Tz-Jun Kuo

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2022-08-18

Top Assignees for applications by Tz-Jun Kuo

The entities that hold a legal rights for patent applications filed by inventor Kuo Tz-Jun:

Tz-Jun Kuo from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Interconnect structure without barrier layer on bottom surface of via

Method of forming an interconnection

InventorID:

1036868 ⎘