Gilbert, Arizona
United States
36
2024-06-27
The entities that hold a legal rights for patent applications filed by inventor Molla Jaynal A.:
Jaynal A. Molla from Gilbert, US has applied for patents for these inventions. The list has both pending applications and granted patents:
LOW-STRESS THERMAL INTERFACE
#2 | 2023-04-13Die-substrate assemblies having sinter-bonded backside via structures and associated fabrication methods
#3 | 2021-06-03Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods
#4 | 2021-01-21Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods
#5 | 2020-10-22Thick-silver layer interface
#6 | 2020-10-22Packaged dies with metal outer layers extending from die back sides toward die front sides
#7 | 2019-07-04Microelectronic components having integrated heat dissipation posts and systems including the same
#8 | 2019-05-16Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof
#9 | 2019-04-23Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof
#10 | 2019-04-11Molded air cavity packages and methods for the production thereof
#11 | 2019-03-28Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof
#12 | 2019-02-14Molded air cavity packages and methods for the production thereof
#13 | 2019-02-07Molded air cavity packages and methods for the production thereof
#14 | 2019-02-07Molded air cavity packages and methods for the production thereof
#15 | 2019-01-10Method of wafer dicing for wafers with backside metallization and packaged dies
#16 | 2018-11-27Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof
#17 | 2018-04-10Semiconductor devices with protruding conductive vias and methods of making such devices
#18 | 2018-03-22Air cavity packages and methods for the production thereof
#19 | 2018-01-11Semiconductor device package and methods of manufacture thereof
#20 | 2017-09-14Thick-silver layer interface
#21 | 2016-12-15Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices
#22 | 2016-05-05Thick-silver layer interface for a semiconductor die and corresponding thermal layer
#23 | 2016-04-07Electronic devices with semiconductor die coupled to a thermally conductive substrate
#24 | 2015-11-19Semiconductor device with mechanical lock features between a semiconductor die and a substrate
#25 | 2015-05-28Packaged semiconductor devices and methods of their fabrication
#26 | 2015-02-26Solder wettable flanges and devices and systems incorporating solder wettable flanges
#27 | 2008-10-30Magnetoresistive device and method of packaging same
#28 | 2008-05-22Methods and apparatus for a dual-metal magnetic shield structure
#29 | 2005-12-01Method of applying cladding material on conductive lines of MRAM devices
#30 | 2005-09-22Method for fabricating a flux concentrating system for use in a magnetoelectronics device
#31 | 2005-08-30Magnetic shielding for electronic circuits which include magnetic materials
#32 | 2005-08-09Method of applying cladding material on conductive lines of MRAM devices
#33 | 2005-07-28Method for fabricating a flux concentrating system for use in a magnetoelectronics device
#34 | 2005-07-21Cladded conductor for use in a magnetoelectronics device and method for fabricating the same
#35 | 2005-05-05Compositions and methods for the electroless deposition of NiFe on a work piece
#36 | 2005-04-26Cladded conductor for use in a magnetoelectronics device and method for fabricating the same
1077863 ⎘