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Inventor profile of:

Perceval COUDRAIN

City:

Grenoble

Country:

France

Published Applications:

17

Last publication date:

2025-06-19

Top Assignees for applications by Perceval COUDRAIN

The entities that hold a legal rights for patent applications filed by inventor COUDRAIN Perceval:

STMICROELECTRONICS SA 11 Montrouge, France
Commissariat A L'Energie Atomique Et Aux Energies Alternatives 7 Paris, France
STMicroelectronics (CROLLES 2) SAS 6 Crolles, France
Commissariat à I'Énergie Atomique et aux Énergies Alternatives 1 Paris, France
COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES 1 Paris, France
Commissariat à l'Énergies Atomique et aux Énergies Alternatives 1 Paris, France
SOCPRA Sciences et Génie s.e.c. 1 Sherbrooke, QC Canada
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT 1 Paris, France
STMICROELECTRONICS (GRENOBLE 2) SAS 1 Grenoble, France
Commissariat A L'Energie Atomique 1 Paris, France

Recent patent applications by COUDRAIN Perceval

Perceval COUDRAIN from Grenoble, FR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-06-19

US20250197269A1

Chemistry; metallurgy

STEAM CHAMBER

#2 | 2024-03-21

US20240097721A1

RADIO FREQUENCY TRANSMISSION FRONT-END MODULE AND ASSOCIATED MANUFACTURING METHOD

#3 | 2022-03-24

US20220093501A1

Chip with bifunctional routing and associated method of manufacturing

#4 | 2022-03-24

US20220093500A1

Integrated structure with bifunctional routing and assembly comprising such a structure

#5 | 2020-05-07

US20200144152A1

Method of manufacturing a cooling circuit on an integrated circuit chip using a sacrificial material

#6 | 2018-05-24

US20180142923A1

Mechanical engineering

Heat-transferring and electrically connecting device and electronic device

#7 | 2018-01-04

US20180005889A1

Method for collective (wafer-scale) fabrication of electronic devices and electronic device

#8 | 2017-10-05

US20170287806A1

Electronic device provided with a thermal dissipation member

#9 | 2016-11-24

US20160343638A1

Process for producing a microfluidic circuit within a three-dimensional integrated structure, and corresponding structure

#10 | 2015-01-29

US20150028488A1

Method for manufacturing a conducting contact on a conducting element

#11 | 2012-03-29

US20120074527A1

Performing operations; transporting

Integrated circuit comprising a device with a vertical mobile element integrated in a support substrate and method for producing the device with a mobile element

#12 | 2012-03-01

US20120052629A1

Process for assembling two parts of a circuit

#13 | 2010-12-09

US20100308411A1

Method for forming an integrated circuit level by sequential tridimensional integration

#14 | 2010-11-25

US20100295631A1

Bulk acoustic wave resonator disposed on a substrate having a buried cavity formed therein providing different substrate thicknesses underneath the resonator

#15 | 2009-10-15

US20090256224A1

Integrated circuit comprising mirrors buried at different depths

#16 | 2009-01-15

US20090014764A1

IMAGE SENSOR WITH AN IMPROVED SENSITIVITY

#17 | 2008-08-28

US20080205027A1

Assembly of two parts of an integrated electronic circuit

InventorID:

1048685 ⎘