Newark, Delaware
United States
46
2026-02-26
The entities that hold a legal rights for patent applications filed by inventor Guo Yi:
Yi Guo from Newark, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Soluble Metal Oxide Anion CMP Slurry
#2 | 2026-01-01Functionalized Metal and Nitride CMP Slurry
#3 | 2025-07-10Functionalized Carbon Particle CMP Slurry Dispersion
#4 | 2025-07-10Functionalized Carbon Particle CMP Slurry
#5 | 2025-01-16CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD FOR PREVENTING POLISHING PAD GROOVE CLOGGING
#6 | 2023-03-30METHOD OF ENHANCING THE REMOVAL RATE OF POLYSILICON
#7 | 2023-03-16Polishing composition and method of polishing a substrate having enhanced defect reduction
#8 | 2022-11-03Polishing composition and method of polishing a substrate having enhanced defect reduction
#9 | 2022-10-18Method of enhancing the removal rate of polysilicon
#10 | 2022-06-09Chemical mechanical polishing composition containing composite silica particles, method of making the silica composite particles and method of polishing a substrate
#11 | 2022-03-15Polishing composition and method of polishing a substrate having enhanced defect inhibition
#12 | 2021-10-21Chemical mechanical polishing composition containing composite silica particles, method of making the silica composite particles and method of polishing a substrate
#13 | 2021-06-03Neutral to alkaline chemical mechanical polishing compositions and methods for tungsten
#14 | 2021-03-11Method of selective chemical mechanical polishing cobalt, zirconium oxide, poly-silicon and silicon dioxide films
#15 | 2020-07-30Chemical mechanical polishing compositions having stabilized abrasive particles for polishing dielectric substrates
#16 | 2020-07-30Acid polishing composition and method of polishing a substrate having enhanced defect inhibition
#17 | 2020-02-25Chemical mechanical polishing pad and polishing method
#18 | 2020-01-09Neutral to alkaline chemical mechanical polishing compositions and methods for tungsten
#19 | 2019-11-05Chemical mechanical polishing pad and polishing method
#20 | 2019-09-19Polishing composition and method of polishing a substrate having enhanced defect inhibition
#21 | 2019-03-28Aqueous silica slurry and amine carboxylic acid compositions selective for nitride removal in polishing and methods of using them
#22 | 2019-03-28Aqueous low abrasive silica slurry and amine carboxylic acid compositions for use in shallow trench isolation and methods of making and using them
#23 | 2018-11-06Low-abrasive CMP slurry compositions with tunable selectivity
#24 | 2018-04-05CMP POLISHING COMPOSITION COMPRISING POSITIVE AND NEGATIVE SILICA PARTICLES
#25 | 2017-10-31Aqueous compositions of stabilized aminosilane group containing silica particles
#26 | 2017-10-10Aqueous compositions of low abrasive silica particles
#27 | 2017-01-03Method of polishing semiconductor substrate
#28 | 2016-11-01Chemical mechanical polishing method
#29 | 2016-03-22Method of polishing semiconductor substrate
#30 | 2015-12-31Chemical mechanical polishing composition and method for polishing tungsten
#31 | 2015-03-19Low defect chemical mechanical polishing composition
#32 | 2013-05-02Method of polishing using tunable polishing formulation
#33 | 2013-05-02Method of polishing a substrate
#34 | 2013-02-21Method for chemical mechanical polishing tungsten
#35 | 2012-11-01Chemical mechanical polishing composition and method for polishing phase change alloys
#36 | 2012-11-01Chemical mechanical polishing composition and method for polishing germanium-antimony-tellurium alloys
#37 | 2012-10-11Stabilized chemical mechanical polishing composition and method of polishing a substrate
#38 | 2012-03-22Slurry composition having tunable dielectric polishing selectivity and method of polishing a substrate
#39 | 2012-03-22Stabilized, concentratable chemical mechanical polishing composition and method of polishing a substrate
#40 | 2011-12-15Stabilized chemical mechanical polishing composition and method of polishing a substrate
#41 | 2011-10-06Method of chemical mechanical polishing a substrate with polishing composition adapted to enhance silicon oxide removal
#42 | 2011-09-22Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride
#43 | 2011-09-22Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride
#44 | 2011-09-22Method of polishing a substrate comprising polysilicon, silicon oxide and silicon nitride
#45 | 2011-05-12Chemical mechanical polishing composition and methods relating thereto
#46 | 2010-11-04Method for chemical mechanical polishing a substrate
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