Boise, Idaho
United States
4
2022-05-12
The entities that hold a legal rights for patent applications filed by inventor Hooper Andy E.:
Andy E. Hooper from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor device release during pick and place operations, and associated systems and methods
#2 | 2019-10-10Semiconductor device release during pick and place operations, and associated systems and methods
#3 | 2018-04-12System for handling semiconductor dies
#4 | 2014-12-18Underfill-accommodating heat spreaders and related semiconductor device assemblies and methods
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