Heny Lin

City:

Irvine, California

Country:

United States

Published Applications:

Last publication date:

2017-10-19

Top Assignees for applications by Heny Lin

The entities that hold a legal rights for patent applications filed by inventor Lin Heny:

INTERNATIONAL RECTIFIER CORPORATION 4 EL SEGUNDO, CA United States
Infineon Technologies Americas Corp. 3 El Segundo, CA United States

Recent patent applications by Lin Heny

Heny Lin from Irvine, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-10-19

US20170301613A1

Electricity

Adaptable molded leadframe package and related method

#2 | 2015-06-11

US20150162326A1

Electricity

Semiconductor package for III-nitride transistor stacked with diode

#3 | 2015-01-08

US20150008445A1

Electricity

III-nitride device and FET in a package

#4 | 2012-09-06

US20120223322A1

Electricity

III-nitride transistor stacked with diode in a package

#5 | 2012-09-06

US20120223321A1

Electricity

III-nitride transistor stacked with FET in a package

#6 | 2007-11-08

US20070257343A1

Electricity

DIE-ON-LEADFRAME (DOL) WITH HIGH VOLTAGE ISOLATION

#7 | 2006-12-28

US20060290689A1

Electricity

Semiconductor half-bridge module with low inductance

#8 | 2006-05-09

US10631879

Non-isolated heatsink(s) for power modules

#9 | 2005-12-22

US20050280998A1

Electricity

Half-bridge power module with insert molded heatsinks

InventorID:

1026897 ⎘