Bloomington, Minnesota
United States
7
2015-09-17
The entities that hold a legal rights for patent applications filed by inventor Li Leping:
Leping Li from Bloomington, US has applied for patents for these inventions. The list has both pending applications and granted patents:
PROBE TIP STRUCTURE FOR BONDINGLESS ELECTRONIC LAPPING GUIDE CONNECTIONS
#2 | 2015-04-23Lapping head with a sensor device on the rotating lapping head
#3 | 2015-03-26Row bar thickness measurement device, system and methods
#4 | 2015-03-19Work piece contact pad with centering feature
#5 | 2015-01-08Lapping carrier
#6 | 2014-07-01Ambient temperature ball bond
#7 | 2012-03-01SELF-ASSEMBLED MONOLAYER
1025654 ⎘