-BONDING FILM AND USE THEREOF

#12
20120231260
2012-09-13

FIBER, FIBER AGGREGATE AND ADHESIVE HAVING THE SAME

#13
20120228805
2012-09-13

Fiber, fiber aggregate and adhesive having the same

#14
20120141759
2012-06-07

Filled polyimide films and coverlays comprising such films

#15
20120111469
2012-05-10

Adhesive composition and pneumatic tire using same

#16
20120024352
2012-02-02

Fluoropolymer coated films useful for photovoltaic module

#17
20110262760
2011-10-27

Bonding wood composites with resin solids-fortified phenol-formaldehyde resin

#18
20110210407
2011-09-01

DOUBLE-FACED ADHESIVE FILM AND ELECTRONIC COMPONENT MODULE USING SAME

#19
20110147052
2011-06-23

POLYIMIDE FILM

#20
20100289158
2010-11-18

Adhesive film, dicing die bonding film and semiconductor device using the same

#21
20100261314
2010-10-14

THERMOSETTING DIE BONDING FILM

#22
20100167615
2010-07-01

Method for surface hardening substances by application of particularly transparent polymethacrylate layers

#23
20090293944
2009-12-03

Fluoropolymer coated films useful for photovoltaic modules

#24
20090260677
2009-10-22

Fluoropolymer coated films useful for photovoltaic modules

#25
20090078453
2009-03-26

Polyimide Film

#26
20080248298
2008-10-09

Method for surface hardening substances by application of particularly transparent polymethacrylate layers

#27
20070172669
2007-07-26

Heat shrinkable film with (meth)acrylate resin curable adhesive

#28
20070154704
2007-07-05

Fluoropolymer coated films useful for photovoltaic modules

#29
20070111622
2007-05-17

Fiber mat and process for making same

#30
20070042659
2007-02-22

Fiber mat and process for making same

#31
20060165923
2006-07-27

Adhesive composition and thermal transfer sheet

#32
20060105167
2006-05-18

Adhesive sheet and stacking material

#33
20060078716
2006-04-13

Decorative glass laminate containing an ultraviolet printed image thereon and a method for preparing said decorative glass laminate

#34
20050101734
2005-05-12

Acrylic adhesive sheet