INTERLAYER FOR LITHOGRAPHIC PLATES

Intermediate layer material and composite laminate

Demountable interconnect structure

Composite materials with blend of thermoplastic particles

Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability

Laminate made from epoxy resin, styrene-maleic anhydride copolymer and crosslinkers

Formaldehyde-free adhesives and lignocellulosic composites made from the adhesives

Two-component adhesive of epoxy resin/polyol pack and polyamide/aliphatic amine/tertiary amine pack

Method of making electrical devices having an oxygen barrier coating

Method for producing a device and device

Hybrid composite wafer carrier for wet clean equipment

Thermally B-Stageable Composition for Rapid Electronic Device Assembly

Capillary-flow underfill compositions, packages containing same, and systems containing same

Adhesive film composition, associated dicing die bonding film, and die package

Low odor, fast cure, toughened epoxy adhesive

Composite Layered Plate for Fire Doors

Functionalized polyphenylene ether

Coated package with filter profile

Pre-impregnated composite materials with improved performance

Heat-conductive dielectric polymer material and heat dissipation substrate containing the same

Aqueous resinous binders

Aqueous resinous binders

Flexible hydraulic compositions

Circuit-connecting material and circuit terminal connected structure and connecting method

TREATMENT OF SEMICONDUCTOR WAFERS

Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package

Method of making coated articles and coated articles made thereby

Circuit-connecting material and circuit terminal connected structure and connecting method

Circuit-connecting material and circuit terminal connected structure and connecting method

Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards

Multi-level layer

Conductive adhesive rework method

Preparation of laminated composite substrates using coated oriented polymeric film

Circuit-connecting material and circuit terminal connected structure and connecting method

Epoxy resin, styrene-maleic anhydride copolymer and crosslinking agent

Photocromic primer composition having high impact resistance and transparent material coated with the same

Conductive adhesive composition

Coating system for cement composite articles

Electrically disbondable compositions and related methods

Adhesive composition

Method of sealing core material

Resin composition, prepreg and metal-foil-clad laminate

Aqueous primer composition, method of surface treating by using the same and laminated structure thereof

Spring coated with powder coating of epoxy resin and thermoplastic resin

Lead-free electrodeposition coating composition and coated article

Multilayer laminates comprising twisted nematic liquid crystals

Resin composition, resin cured product, and liquid discharge head

Adhesive for bonding circuit members, circuit board and process for its production

Interlayers comprising stabilized infrared absorbing agents

Adhesive compositions for flexible circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof

Highly durable spring and method for coating same

High strength multilayer laminates comprising twisted nematic liquid crystals

Heat resistant masking tape

Ultraviolet resistant coating for articles

Substrate for flexible printed wiring board and method for manufacturing the same

Ionomer laminates, composite articles, and processes for making the same

Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same

Protective articles

Photo cation polymerizable resin composition and surface protective material for optical disk

Interpenetrating polymer network as coating for metal substrate and method therefor

Curable polymeric water based coating compositions and resulting coatings with barrier properties for gases and laminate structures

Wood panel

Epoxy primer layer for fuser belts

Primer composition for high temperature belts

Composite coating systems for air handling systems

Layer of reaction product of epoxy and phosphorus materials and curing agent on substrate

Tie-layer materials for use with ionomer-based films and sheets as skins on other materials

Adhesive attachment of a first member to a second member

Magnetic encoder

Metal oxides and hydroxides as corrosion inhibitor pigments for a chromate-free corrosion resistant epoxy primer

Wood preservatives

Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device

Treatment of semiconductor wafers

Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

Ultraviolet light curing compositions for composite repair

Radiopaque polymers for circuit board assembly

Transparent conductor

Pressure sensitive adhesive tapes from cationic cure adhesives

Two-component adhesive of epoxy resins and amine compound

Underfill encapsulant for wafer packaging and method for its application

Thermally conductive resin sheet and power module using the same

Production of optical elements

Slip-resistant coatings and substrates coated therewith

Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same

Adhesive containing a filler, and a method for attaching and manufacturing a thin plate using the same

Ultraviolet light curing compositions for composite repair

Surface modification of substrates

Anhydride polymers for use as curing agents in epoxy resin-based underfill material

Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body

Aqueous phenoxy adhesives

Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg

Radiation curable printing media, transfers produced therewith and process for the production of ceramic decoration

Anisotropic conductive adhesive composition

Prepreg and laminate and printed wiring board using the same

Ultraviolet light curing compositions for composite repair

Lens and method of manufacturing lens

Underfill of resin and sulfonic acid-releasing thermally cleavable compound

Circuit-connecting material and circuit terminal connected structure and connecting method

Electronic circuit including circuit-connecting material

Flexible hydraulic compositions

Electrical devices having an oxygen barrier coating

Method for coating package with a filter profile

Circuit-connecting material and circuit terminal connected structure and connecting method

Organic electroluminescent element, material for positive hole injecting layer, and organic electroluminescent display

Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin

Viscous chemical anchoring adhesive

Aqueous primer surfacer compositions

Co-curable compositions

Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications

Hybrid adhesives, articles, and methods

Abrasion resistant coatings

Indicators for early detection of potential failures due to water exposure of polymer-clad fiberglass

Thermal interface adhesive and rework

Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same

Epoxy resin, SMA copolymer and bis-maleimidetriazine resin

Method of Forming Multilayer Coating Films and Multilayer Coating Films

One way bullet-resistant transparent panel

High Tcoatings

Underfill fluxing curative

Photochromic optical article

Decoration of a multi-layered device, especially a (winter) sports apparatus

Resin curable with actinic radiation, process for the production thereof, and photocurable and thermosetting resin composition

Nanoporous laminates

Poly(arylene ether) adhesive compositions

Combinations of resin compositions and methods of use thereof

Underfill composition and packaged solid state device

Resin curable with actinic radiation, process for the production thereof, and photocurable and thermosetting resin composition

Method for achieving primerless windshield sealant adhesion over a carbamate clearcoat

Two-pack type adhesive

Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross linking agent

Resin composition, prepreg and laminate using the composition

Article with composite hard coat layer and method for forming composite hard coat layer

Plastic film with a multilayered interference coating

Method for connecting two bodies

Coating composition

Resin composition for encapsulating semiconductor device

Chemically-doped composite insulator for early detection of potential failures due to exposure of the fiberglass rod

Corrosion and alkali-resistant compositions and methods for using the same

Oligomeric, hydroxy-terminated phosphonates

Corrosion and alkali-resistant compositions and methods for using the same

Smooth board and process for preparing a smooth board

Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg

N-substituted arylamino-phenol-formaldehyde condensates

Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards