Marcus E. Interrante

City:

New Paltz, New York

Country:

United States

Published Applications:

Last publication date:

2017-02-23

Top Assignees for applications by Marcus E. Interrante

The entities that hold a legal rights for patent applications filed by inventor Interrante Marcus E.:

INTERNATIONAL BUSINESS MACHINES CORPORATION 5 ARMONK, NY United States
GLOBALFOUNDRIES Inc. 2 Grand Cayman, Cayman Islands

Recent patent applications by Interrante Marcus E.

Marcus E. Interrante from New Paltz, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-02-23

US20170053845A1

Electricity

Reducing directional stress in an orthotropic encapsulation member of an electronic package

#2 | 2016-07-26

US14669775

Electricity

Thermal hot spot cooling for semiconductor devices

#3 | 2015-08-13

US20150228614A1

Electricity

3D bond and assembly process for severely bowed interposer die

#4 | 2015-04-02

US20150093859A1

Electricity

Electronic module assembly with patterned adhesive array

#5 | 2015-01-15

US20150014836A1

Electricity

Electronic module assembly with patterned adhesive array

#6 | 2013-05-21

US13362228

Uniform solder reflow fixture

InventorID:

1033716 ⎘