Lucas, Texas
United States
22
2016-04-21
The entities that hold a legal rights for patent applications filed by inventor Gerber Mark A.:
Mark A. Gerber from Lucas, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Packaged semiconductor devices
#2 | 2015-12-24SEMICONDUCTOR DEVICE HAVING NON-CIRCULAR CONNECTORS
#3 | 2015-01-08Method and structure of packaging semiconductor devices
#4 | 2015-01-08METHOD AND STRUCTURE OF PANELIZED PACKAGING OF SEMICONDUCTOR DEVICES
#5 | 2011-07-28Array-molded package-on-package having redistribution lines
#6 | 2011-01-20Method for exposing and cleaning insulating coats from metal contact surfaces
#7 | 2010-08-05Semiconductor flip-chip system having oblong connectors and reduced trace pitches
#8 | 2010-03-25FINE-PITCH OBLONG SOLDER CONNECTIONS FOR STACKING MULTI-CHIP PACKAGES
#9 | 2009-12-31Method for fine-pitch, low stress flip-chip interconnect
#10 | 2009-10-29Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices
#11 | 2009-10-15Packaged system of semiconductor chips having a semiconductor interposer
#12 | 2009-03-26Method for stacking semiconductor chips
#13 | 2008-12-25Semiconductor Package-on-Package System Including Integrated Passive Components
#14 | 2008-12-25Array molded package-on-package having redistribution lines
#15 | 2008-10-09Packed system of semiconductor chips having a semiconductor interposer
#16 | 2007-11-01Semiconductor package-on-package system including integrated passive components
#17 | 2007-10-11Packaged system of semiconductor chips having a semiconductor interposer
#18 | 2007-10-04Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices
#19 | 2007-09-20Low profile semiconductor package-on-package
#20 | 2007-09-13Gold-bumped interposer for vertically integrated semiconductor system
#21 | 2007-08-30Flip-Chip Device Having Underfill in Controlled Gap
#22 | 2007-07-26Low profile semiconductor system having a partial-cavity substrate
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