Ranadeep Dutta

PACKAGE COMPRISING INTEGRATED DEVICES AND PASSIVE DEVICES

PACKAGE COMPRISING INTEGRATED DEVICES

PACKAGE COMPRISING AN INTEGRATED DEVICE, AN ENCAPSULATION LAYER AND VIA INTERCONNECTS CONFIGURED FOR SHIELDING

INDUCTIVE DEVICE WITH INTEGRATED INDUCTORS

CONFIGURABLE BONDING PAD ROUTING

DEVICE COMPRISING AN OPTO-ELECTRONIC INTEGRATED DEVICE AND STACKED INTEGRATED DEVICES

IMPURE INDIUM PHOSPHIDE SEMICONDUCTOR SUBSTRATE

INTEGRATED CIRCUIT DEVICE INCLUDING A MULTI-CHIP PACKAGE

INTEGRATED DEVICES WITH MULTIPLE ACOUSTIC RESONATOR CHIPLETS

INTEGRATED CIRCUIT DEVICE INCLUDING IMPEDANCE ADAPTER

INTERPOSER HAVING INTEGRATED OPTICAL WAVEGUIDE

ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD PACKAGE TO SUPPORT EFFICIENT INTEGRATION OF RADIO-FREQUENCY (RF) CIRCUITRY, AND RELATED FABRICATION METHODS

INTEGRATED CIRCUIT DEVICE INCLUDING THERMAL INTERPOSER LAYER

INDUCTOR PERFORMANCE ENHANCEMENT USING AN OUTER, PERIPHERAL PATTERNED GROUND SHIELD

INTEGRATED DEVICES COUPLED TO INTERPOSER COMPRISING POROUS PORTION

INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION

ACOUSTIC DEVICES WITH INTEGRATED CIRCUIT ELEMENTS AND RELATED FABRICATION METHODS

DEVICES INCLUDING THROUGH-SUBSTRATE VIAS (TSVs) FOR BACKSIDE INTERCONNECTION, AND RELATED FABRICATION METHODS

ANTENNA MODULE AS A RADIO-FREQUENCY (RF) INTEGRATED CIRCUIT (IC) DIE WITH AN INTEGRATED ANTENNA SUBSTRATE, AND RELATED FABRICATION METHODS

CAVITY-EMBEDDED TUNABLE FILTER

THROUGH MOLDING CONTACT ENABLED EMI SHIELDING

Reducing Parasitic Capacitance

ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION

THREE-DIMENSIONAL VERTICAL CO-SPIRAL INDUCTORS

CAPACITOR EMBEDDED 3D RESONATOR FOR BROADBAND FILTER

Antenna modules employing three-dimensional (3D) build-up on mold package to support efficient integration of radio-frequency (RF) circuitry, and related fabrication methods

Thermal bridge interposer structure

ESL-less AC resistor for high frequency applications

HIGH DENSITY SILICON BASED CAPACITOR

RADIO-FREQUENCY INTEGRATED CIRCUITS (RFICS) INCLUDING A POROSIFIED SEMICONDUCTOR ISOLATION REGION TO REDUCE NOISE INTERFERENCE AND RELATED FABRICATION METHODS

Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods

3D inductor design using bundle substrate vias

Radio frequency front end (RFFE) hetero-integration

COMPOUND SEMICONDUCTOR AND COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (CMOS) TRANSISTOR INTEGRATION

Stacked inductor having a discrete metal-stack pattern

SURFACE ACOUSTIC WAVE (SAW) DEVICES WITH A DIAMOND BRIDGE ENCLOSED WAVE PROPAGATION CAVITY

SUBSTRATE COMPRISING ACOUSTIC RESONATORS CONFIGURED AS AT LEAST ONE ACOUSTIC FILTER

Three-dimensional (3D) integrated circuit with passive elements formed by hybrid bonding

Metamorphic high electron mobility transistor-heterojunction bipolar transistor integration

Advanced integrated passive device (IPD) with thin-film heat spreader (TF-HS) layer for high power handling filters in transmit (TX) path

Package comprising stacked filters with a shared substrate cap

Heterogeneous integrated wideband high electron mobility transistor power amplifier with a single-crystal acoustic resonator/filter

Integrated device with electromagnetic shield

Resonator device

INTEGRATION OF HETEROGENEOUS TRANSISTORS ON DIAMOND SUBSTRATE BY LAYER TRANSFER

Die-to-wafer hybrid bonding with forming glass

SILICON ON DIAMOND THERMAL AND SHIELDING MITIGATION

Device with 3D inductor and magnetic core in substrate

Self-aligned collector heterojunction bipolar transistor (HBT)

Device on ceramic substrate

Stacked circuits of III-V devices over silicon with high quality integrated passives with hybrid bonding

Self-aligned high voltage transistor

INTEGRATION OF HETEROGENEOUS TRANSISTORS ON DIAMOND SUBSTRATE

Monolithic self-aligned heterojunction bipolar transistor (HBT) and complementary metal-oxide-semiconductor (CMOS)

Electrostatic discharge (ESD) robust transistor

MONOLITHIC INTEGRATION OF GAN HEMT AND SI CMOS

Transistor with lightly doped drain (LDD) compensation implant

Integrated semiconductor devices and method of fabricating the same

MESH STRUCTURE FOR HETEROJUNCTION BIPOLAR TRANSISTORS FOR RF APPLICATIONS

Cascode radio frequency (RF) power amplifier on single diffusion

CMOS and bipolar device integration including a tunable capacitor

METHODS AND APPARATUSES FOR FORMING MULTIPLE RADIO FREQUENCY (RF) COMPONENTS ASSOCIATED WITH DIFFERENT RF BANDS ON A CHIP

High voltage MOS transistor

Methods and apparatuses for forming multiple radio frequency (RF) components associated with different RF bands on a chip