Chandler, Arizona
United States
19
2014-12-18
The entities that hold a legal rights for patent applications filed by inventor LYTLE WILLIAM H.:
WILLIAM H. LYTLE from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Warp compensated electronic assemblies
#2 | 2011-09-08Method for singulating electronic components from a substrate
#3 | 2011-05-26Method for releasing a microelectronic assembly from a carrier substrate
#4 | 2010-05-06Integrated circuit package formation
#5 | 2010-04-01Method of forming a package with exposed component surfaces
#6 | 2010-04-01Method of forming a semiconductor package including two devices
#7 | 2009-07-02Electronic assembly manufacturing method
#8 | 2009-03-05Method of packaging an integrated circuit die
#9 | 2009-03-05Method for forming a packaged semiconductor device
#10 | 2009-01-08Flexible carrier for high volume electronic package fabrication
#11 | 2008-07-31METHOD FOR FORMING A MICROELECTRONIC ASSEMBLY INCLUDING ENCAPSULATING A DIE USING A SACRIFICIAL LAYER
#12 | 2007-09-13Warp compensated package and method
#13 | 2006-06-15Flexible carrier and release method for high volume electronic package fabrication
#14 | 2005-10-11Wafer level MEMS packaging
#15 | 2005-09-27Low cost fabrication and assembly of lid for semiconductor devices
#16 | 2005-05-19Corrosion-resistant bond pad and integrated device
#17 | 2005-01-06Activation plate for electroless and immersion plating of integrated circuits
#18 | 2005-01-06Corrosion-resistant copper bond pad and integrated device
#19 | 2005-01-06Corrosion-resistant bond pad and integrated device
1005115 ⎘