Tokyo
Japan
9
2023-08-03
The entities that hold a legal rights for patent applications filed by inventor Nakamura Eiji:
Eiji Nakamura from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Prevention of dripping of material for material injection
#2 | 2023-04-06Surface-coated cutting tool
#3 | 2022-06-23Prevention of dripping of material for material injection
#4 | 2022-03-03Chemical reaction network for estimating concentration of chemical species based on an identified pattern of output chemical species
#5 | 2018-09-13Sputtering apparatus and substrate processing apparatus
#6 | 2015-09-17Sputtering apparatus and substrate processing apparatus
#7 | 2015-09-17Sputtering apparatus and substrate processing apparatus
#8 | 2014-12-25Body Composition Measuring Apparatus
#9 | 2005-11-10Tire
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