Daisuke Tsukahara

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2016-02-04

Top Assignees for applications by Daisuke Tsukahara

The entities that hold a legal rights for patent applications filed by inventor Tsukahara Daisuke:

Daisuke Tsukahara from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

ADHERING DEVICE AND METHOD FOR PRODUCING ELECTRONIC DEVICE

Element connecting board, producing method thereof, and light emitting diode device

ENCAPSULATING SHEET CONTAINER

Element-connecting board, producing method thereof, and light-emitting diode device

Method for producing light emitting diode device

Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

InventorID:

106616 ⎘