Inventor profile of:

Michael R. Pinter

City:

Spokane, Washington

Country:

United States

Published Applications:

14

Last publication date:

2021-04-01

Top Assignees for applications by Michael R. Pinter

The entities that hold a legal rights for patent applications filed by inventor Pinter Michael R.:

Recent patent applications by Pinter Michael R.

Michael R. Pinter from Spokane, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-04-01
US20210095370A1
Chemistry; metallurgy

Chalcogenide sputtering target and method of making the same

#2 | 2019-04-18
US20190112702A1
Chemistry; metallurgy

Copper manganese sputtering target

#3 | 2018-11-29
US20180339369A1
Performing operations; transporting

Lead-free solder compositions

#4 | 2018-04-26
US20180113099A1
Physics

A VOID FREE INCLUSION-BASED REFERENCE STANDARD FOR NONDESTRUCTIVE TESTS AND METHOD OF MAKING

#5 | 2018-04-05
US20180094340A1
Chemistry; metallurgy

High strength aluminum alloy backing plate and methods of making

#6 | 2018-02-22
US20180051370A1
Chemistry; metallurgy

Chalcogenide sputtering target and method of making the same

#7 | 2017-01-12
US20170008131A1
Performing operations; transporting

Lead-free solder compositions

#8 | 2015-01-01
US20150004427A1
Performing operations; transporting

LEAD-FREE SOLDER COMPOSITIONS

#9 | 2013-02-21
US20130045131A1
Performing operations; transporting

Lead-Free Solder Compositions

#10 | 2008-05-15
US20080112878A1
Chemistry; metallurgy

Alloy casting apparatuses and chalcogenide compound synthesis methods

#11 | 2007-05-03
US20070099332A1
Chemistry; metallurgy

Chalcogenide PVD components and methods of formation

#12 | 2006-03-23
US20060062686A1
Chemistry; metallurgy

PVD target support members and methods of making

#13 | 2005-12-22
US20050279637A1
Chemistry; metallurgy

Methods of forming target/backing plate assemblies comprising ruthenium, methods of electrolytically processing ruthenium, and container-shaped physical vapor deposition targets comprising ruthenium

#14 | 2005-01-06
US20050000821A1
Electricity

Anodes for electroplating operations, and methods of forming materials over semiconductor substrates

InventorID:

100115 ⎘