Haruo SUDO

City:

Niigata

Country:

Japan

Published Applications:

Last publication date:

2026-01-15

Top Assignees for applications by Haruo SUDO

The entities that hold a legal rights for patent applications filed by inventor SUDO Haruo:

GLOBALWAFERS JAPAN CO., LTD. 5 Niigata, Japan
Covalent Materials Corporation 2 Shinagawa-ku, Tokyo, Japan
Global Wafers Japan Co., Ltd. 1 Nigata, Japan
TOHOKU UNIVERSITY 1 Miyagi, Japan
Global Wafers Japan Co., Ltd. 1 Niigata, Japan
Covalent Materials Corporation 1 Shingawa-ku, TOKYO, Japan
GlobalWafers Japan Co., Ltd. 1 Kitakanbara-gun, Niigata, Japan
Covalent Materials Corporation 1 Tokyo, Japan

Recent patent applications by SUDO Haruo

Haruo SUDO from Niigata, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-01-15

US20260014594A1

Performing operations; transporting

CLEANING METHOD OF SUSCEPTOR

#2 | 2023-08-03

US20230243062A1

Chemistry; metallurgy

SILICON WAFER AND METHOD FOR PRODUCING SILICON WAFER

#3 | 2021-02-25

US20210055232A1

Physics

Evaluation method of silicon wafer

#4 | 2020-06-11

US20200181802A1

Chemistry; metallurgy

Thermal processing method for silicon wafer

#5 | 2019-04-25

US20190119828A1

Chemistry; metallurgy

Silicon wafer

#6 | 2015-02-12

US20150044422A1

Electricity

Silicon wafer and method for manufacturing the same

#7 | 2012-07-19

US20120184091A1

Electricity

Method for heat treating a silicon wafer

#8 | 2012-06-07

US20120139088A1

Electricity

Silicon wafer and method for heat-treating silicon wafer

#9 | 2010-08-05

US20100197146A1

Chemistry; metallurgy

Method of heat treating silicon wafer

#10 | 2010-02-18

US20100038757A1

Electricity

Method of manufacturing single crystal silicon wafer from ingot grown by Czocharlski process with rapid heating/cooling process

InventorID:

1065782 ⎘