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Inventor profile of:

Yuka Sato

City:

Country:

United States

Published Applications:

1

Last publication date:

2015-01-08

Top Assignees for applications by Yuka Sato

The entities that hold a legal rights for patent applications filed by inventor Sato Yuka:

SENJU METAL INDUSTRY CO., LTD 1 Tokyo, Japan

Recent patent applications by Sato Yuka

Yuka Sato from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-01-08

US20150007958A1

Performing operations; transporting

Solder bump forming method and apparatus

InventorID:

1026289 ⎘