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Inventor profile of:

S. Jay Chey

City:

Ossining, New York

Country:

United States

Published Applications:

21

Last publication date:

2013-02-28

Top Assignees for applications by S. Jay Chey

The entities that hold a legal rights for patent applications filed by inventor Chey S. Jay:

INTERNATIONAL BUSINESS MACHINES CORPORATION 18 ARMONK, NY United States
Hitachi Global Storage Technologies Netherlands B.V. 1 Amsterdam, Netherlands
IBM 1 Armonk, NY United States
INTERNATIONAL BUSINESS MACHINES CORP. 1 Armonk, NY United States
Schott Glas 1 Mainz, Germany
SCHOTT AG 1 Mainz, Germany
INTERNATIONAL BUSINESS MACHINES 1 Armonk, NY United States

Recent patent applications by Chey S. Jay

S. Jay Chey from Ossining, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-02-28

US20130047547A1

Methods and apparatus for managing corrosion in buildings

#2 | 2011-08-18

US20110199109A1

Silicon chicklet pedestal

#3 | 2011-08-18

US20110199108A1

Silicon chicklet pedestal

#4 | 2011-02-10

US20110034047A1

Performing operations; transporting

Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging

#5 | 2010-11-04

US20100276277A1

Electrochemical liquid cell apparatus

#6 | 2010-06-24

US20100155456A1

Performing operations; transporting

Method and process for reducing undercooling in a lead-free tin-rich solder alloy

#7 | 2009-10-22

US20090263991A1

Performing operations; transporting

Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging

#8 | 2009-08-27

US20090214780A1

Negative coefficient of thermal expansion particles

#9 | 2009-02-26

US20090051026A1

PROCESS FOR FORMING METAL FILM AND RELEASE LAYER ON POLYMER

#10 | 2008-11-27

US20080290142A1

Performing operations; transporting

Method and process for reducing undercooling in a lead-free tin-rich solder alloy

#11 | 2008-08-26

US10310532

Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging

#12 | 2008-02-28

US20080048305A1

Performing operations; transporting

Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging

#13 | 2008-01-17

US20080014406A1

Performing operations; transporting

Injection molded soldering head for high temperature application and method of making same

#14 | 2007-10-25

US20070246853A1

Performing operations; transporting

Global vacuum injection molded solder system and method

#15 | 2007-08-30

US20070200572A1

Structure for coupling probes of probe device to corresponding electrical contacts on product substrate

#16 | 2006-10-31

US10401565

Assembly for thermal and/or thermally-assisted information processing

#17 | 2005-12-27

US10727925

Attenuated embedded phase shift photomask blanks

#18 | 2005-05-26

US20050114068A1

Thermal measurements of electronic devices during operation

#19 | 2005-05-12

US20050100743A1

Negative coefficient of thermal expansion particles and method of forming the same

#20 | 2005-03-10

US20050053845A1

Chemistry; metallurgy

Attenuating phase shift mask blank and photomask

#21 | 2005-02-22

US10657665

Attenuated embedded phase shift photomask blanks

InventorID:

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