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Inventor profile of:

Kenji Oya

City:

Tokyo

Country:

Japan

Published Applications:

6

Last publication date:

2026-04-23

Top Assignees for applications by Kenji Oya

The entities that hold a legal rights for patent applications filed by inventor Oya Kenji:

  • HITACHI, LTD. 1 Tokyo, Japan

Recent patent applications by Oya Kenji

Kenji Oya from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-04-23
US20260111834A1
Physics

DELIVERY DATE ANSWERING SUPPORT METHOD AND DELIVERY DATE ANSWERING SUPPORT SYSTEM

#2 | 2025-01-16
US20250021902A1
Physics

RETRIEVAL METHOD AND RETRIEVAL DEVICE

#3 | 2024-06-27
US20240211979A1
Physics

Delivery date answering apparatus and delivery date answering method

#4 | 2023-11-02
US20230351325A1
Physics

PARTS PROCUREMENT SUPPORT DEVICE, PARTS PROCUREMENT SUPPORT SYSTEM, AND PARTS PROCUREMENT SUPPORT METHOD

#5 | 2023-06-29
US20230206176A1
Physics

DEMAND AND SUPPLY PLANNING APPARATUS AND DEMAND AND SUPPLY PLANNING METHOD

#6 | 2015-02-19
US20150047466A1
Chemistry; metallurgy

METHOD OF ADJUSTING PRECURSOR POWDER FOR SINTERED ORE, AND PRECURSOR POWDER FOR SINTERED ORE

InventorID:

1069400 ⎘

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