Radebeul
Germany
5
2020-03-05
The entities that hold a legal rights for patent applications filed by inventor Wieland Marcel:
Marcel Wieland from Radebeul, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Wafer level packaging with integrated antenna structures
#2 | 2015-01-15Semiconductor device with improved metal pillar configuration
#3 | 2008-05-01METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER
#4 | 2006-08-03Efficient method of forming and assembling a microelectronic chip including solder bumps
#5 | 2006-03-30Semiconductor substrate thinning method for manufacturing thinned die
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