Benjamin N. Eldridge

Direct metalized guide plate

Vertical probe array having a tiled membrane space transformer

Probe head with inductance reducing structure

Shielding for vertical probe heads

Floating nest for a test socket

Multipath electrical probe and probe assemblies with signal paths through secondary paths between electrically conductive guide plates

Method of forming a probe substrate by layering probe row structures and probe substrates formed thereby

Non-linear vertical leaf spring

Testing techniques for through-device vias

Wiring substrate with customization layers

Probe card assembly having an actuator for bending the probe substrate

Fuel cell using carbon nanotubes

Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out

Sharpened, oriented contact tip structures

Electrical contactor, especially wafer level contactor, using fluid pressure

Method and apparatus for probe card alignment in a test system

METHODS FOR PLANARIZING A SEMICONDUCTOR CONTACTOR

Apparatus and method of testing singulated dies

Probing apparatus with guarded signal traces

Method to build robust mechanical structures on substrate surfaces

WAFER LEVEL INTERPOSER

Carbon nanotube contact structures

Printing of redistribution traces on electronic component

Microelectronic contact structure

LITHOGRAPHIC CONTACT ELEMENTS

Carbon nanotube columns and methods of making and using carbon nanotube columns as probes

METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY FROM WHICH A WIRE IS PLAYED OUT

Remote test facility with wireless interface to local test facilities

Method and system for designing a probe card

APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY

Probe card assembly and kit, and methods of making same

Microelectronic contact structures

Spring interconnect structures

Test system with wireless communications

Providing an electrically conductive wall structure adjacent a contact structure of an electronic device

Microelectronic spring contact elements

Probe card assembly with an interchangeable probe insert

Method and apparatus for adjusting a multi-substrate probe structure

Integrated circuit assembly

Method to build a wirebond probe card in a many at a time fashion

PROBE ARRAY AND METHOD OF ITS MANUFACTURE

APPARATUS AND METHOD FOR LIMITING OVER TRAVEL IN A PROBE CARD ASSEMBLY

Electronic device testing using a probe tip having multiple contact features

Component assembly and alignment

Electrical contactor, especially wafer level contactor, using fluid pressure

Probe card assembly with carbon nanotube probes having a spring mechanism therein

INTERCONNECT ASSEMBLIES AND METHODS

Shaped spring

Multilayered probe card

Wafer level interposer

Spring interconnect structures

Variable width resilient conductive contact structures

Contact carriers (tiles) for populating larger substrates with spring contacts

Probe card assembly and kit

Wafer level interposer

Resilient contact element and methods of fabrication

High density planar electrical interface

Sharing resources in a system for testing semiconductor devices

Interconnect For Microelectronic Structures With Enhanced Spring Characteristics

CONTACT TIP STRUCTURE FOR MICROELECTRONIC INTERCONNECTION ELEMENTS AND METHODS OF MAKING SAME

Method of making lithographic contact elements

Spring interconnect structures

Method and system for compensating thermally induced motion of probe cards

ATTACHING AND INTERCONNECTING DIES TO A SUBSTRATE

Apparatus for reducing power supply noise in an integrated circuit

Methods for planarizing a semiconductor contactor

Apparatus and method for managing thermally induced motion of a probe card assembly

Method to build robust mechanical structures on substrate surfaces

AC coupled parameteric test probe

Sawing tile corners on probe card substrates

Electrical contactor, especially wafer level contactor, using fluid pressure

Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component

Remote test facility with wireless interface to local facilities

Electronic components with plurality of contoured microelectronic spring contacts

Methods of probing an electronic device

Predictive, adaptive power supply for an integrated circuit under test

Composite wiring structure having a wiring block and an insulating layer with electrical connections to probes

Mechanically reconfigurable vertical tester interface for IC probing

Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out

Wireless test system

Stacked guard structures

Apparatuses and methods for planarizing a semiconductor contactor

Method of assembling and testing an electronics module

Testing an electronic device using test data from a plurality of testers

Composite motion probing

A PROBE ARRAY STRUCTURE AND A METHOD OF MAKING A PROBE ARRAY STRUCTURE

Probing apparatus with guarded signal traces

Method and system for compensating thermally induced motion of probe cards

Semiconductor Fuse Covering

Method of Manufacturing A Probe Card

Probe card assembly with a mechanically decoupled wiring substrate

Apparatus and method for adjusting an orientation of probes

Interconnect assemblies and methods

Method of making an electronics module

Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component

Composite motion probing

Contact carriers (tiles) for populating larger substrates with spring contacts

Electrical contactor, especially wafer level contactor, using fluid pressure

Apparatus and method of testing singulated dies

Electric discharge machining of a probe array